Abstract: An electrical equipment is supplied with electric power from one of an electric power supply system and a secondary battery. The electrical equipment includes a switch circuit and a module. The switching circuit switches a power supply source for supplying electric power to the electrical equipment between the electric power supply system and the secondary battery. The module includes a processor to execute a program to perform a controlling process including a process of controlling the switch circuit to selectively connect the electrical equipment to one of the electric power supply system and the secondary battery according to a control signal supplied from an external device.

Abstract: A power supply device is connected to an external power supply and supplies electric power to a load. The power supply device includes a battery terminal that is used to connect a secondary battery, a superposition unit that superposes second electric power output from the secondary battery on first electric power supplied from the external power supply, and that outputs resultant electric power to the load; a power consumption amount retrieve unit that retrieves a power consumption amount of the load; and a controller that controls an amount of the second electric power to be output from the secondary battery, based on the power consumption amount.

Abstract: A semiconductor device having a chip size package is disclosed. The chip size package comprises a semiconductor chip having at least a bonding pad, at least a terminal of said chip size package and a reroute trace formed between the bonding pad and the terminal on said chip size package. The reroute trace is formed to have a desired resistance.

Abstract: A semiconductor device having a chip size package is disclosed. The chip size package comprises a semiconductor chip having at least a bonding pad, at least a terminal of said chip size package and a reroute trace formed between the bonding pad and the terminal on said chip size package. The reroute trace is formed to have a desired resistance.

Abstract: A semiconductor device having a chip size package is disclosed. The chip size package comprises a semiconductor chip having at least a bonding pad, at least a terminal of said chip size package and a reroute trace formed between the bonding pad and the terminal on said chip size package. The reroute trace is formed to have a desired resistance.

Abstract: A semiconductor device having a chip size package is disclosed. The chip size package comprises a semiconductor chip having at least a bonding pad, at least a terminal of said chip size package and a reroute trace formed between the bonding pad and the terminal on said chip size package. The reroute trace is formed to have a desired resistance.

Abstract: A semiconductor device production method of the invention includes a step of packaging a semiconductor chip with a transparent material (14) which penetrates a laser beam (13) within a predetermined range of wavelength having sufficient energy to cut part of an adjustable circuit (12), and a step of trimming part of the adjustable circuit (12) to obtain a target value of electric properties for the adjustable circuit by focusing, after the packaging step, the laser beam (13) onto the adjustable circuit from an upper surface of the semiconductor chip through the transparent material.

Abstract: A power supply voltage detecting circuit includes: a depletion MOS transistor having its source and gate connected to the base thereof; and an enhancement MOS transistor which is serially connected to the depletion MOS transistor, which has its source connected to its base, and which is fed an output of the voltage divider through its gate. Therefore, the production yield can be greatly improved, and the production costs can be greatly reduced.

Abstract: A hysteresis comparator circuit and a waveform generating circuit reduce a power consumption of a DC/DC converter so as to improve a power consumption efficiency when the DC/DC converter is operated with a relatively small load. The hysteresis comparator circuit is connected to a reference voltage source providing a reference voltage. A hysteresis comparator compares an input voltage with one of a first threshold voltage and a second threshold voltage. A hysteresis voltage generating circuit selectively generates one of the first and second threshold voltages by controlling a state of electric charge stored in each of the capacitors. An electric charge stored in the capacitors is provided from the reference voltage source.