Abstract: An apparatus for dispensing fluid during semiconductor substrate processing operations comprises an enclosure having a first side and a second side. The enclosure comprises a first processing station and a second processing station. The second processing station is positioned adjacent to the first processing station. In addition, the substrate processing apparatus includes a first dispense arm configured to deliver a fluid to the first processing station wherein the first dispense arm is positioned between the first side and the first processing station and a second dispense arm configured to deliver the fluid to the second processing station wherein the second dispense arm is positioned between the second side and the second processing station. The substrate processing apparatus also comprises a first rinse arm configured to deliver a rinsing fluid to the first processing station and a second rinse arm configured to deliver the rinsing fluid to the second processing station.

Abstract: In a substrate processing apparatus, an indexer block, a resist film processing block, a cleaning/drying processing block, a development processing block, and an interface block are provided side by side in this order. An exposure device is arranged adjacent to the interface block. The exposure device subjects a substrate to exposure processing by means of a liquid immersion method. Substrate platforms are provided in close proximity one above the other between the cleaning/drying processing block and the development processing block for receiving and transferring the substrate therebetween. Reversing units that reverse one surface and the other surface of the substrate are respectively stacked above and below the substrate platforms.

Abstract: A substrate processing apparatus includes a development part for performing a development process on a substrate after being subjected to exposure and a cleaning part. When the processing time in the development part is shorter than the reference time determined in advance, the development part performs all the process steps for development. On the other hand, when the processing time in the development part is longer than the reference time, the development process is split into a first half process step and a second half process step, and the development part performs a processing including the first half process step and the cleaning part performs a processing including the second half process step. Even if the development process takes a long time, it is possible to prevent deterioration in processing capability of the substrate processing apparatus on the whole by splitting the development process.

Abstract: A substrate processing apparatus is arranged adjacent to an exposure device and includes a processing section, a transfer section configured to carry the substrate into and out of the processing section, and an interface configured to receive and transfer the substrate between the processing section and the exposure device. The processing section includes a first processing unit having a photosensitive film formation region, a thermal processing region having a first thermal processing unit, and a first transport region having a first transport unit. The photosensitive film formation region is arranged opposite the thermal processing region with the first transport region interposed therebetween. The processing section also includes a second processing unit having a first development region, a second development region, and a second transport region having a second transport unit.

Abstract: In a substrate processing apparatus, an indexer block, a resist film processing block, a cleaning/drying processing block, a development processing block, and an interface block are provided side by side in this order. An exposure device is arranged adjacent to the interface block. The exposure device subjects a substrate to exposure processing by means of a liquid immersion method. Substrate platforms are provided in close proximity one above the other between the cleaning/drying processing block and the development processing block for receiving and transferring the substrate therebetween. Reversing units that reverse one surface and the other surface of the substrate are respectively stacked above and below the substrate platforms.

Abstract: A substrate processing apparatus that is arranged adjacent to an exposure device includes a processing section including a first processing unit and a second processing unit. The first processing unit includes a development region, a first cleaning region, and a first transport region. The development region and the first cleaning region are arranged opposite to each other with the first transport region interposed therebetween. The second processing unit includes a reversing region, a second cleaning region, and a second transport region. The reversing region and the second cleaning region are arranged opposite to each other with the second transport region interposed therebetween. The second processing unit is arranged between the first processing unit and the exposure device. The substrate processing apparatus also includes a transfer section coupled to the processing section and an interface configured to receive and transfer the substrate between the processing section and the exposure device.

Abstract: A moving image representing a maintenance method is reflected on a moving image display section in an operation panel. A worker can grasp the maintenance method by seeing the moving image displayed on the moving image display section. Consequently, maintenance can be performed in a short time and accurately in accordance with the moving image displayed on the moving image display section.

Abstract: A substrate processing apparatus includes a transport robot (TR1) formed with a telescopic vertical movement mechanism of a so-called telescopially nestable multi-tier construction. A drive mechanism (D1) is initially driven to move a support member (48) upwardly to simultaneously elevate a vertical movement member (42d). As the vertical movement member (42d) rises, a pulley (47c) simultaneously moves upwardly. As the pulley (47c) moves upwardly, a vertical movement member (42c) is lifted upwardly by a belt (L1). Similar actions elevate a pair of transport arms (31a, 31b) provided on the top of a vertical movement member (42a). The increase in the number of tiers of the nestable multi-tier structure precludes the increase in height of the transport robot (TR1) in its retracted position.

Abstract: An inspection unit is provided in a substrate processing apparatus performing resist coating processing and development processing on a substrate. In the inspection unit, a film thickness measuring device, a line width measuring device, an overlay measuring device and a macro defect inspection device are successively stacked and arranged from below. The inspection unit is provided on an intermediate portion of a substrate transport path formed in the substrate processing apparatus. The substrate processed in the substrate processing apparatus is selectively introduced into each inspection part. Therefore, the apparatus can properly inspect the substrate at need while suppressing reduction of the throughput. Thus provided are a substrate processing apparatus and a substrate inspection method capable of properly inspecting a substrate while suppressing reduction of the throughput.

Abstract: Substrate processing parts are stacked and arranged in a multistage manner around a transport robot arranged at the center of a processing area. Rotary application units are arranged on a second layer through an indexer and the transport robot. Rotary developing units are stacked above the rotary application units respectively on a fourth layer located above the second layer. Multistage thermal processing units and an edge exposure unit are horizontally arranged in line above the indexer. In place of the processing units, inspection units performing a macro defect inspection and pattern line width measurement may be arranged in the upside region of the indexer space.

Abstract: Provided is a robot comprising a telescopic-drive mechanism which does not contaminate works in a purified environment such as a clean room, is easy to handle, and requires no cover for covering the telescopic-drive mechanism. A robot comprises: an up-down axis in which a plurality of hollow axis sectional elements telescopically continue; and a telescopic-drive mechanism for driving the up-down axis to be vertically extended or retracted between an extended state in which a tip end of the up-down axis extends with respect to a base end thereof and a retracted state in which the tip end is moved close to the base end, wherein the telescopic-drive mechanism is integrated on one side of the up-down axis without being exposed from the up-down axis.

Abstract: A cleaning processing part and an ashing processing part are oppositely arranged flush with each other through a transport path where a transport robot is arranged. The cleaning processing part comprises a surface scrubber and a rear scrubber. The ashing processing part performs ashing with plasma. The transport robot transports a substrate to be processed from an indexer successively through the ashing processing part, a reversal part and the cleaning processing part and returns the same to the indexer again. The transport robot immediately transports the substrate completely subjected to ashing toward the cleaning processing part, whereby the time required from ashing to cleaning processing is so reduced that a dead time can be eliminated while cleaning performance can be improved by performing cleaning processing immediately after ashing. Thus, a substrate processing apparatus improving cleaning performance by reducing a dead time up to cleaning processing is provided.

Abstract: An inspection unit is provided in a substrate processing apparatus performing resist coating processing and development processing on a substrate. In the inspection unit, a film thickness measuring device, a line width measuring device, an overlay measuring device and a macro defect inspection device are successively stacked and arranged from below. The inspection unit is provided on an intermediate portion of a substrate transport path formed in the substrate processing apparatus. The substrate processed in the substrate processing apparatus is selectively introduced into each inspection part. Therefore, the apparatus can properly inspect the substrate at need while suppressing reduction of the throughput. Thus provided are a substrate processing apparatus and a substrate inspection method capable of properly inspecting a substrate while suppressing reduction of the throughput.

Abstract: A substrate processing apparatus includes a transport robot (TR1) formed with a telescopic vertical movement mechanism of a so-called telescopially nestable multi-tier construction. A drive mechanism (D1) is initially driven to move a support member (48) upwardly to simultaneously elevate a vertical movement member (42d). As the vertical movement member (42d) rises, a pulley (47c) simultaneously moves upwardly. As the pulley (47c) moves upwardly, a vertical movement member (42c) is lifted upwardly by a belt (L1). Similar actions elevate a pair of transport arms (31a, 31b) provided on the top of a vertical movement member (42a). The increase in the number of tiers of the nestable multi-tier structure precludes the increase in height of the transport robot (TR1) in its retracted position.

Abstract: Substrate processing parts are stacked and arranged in a multistage manner around a transport robot arranged at the center of a processing area. Rotary application units are arranged on a second layer through an indexer and the transport robot. Rotary developing units are stacked above the rotary application units respectively on a fourth layer located above the second layer. Multistage thermal processing units and an edge exposure unit are horizontally arranged in line above the indexer. In place of the processing units, inspection units performing a macro defect inspection and pattern line width measurement may be arranged in the upside region of the indexer space.

Abstract: A substrate processing apparatus includes a transport robot (TR1) formed with a telescopic vertical movement mechanism of a so-called telescopically nestable multi-tier construction. A drive mechanism (D1) is initially driven to move a support member (48) upwardly to simultaneously elevate a vertical movement member (42d). As the vertical movement member (42d) rises, a pulley (47c) simultaneously moves upwardly. As the pulley (47c) moves upwardly, a vertical movement member (42c) is lifted upwardly by a belt (L1). Similar actions elevate a pair of transport arms (31a, 31b) provided on the top of a vertical movement member (42a). The increase in the number of tiers of the nestable multi-tier structure precludes the increase in height of the transport robot (TR1) in its retracted position.

Abstract: Provided is a robot comprising a telescopic-drive mechanism which does not contaminate works in a purified environment such as a clean room, is easy to handle, and requires no cover for covering the telescopic-drive mechanism. A robot comprises: an up-down axis in which a plurality of hollow axis sectional elements telescopically continue; and a telescopic-drive mechanism for driving the up-down axis to be vertically extended or retracted between an extended state in which a tip end of the up-down axis extends with respect to a base end thereof and a retracted state in which the tip end is moved close to the base end, wherein the telescopic-drive mechanism is integrated on one side of the up-down axis without being exposed from the up-down axis.

Abstract: A plurality of cleaning devices of the same type are attached to one support arm. The cleaning devices are simultaneously moved over a surface to be cleaned of a substrate supported and spun by a substrate supporting and spinning mechanism. Thus, the same type of cleaning devices share the task of cleaning the entire surface of the substrate, thereby to improve cleaning efficiency and shorten cleaning time. Different types of cleaning devices may be attached to the support arm for simultaneous cleaning of the entire surface of the substrate. Where different types of cleaning brushes are attached to the support arm, a cleaning operation may be carried out by simultaneously using cleaning brushes of optimal hardness for different regions on the substrate surface.

Abstract: A substrate cleaning apparatus includes a spin support for supporting and spinning a substrate, a nozzle for discharging a cleaning liquid with a given cleaning condition from a discharge opening, a moving mechanism for moving the nozzle at least between center and edge of the substrate, a cleaning condition adjuster for adjusting the cleaning condition, and a controller for controlling the cleaning condition adjuster to vary the cleaning condition according to a cleaning liquid supply position movable over the substrate surface.

Abstract: A substrate treating apparatus for treating a substrate in a predetermined substrate treating region. Each holder arm is supported in a proximal end portion thereof by an arm support to be swingable about a pivotal axis. In time of substrate treatment, the arm support is raised by an air cylinder. With the ascent of the arm support, a cam follower attached to a proximal end of the holder arm is guided by a cam groove. The holder arm, while being raised, turns from a vertical standby posture to a horizontal posture for treating the substrate. As a result, a treating device attached to a distal end of the holder arm moves to a treating position. In the treating position, the treating device treats the substrate. The holder arms are maintained in the vertical standby posture when out of use in substrate treatment. Thus, the holder arms require a reduced standby space.