Abstract: A light emitting module includes a light emitting diode chip mounted on a first surface of a support substrate, a wavelength conversion member formed on a light emitting surface of the light emitting diode chip, and a reflection member formed to surround a side surface of the wavelength conversion member, an electrode pad formed on a second surface of the support substrate to be electrically connected with the light emitting diode chip, a circuit board formed with a circuit pattern which is electrically connected with the electrode pad, and a conductive bonding material formed between the electrode pad and the circuit pattern to electrically connect the electrode pad and the circuit pattern. Coefficients of thermal expansion of the support substrate, the electrode pad and the conductive bonding material are different, and a coefficient of thermal expansion gradually increases from the support substrate to the circuit board.

Abstract: A light emitting device may include a substrate having a circuit pattern and at least one light emitting diode (LED) chip. The LED chip may include electrode pads provided on one surface thereof disposed on the circuit pattern to be electrically connected to the circuit pattern. The electrode pads may be rotationally symmetrical with respect to the center of the surface of the LED chip and the circuit pattern may have at least one wiring cell defining a mounting area in which the LED chip is mounted. The shape of the wiring cell may correspond to that of the LED chip.

Abstract: A light emitting diode (LED) package includes: an array substrate; a plurality of LEDs mounted on the array substrate and arranged in rows and columns; a plurality of wavelength conversion units disposed in a light path of light emitted from each of the plurality of LEDs to convert the wavelength thereof; a plurality of first inspection terminals formed on the array substrate and electrically connected to LEDs in the same rows, among the plurality of LEDs; and a plurality of second inspection terminals formed on the array substrate and electrically connected to LEDs in the same columns, among the plurality of LEDs.

Abstract: A light emitting device package includes: a substrate with a mounting surface; a light emitting device bonded to the mounting surface of the substrate; a light reflecting resin part containing a high reflective material, filled on the substrate around the light emitting device so as to extend in a space between the light emitting device and the substrate; and a packing resin part hermetically sealed to cover the light emitting device and the light reflection resin part.

Abstract: A light emitting diode (LED) package includes: an array substrate; a plurality of LEDs mounted on the array substrate and arranged in rows and columns; a plurality of wavelength conversion units disposed in a light path of light emitted from each of the plurality of LEDs to convert the wavelength thereof; a plurality of first inspection terminals formed on the array substrate and electrically connected to LEDs in the same rows, among the plurality of LEDs; and a plurality of second inspection terminals formed on the array substrate and electrically connected to LEDs in the same columns, among the plurality of LEDs.

Abstract: A light emitting device package includes: a substrate with a mounting surface; a light emitting device bonded to the mounting surface of the substrate; a light reflecting resin part containing a high reflective material, filled on the substrate around the light emitting device so as to extend in a space between the light emitting device and the substrate; and a packing resin part hermetically sealed to cover the light emitting device and the light reflection resin part.

Abstract: A packaging structure and a related fabrication method for high-power LED chip are provided herein, which mainly contains a base made of a metallic material and an electrically insulating material integrated into a single object. The metallic material forms a heat sinking seat in the middle of the base, which is exposed from the top surface of the base, and from the bottom surface or a side surface of the base. The metallic material also forms a plurality of electrodes surrounding the heat sinking seat, which are exposed from the top surface of the base, and from the bottom surface or a side surface of the base, respectively. The electrically insulating material is interposed between the electrodes and the heat sinking seat so that they are adhere together, and so that the heat sinking seat and any one of the electrodes, and any two electrodes are electrically insulated.

Abstract: A packaging structure and a related fabrication method for high-power LED chip are provided herein, which mainly contains a base made of a metallic material and an electrically insulating material integrated into a single object. The metallic material forms a heat sinking seat in the middle of the base, which is exposed from the top surface of the base, and from the bottom surface or a side surface of the base. The metallic material also forms a plurality of electrodes surrounding the heat sinking seat, which are exposed from the top surface of the base, and from the bottom surface or a side surface of the base, respectively. The electrically insulating material is interposed between the electrodes and the heat sinking seat so that they are adhere together, and so that the heat sinking seat and any one of the electrodes, and any two electrodes are electrically insulated.

Abstract: A flat panel display lighting system 20 includes: semiconductor light-emitting device 10; board 21; and light guide plate 22. The device 10 includes an inverted T-shaped substrate 1 having a base portion 1a, on which a pair of electrodes 2 and 3 are formed, and a mounting portion 1b, on which a light emitter 4 is mounted. The device 10 is mounted through the board 21 with the mounting portion 1b set through an opening 21a formed in the board 21. A light guide plate 22 is mounted on the board 21 so that a face of the plate 22 faces the light emitter 4. Each of the pair of electrodes 2 and 3 is formed on the substrate 1 of the device 10 so as to be electrically connected to the light emitter 4 and to a circuit pattern formed on the board 21.

Abstract: A flat panel display lighting system 20 includes: semiconductor light-emitting device 10; board 21; and light guide plate 22. The device 10 includes an inverted T-shaped substrate 1 having a base portion 1a, on which a pair of electrodes 2 and 3 are formed, and a mounting portion 1b, on which a light emitter 4 is mounted. The device 10 is mounted through the board 21 with the mounting portion 1b set through an opening 21a formed in the board 21. A light guide plate 22 is mounted on the board 21 so that a face of the plate 22 faces the light emitter 4. Each of the pair of electrodes 2 and 3 is formed on the substrate 1 of the device 10 so as to be electrically connected to the light emitter 4 and to a circuit pattern formed on the board 21.

Abstract: A semiconductor memory is provided in which a column decoder is used commonly for the random input and output and the serial input/output by providing both a signal path for transmitting signals in parallel to the data lines of a memory array and a latch circuit and a switch path for connecting said latch circuit and a serial input/output common data line in response to a selection signal generated by a shift register, and by feeding the output signal of a random input/output column decoder as an initial value to the individual bits of said shift register.