Abstract: An apparatus for dispensing fluid during semiconductor substrate processing operations comprises an enclosure having a first side and a second side. The enclosure comprises a first processing station and a second processing station. The second processing station is positioned adjacent to the first processing station. In addition, the substrate processing apparatus includes a first dispense arm configured to deliver a fluid to the first processing station wherein the first dispense arm is positioned between the first side and the first processing station and a second dispense arm configured to deliver the fluid to the second processing station wherein the second dispense arm is positioned between the second side and the second processing station. The substrate processing apparatus also comprises a first rinse arm configured to deliver a rinsing fluid to the first processing station and a second rinse arm configured to deliver the rinsing fluid to the second processing station.

Abstract: A camera is fixed to a camera fixture extending forward and upward from a rear end of an arm mechanism. The camera picks up the direction of extension of the arm mechanism when the substrate is carried in and out. If a normal still image in a hot plate unit previously recorded and a still image picked up by the camera coincide with each other, a substrate transport robot TR carries in and out the substrate.

Abstract: A camera is fixed to a camera fixture extending forward and upward from a rear end of an arm mechanism. The camera picks up the direction of extension of the arm mechanism when the substrate is carried in and out. If a normal still image in a hot plate unit previously recorded and a still image picked up by the camera coincide with each other, a substrate transport robot TR carries in and out the substrate.

Abstract: A wafer transferring device for transferring a wafer to be treated from a wafer supply station of a wafer treating apparatus to a wafer holding member, where the wafer is treated, and from the holding member to a wafer discharge station. The device includes a transfer unit for separately supporting untreated and treated wafers at different heights relative to one another. A carrier unit moves horizontally and reciprocates between the supply and discharge stations and toward and away from the holding member integrally with the transfer unit and is adapted to move up and down the transfer unit.

Abstract: Two transfer routes for exposed films are provided in a film processor, in one of the two ordinary films which require treatments of developing, stopping, fixing and washing with being transferred, and in the other route wash-off films which require only a treatment of the washing with being transferred. The ordinary films are transferred through the former route with being treated several processes, and the other hand, the wash-off films are directly transferred into a washing tray through the latter route, skipping over treatments of developing, stopping and fixing.The by-pass mechanism for wash-off films can be swinged around a shaft, by which the maintenance for the film processor becomes easier. Processing for different kinds of films can be performed, depending on the kind of films to be processed, with a film processor.

Abstract: A device responsive to an unusual temperature change in a refrigerant compressor using an electromagnetic clutch including a magnet coil as an actuating element of the clutch, comprising an overcurrent-responsive element such as a fuse connected in parallel with the magnet coil, a temperature-responsive switch operative to be open when the temperature in the compressor rises beyond a predetermined value, and a switching element such as a transistor which is non-conductive when the temperature-responsive switch is closed and which is made conductive to cause the fuse to melt when the temperature-responsive switch is made to open.