Patents by Inventor Masami Yanagida

Masami Yanagida has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10230112
    Abstract: A conductive film includes a layer 1 formed by a conductive material 1 that includes a polymer material 1 containing any of (1) an amine and an epoxy resin (where the epoxy resin and the amine are mixed in a ratio of 1.0 or more in terms of the ratio of the number of active hydrogen atoms in the amine with respect to the number of functional groups in the epoxy resin), (2) a phenoxy resin and an epoxy resin, (3) a saturated hydrocarbon polymer having a hydroxyl group, and (4) a curable resin and an elastomer and conductive particles 1. The conductive film has excellent stability in an equilibrium potential environment in a negative electrode and low electric resistance per unit area in the thickness direction. A multilayer conductive film including the conductive film achieves excellent interlayer adhesion, and using them as a current collector enables the production of a battery satisfying both weight reduction and durability.
    Type: Grant
    Filed: May 22, 2012
    Date of Patent: March 12, 2019
    Assignee: NISSAN MOTOR CO., LTD.
    Inventors: Yusuke Kato, Takashi Ito, Masami Yanagida, Satoshi Oku, Hiroyuki Ogino, Masato Kusakabe, Ryutaro Mukai, Masahiro Kojima, Takashi Kikuchi, Akiko Waki, Shiho Inoue, Shigeo Ibuka, Yasuyuki Tanaka, Yoshio Shimoida, Yuji Muroya, Norihisa Waki
  • Patent number: 9537152
    Abstract: A collector for bipolar lithium ion secondary batteries comprises a first conductive layer that is obtained by adding a conductive filler to a base that contains an imide group-containing resin, and a second conductive layer that has a function of blocking lithium ions. The second conductive layer comprises a blocking resin layer that is obtained by adding a conductive filler to a base that contains a resin which contains no imide group, and a metal layer. This collector for bipolar lithium ion secondary batteries is used in such a manner that the first conductive layer is on the positive electrode active material layer side with respect to the second conductive layer.
    Type: Grant
    Filed: July 18, 2012
    Date of Patent: January 3, 2017
    Assignees: Nissan Motor Co., Ltd., Kaneka Corporation
    Inventors: Yasuyuki Tanaka, Masami Yanagida, Kohei Ogawa, Satoshi Oku, Masahiro Kojima, Takashi Kikuchi, Takashi Ito
  • Publication number: 20150303483
    Abstract: A collector for bipolar lithium ion secondary batteries including an electroconductive polyimide layer including a conductivity-imparting agent dispersed in a polyimide resin that is prepared by imidizing a polyamic acid that is obtained by reacting at least one tetracarboxylic dianhydride component of biphenyltetracarboxylic dianhydrides, 3,3?,4,4?-benzophenonetetracarboxylic dianhydride, pyromellitic dianhydride, and [isopropylidenebis(p-phenyleneoxy)]diphthalic dianhydrides with at least one diamine component of oxydianilines, phenylenediamines, and 2,2-bis[4-(4-aminophenoxy)phenyl]propane has excellent solvent barrier properties to an electrolytic solution, and can be used to give a highly reliable bipolar lithium ion secondary battery.
    Type: Application
    Filed: November 18, 2013
    Publication date: October 22, 2015
    Applicants: KANEKA CORPORATION, NISSAN MOTOR CO., LTD.
    Inventors: Takashi Kikuchi, Masami Yanagida, Takashi Ito, Kohei Ogawa, Satoshi Oku, Keisuke Wakabayashi, Norihisa Waki, Yuji Muroya, Yoshio Shimoida, Seiji Ishimoto, Tomohisa Matsuno
  • Publication number: 20150090941
    Abstract: A conductive polyimide film having an excellent film strength and electrical properties can be manufactured in a high productivity by a method for manufacturing conductive polyimide film which includes, in a manufacture method of a conductive polyimide film including an agent for imparting conductivity and a polyimide resin, drying a coating film including (A) and (B); and subjecting the film to imidation. (A) A polyamic acid including 3,3?,4,4?-biphenyltetracarboxylic acid dianhydride, 4,4?-oxydianiline, and 3,3?,4,4?-benzophenonetetracarboxylic acid dianhydride and/or p-phenylenediamine, which is obtained by reacting a tetracarboxylic acid dianhydride with a diamine compound. (B) A agent for imparting conductivity. (C) An imidation accelerator including a dialkylpyridine, and 0.1 to 1.6 molar equivalents of acetic anhydride per mol of an amic acid in a polyamic acid.
    Type: Application
    Filed: April 17, 2013
    Publication date: April 2, 2015
    Applicant: KANEKA CORPORATION
    Inventors: Kohei Ogawa, Masami Yanagida, Takashi Ito
  • Publication number: 20140099537
    Abstract: A conductive film includes a layer 1 formed by a conductive material 1 that includes a polymer material 1 containing any of (1) an amine and an epoxy resin (where the epoxy resin and the amine are mixed in a ratio of 1.0 or more in terms of the ratio of the number of active hydrogen atoms in the amine with respect to the number of functional groups in the epoxy resin), (2) a phenoxy resin and an epoxy resin, (3) a saturated hydrocarbon polymer having a hydroxyl group, and (4) a curable resin and an elastomer and conductive particles 1. The conductive film has excellent stability in an equilibrium potential environment in a negative electrode and low electric resistance per unit area in the thickness direction. A multilayer conductive film including the conductive film achieves excellent interlayer adhesion, and using them as a current collector enables the production of a battery satisfying both weight reduction and durability.
    Type: Application
    Filed: May 22, 2012
    Publication date: April 10, 2014
    Applicants: Nissan Motor Co., Ltd., Kaneka Corporation
    Inventors: Yusuke Kato, Takashi Ito, Masami Yanagida, Satoshi Oku, Hiroyuki Ogino, Masato Kusakabe, Ryutaro Mukai, Masahiro Kojima, Takashi Kikuchi, Akiko Waki, Shiho Inoue, Shigeo Ibuka, Yasuyuki Tanaka, Yoshio Shimoida, Yuji Muroya, Norihisa Waki
  • Publication number: 20130270487
    Abstract: A polyamic acid that includes a polyamic acid (A) obtained by reacting a tetracarboxylic anhydride containing 3,3?,4,4?-biphenyltetracarboxylic dianhydride with a diamine compound containing 4,4?-oxydianiline, a conductivity-imparting agent (B), and an imidization accelerator (C) and in which the conductivity-imparting agent is dispersed is used as a coating liquid; the coating liquid is applied onto a support; the obtained coating film is dried and imidized; and an electrically conductive polyimide film having a desired electric resistivity and good mechanical properties is consequently produced with good productivity.
    Type: Application
    Filed: October 28, 2011
    Publication date: October 17, 2013
    Applicant: KANEKA CORPORATION
    Inventors: Satoshi Oku, Masami Yanagida, Yusuke Kato, Masahiro Kojima, Takashi Ito
  • Patent number: 8124241
    Abstract: It is an object of the present invention to provide a method for manufacturing a multilayer polyimide film, uniform in film thickness and rate of dimensional change in the width direction of the film, which has a thermoplastic polyimide layer or the like serving as an adhesive layer. The object is attained by a method for manufacturing a multilayer polyimide film by width-spreading and flow-casting at least two types of polyimide resin solutions or polyimide precursor resin solutions fed into a multilayer coextrusion die including a plurality of flow channels, the method being characterized in that the thickness of each layer of the multilayer film is controlled by adding a solvent to the resin solutions to be fed into at least one of the flow channels and by adjusting, independently of the amounts of the resin solutions to be fed, the amount of the solvent to be added.
    Type: Grant
    Filed: February 19, 2007
    Date of Patent: February 28, 2012
    Assignee: Kaneka Corporation
    Inventors: Masami Yanagida, Kenji Ueshima, Yuzuru Saito
  • Patent number: 7858200
    Abstract: Disclosed in an adhesive film which enables to obtain a flexible metal clad laminate which is suppressed in dimensional change when produced by heat roll lamination. Such an adhesive film comprises a heat-resistant layer containing a highly heat resistant polyimide and an adhesive layer which is formed on at least one surface of the heat-resistant layer and contains a thermoplastic polyimide. In this adhesive film, the thermal shrinkage ratio in the TD direction is not less than +0.01%, and the thermal shrinkage ratio in the MD direction is not more than ?0.02%. Consequently, when a metal layer and the adhesive film are bonded together by heat roll lamination and the resulting laminate is subjected to a treatment with heating, occurrence of dimensional changes can be sufficiently suppressed.
    Type: Grant
    Filed: July 20, 2005
    Date of Patent: December 28, 2010
    Assignee: Kaneka Corporation
    Inventors: Masami Yanagida, Hisayasu Kaneshiro
  • Patent number: 7678315
    Abstract: A process for producing an adhesive film includes laminating an adhesive layer containing thermoplastic polyimide onto at least one surface of a highly heat-resistant polyimide layer by coextrusion casting method, wherein a chemical dehydrator and a catalyst are contained in a precursor solution of the highly heat-resistant polyimide and/or a solution containing either the thermoplastic polyimide or a precursor of the thermoplastic polyimide.
    Type: Grant
    Filed: November 17, 2006
    Date of Patent: March 16, 2010
    Assignee: Kaneka Corporation
    Inventors: Masami Yanagida, Hisayasu Kaneshiro, Takashi Kikuchi, Hiroyuki Tsuji
  • Publication number: 20090104465
    Abstract: It is an object of the present invention to provide a method for manufacturing a multilayer polyimide film, uniform in film thickness and rate of dimensional change in the width direction of the film, which has a thermoplastic polyimide layer or the like serving as an adhesive layer. The object is attained by a method for manufacturing a multilayer polyimide film by width-spreading and flow-casting at least two types of polyimide resin solutions or polyimide precursor resin solutions fed into a multilayer coextrusion die including a plurality of flow channels, the method being characterized in that the thickness of each layer of the multilayer film is controlled by adding a solvent to the resin solutions to be fed into at least one of the flow channels and by adjusting, independently of the amounts of the resin solutions to be fed, the amount of the solvent to be added.
    Type: Application
    Filed: February 19, 2007
    Publication date: April 23, 2009
    Inventors: Masami Yanagida, Kenji Ueshima, Yuzuru Saito
  • Publication number: 20090022939
    Abstract: An adhesive film, having lubricity, which can be favorably used as an FPC board even when a dense circuit pattern is formed is provided. The adhesive film is obtained by providing a highly heat-resistant polyimide layer and thermoplastic polyimide layers on both surfaces of the highly heat-resistant polyimide layer. The highly heat-resistant polyimide layer, serving as a central layer, has substantially no lubricant existing therein. Each of the thermoplastic polyimide layers has a lubricant, uniformly dispersed in the thermoplastic polyimide layer, which has a median average particle diameter of 1 ?m to 10 ?m. The lubricant existing in the thermoplastic polyimide layer is covered with a thermoplastic polyimide resin.
    Type: Application
    Filed: February 28, 2007
    Publication date: January 22, 2009
    Inventors: Masami Yanagida, Kenji Ueshima
  • Publication number: 20080305346
    Abstract: Disclosed in an adhesive film which enables to obtain a flexible metal clad laminate which is suppressed in dimensional change when produced by heat roll lamination. Such an adhesive film comprises a heat-resistant layer containing a highly heat resistant polyimide and an adhesive layer which is formed on at least one surface of the heat-resistant layer and contains a thermoplastic polyimide. In this adhesive film, the thermal shrinkage ratio in the TD direction is not less than +0.01%, and the thermal shrinkage ratio in the MD direction is not more than ?0.02%. Consequently, when a metal layer and the adhesive film are bonded together by heat roll lamination and the resulting laminate is subjected to a treatment with heating, occurrence of dimensional changes can be sufficiently suppressed.
    Type: Application
    Filed: July 20, 2005
    Publication date: December 11, 2008
    Applicant: Kaneka Corporation
    Inventors: Masami Yanagida, Hisayasu Kaneshiro
  • Publication number: 20080138637
    Abstract: An object of the present invention is to provide a polyimide multilayer adhesive film in which the thicknesses of the respective layers can be precisely measured by an infrared absorption method and a method for producing the same. In an adhesive film including a highly heat-resistant polyimide layer and an adhesive layer that contains a thermoplastic polyimide and that is disposed on at least one surface of the highly heat-resistant polyimide layer, the adhesive film is produced by a coextrusion-flow casting method and either of the highly heat-resistant polyimide layer or the adhesive layer contains, as a principal component, a polyimide resin having a functional group showing a characteristic infrared absorption wavelength.
    Type: Application
    Filed: December 7, 2005
    Publication date: June 12, 2008
    Inventors: Masami Yanagida, Kenji Ueshima, Toshiyuki Komatsu
  • Publication number: 20070178323
    Abstract: Disclosed is a polyimide laminate wherein a thermoplastic polyimide layer is formed on at least one side of a highly heat resistant polyimide layer. This polyimide laminate is characterized in that the highly heat-resistant polyimide layer contains molecules of a polyimide having a reactive functional group, and the thermoplastic polyimide layer contains molecules of a thermoplastic polyimide having a reactive functional group which is capable of forming at least one bond selected from an imide bond, amide bond and benzimidazole bond with the reactive functional group of the polyimide of contained in the highly heat-resistant polyimide layer. By having such an arrangement, the polyimide laminate is improved in the adhesion strength between the polyimides.
    Type: Application
    Filed: May 24, 2005
    Publication date: August 2, 2007
    Applicant: KANEKA CORPORATION
    Inventors: Masami Yanagida, Hiroyuki Tuji
  • Publication number: 20070158869
    Abstract: A process for producing an adhesive film includes laminating an adhesive layer containing thermoplastic polyimide onto at least one surface of a highly heat-resistant polyimide layer by coextrusion casting method, wherein a chemical dehydrator and a catalyst are contained in a precursor solution of the highly heat-resistant polyimide and/or a solution containing either the thermoplastic polyimide or a precursor of the thermoplastic polyimide.
    Type: Application
    Filed: November 17, 2006
    Publication date: July 12, 2007
    Inventors: Masami Yanagida, Hisayasu Kaneshiro, Takashi Kikuchi, Hiroyuki Tsuji
  • Publication number: 20040024107
    Abstract: The present invention provides a polyimide intermediate transfer belt having a medium resistivity, little non-uniformity, and high insulating reliability, in which its volume resistivity at the measured voltage of 100V is within the range of 1×106to 1×1012 &OHgr;·cm because of the containing of 0.5 to 20 parts by weight of carbon black and 5 to 40 parts by weight of a plate-like or pillar-like electrically conductive powder based on 100 parts by weight of a polyimide resin. It is possible to obtain a most suitable intermediate transfer belt by the formation of a fluorocarbon resin layer including an electrically conductive material where the surface resistivity is within the range of 1×108 to 1×1013 &OHgr;/cm2.
    Type: Application
    Filed: March 12, 2003
    Publication date: February 5, 2004
    Inventors: Hitoshi Nojiri, Masami Yanagida, Koji Sezaki
  • Publication number: 20030090031
    Abstract: The present invention provides a method and an apparatus for producing a polyimide molding which have superior productivity and accuracy of dimension. The invention particularly relates to a tubular polyimide applicable to an electrophotographic device, such as a laser-beam printer and a copying machine, or a precision driving belt required for high strength and high dimensional stability.
    Type: Application
    Filed: June 21, 2002
    Publication date: May 15, 2003
    Inventors: Hitoshi Nojiri, Masami Yanagida, Koji Sezaki, Teruo Matsutani