Abstract: Provided is a prober capable of suppressing the increase in installation area and the increase in device cost, and also improving the throughput, while maintaining the accuracy of the moving position of an alignment device shared by each of measuring units. The prober includes: a plurality of measuring units, each of which has a probe card electrically connected to a test head; a wafer chuck that holds a wafer in which a plurality of chips are formed; an alignment device which performs relative alignment between the probe card and the wafer held by the wafer chuck; a moving device which moves the alignment device among the measuring units; and a positioning and fixing device which is provided for every of the measuring units, and positions and fixes the alignment device which is moved to each of the measuring units.

Abstract: Provided is a prober capable of suppressing the increase in installation area and the increase in device cost, and also improving the throughput, while maintaining the accuracy of the moving position of an alignment device shared by each of measuring units. The prober includes: a plurality of measuring units, each of which has a probe card electrically connected to a test head; a wafer chuck that holds a wafer in which a plurality of chips are formed; an alignment device which performs relative alignment between the probe card and the wafer held by the wafer chuck; a moving device which moves the alignment device among the measuring units; and a positioning and fixing device which is provided for every of the measuring units, and positions and fixes the alignment device which is moved to each of the measuring units.

Abstract: In the dicing machine, a parallel adjustment process between a cut-line of a blade and cut-line images displayed on a monitor can be easily performed. In the dicing machine, at least one of the first and second cut-line images displayed on the monitor is electronically moved by an image moving device so as to arrange the first and second cut-line images in the same straight line on the monitor. Thus, in the dicing machine of the present invention, the parallel adjustment can be easily performed as compared with the conventional dicing machine in which the parallel adjustment is mechanically performed by moving an imaging device.

Abstract: In the dicing machine, a parallel adjustment process between a cut-line of a blade and cut-line images displayed on a monitor can be easily performed. In the dicing machine, at least one of the first and second cut-line images displayed on the monitor is electronically moved by an image moving device so as to arrange the first and second cut-line images in the same straight line on the monitor. Thus, in the dicing machine of the present invention, the parallel adjustment can be easily performed as compared with the conventional dicing machine in which the parallel adjustment is mechanically performed by moving an imaging device.