Patents by Inventor Masami Yanagida
Masami Yanagida has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10230112Abstract: A conductive film includes a layer 1 formed by a conductive material 1 that includes a polymer material 1 containing any of (1) an amine and an epoxy resin (where the epoxy resin and the amine are mixed in a ratio of 1.0 or more in terms of the ratio of the number of active hydrogen atoms in the amine with respect to the number of functional groups in the epoxy resin), (2) a phenoxy resin and an epoxy resin, (3) a saturated hydrocarbon polymer having a hydroxyl group, and (4) a curable resin and an elastomer and conductive particles 1. The conductive film has excellent stability in an equilibrium potential environment in a negative electrode and low electric resistance per unit area in the thickness direction. A multilayer conductive film including the conductive film achieves excellent interlayer adhesion, and using them as a current collector enables the production of a battery satisfying both weight reduction and durability.Type: GrantFiled: May 22, 2012Date of Patent: March 12, 2019Assignee: NISSAN MOTOR CO., LTD.Inventors: Yusuke Kato, Takashi Ito, Masami Yanagida, Satoshi Oku, Hiroyuki Ogino, Masato Kusakabe, Ryutaro Mukai, Masahiro Kojima, Takashi Kikuchi, Akiko Waki, Shiho Inoue, Shigeo Ibuka, Yasuyuki Tanaka, Yoshio Shimoida, Yuji Muroya, Norihisa Waki
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Patent number: 9537152Abstract: A collector for bipolar lithium ion secondary batteries comprises a first conductive layer that is obtained by adding a conductive filler to a base that contains an imide group-containing resin, and a second conductive layer that has a function of blocking lithium ions. The second conductive layer comprises a blocking resin layer that is obtained by adding a conductive filler to a base that contains a resin which contains no imide group, and a metal layer. This collector for bipolar lithium ion secondary batteries is used in such a manner that the first conductive layer is on the positive electrode active material layer side with respect to the second conductive layer.Type: GrantFiled: July 18, 2012Date of Patent: January 3, 2017Assignees: Nissan Motor Co., Ltd., Kaneka CorporationInventors: Yasuyuki Tanaka, Masami Yanagida, Kohei Ogawa, Satoshi Oku, Masahiro Kojima, Takashi Kikuchi, Takashi Ito
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Publication number: 20150303483Abstract: A collector for bipolar lithium ion secondary batteries including an electroconductive polyimide layer including a conductivity-imparting agent dispersed in a polyimide resin that is prepared by imidizing a polyamic acid that is obtained by reacting at least one tetracarboxylic dianhydride component of biphenyltetracarboxylic dianhydrides, 3,3?,4,4?-benzophenonetetracarboxylic dianhydride, pyromellitic dianhydride, and [isopropylidenebis(p-phenyleneoxy)]diphthalic dianhydrides with at least one diamine component of oxydianilines, phenylenediamines, and 2,2-bis[4-(4-aminophenoxy)phenyl]propane has excellent solvent barrier properties to an electrolytic solution, and can be used to give a highly reliable bipolar lithium ion secondary battery.Type: ApplicationFiled: November 18, 2013Publication date: October 22, 2015Applicants: KANEKA CORPORATION, NISSAN MOTOR CO., LTD.Inventors: Takashi Kikuchi, Masami Yanagida, Takashi Ito, Kohei Ogawa, Satoshi Oku, Keisuke Wakabayashi, Norihisa Waki, Yuji Muroya, Yoshio Shimoida, Seiji Ishimoto, Tomohisa Matsuno
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Publication number: 20150090941Abstract: A conductive polyimide film having an excellent film strength and electrical properties can be manufactured in a high productivity by a method for manufacturing conductive polyimide film which includes, in a manufacture method of a conductive polyimide film including an agent for imparting conductivity and a polyimide resin, drying a coating film including (A) and (B); and subjecting the film to imidation. (A) A polyamic acid including 3,3?,4,4?-biphenyltetracarboxylic acid dianhydride, 4,4?-oxydianiline, and 3,3?,4,4?-benzophenonetetracarboxylic acid dianhydride and/or p-phenylenediamine, which is obtained by reacting a tetracarboxylic acid dianhydride with a diamine compound. (B) A agent for imparting conductivity. (C) An imidation accelerator including a dialkylpyridine, and 0.1 to 1.6 molar equivalents of acetic anhydride per mol of an amic acid in a polyamic acid.Type: ApplicationFiled: April 17, 2013Publication date: April 2, 2015Applicant: KANEKA CORPORATIONInventors: Kohei Ogawa, Masami Yanagida, Takashi Ito
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Publication number: 20140099537Abstract: A conductive film includes a layer 1 formed by a conductive material 1 that includes a polymer material 1 containing any of (1) an amine and an epoxy resin (where the epoxy resin and the amine are mixed in a ratio of 1.0 or more in terms of the ratio of the number of active hydrogen atoms in the amine with respect to the number of functional groups in the epoxy resin), (2) a phenoxy resin and an epoxy resin, (3) a saturated hydrocarbon polymer having a hydroxyl group, and (4) a curable resin and an elastomer and conductive particles 1. The conductive film has excellent stability in an equilibrium potential environment in a negative electrode and low electric resistance per unit area in the thickness direction. A multilayer conductive film including the conductive film achieves excellent interlayer adhesion, and using them as a current collector enables the production of a battery satisfying both weight reduction and durability.Type: ApplicationFiled: May 22, 2012Publication date: April 10, 2014Applicants: Nissan Motor Co., Ltd., Kaneka CorporationInventors: Yusuke Kato, Takashi Ito, Masami Yanagida, Satoshi Oku, Hiroyuki Ogino, Masato Kusakabe, Ryutaro Mukai, Masahiro Kojima, Takashi Kikuchi, Akiko Waki, Shiho Inoue, Shigeo Ibuka, Yasuyuki Tanaka, Yoshio Shimoida, Yuji Muroya, Norihisa Waki
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Publication number: 20130270487Abstract: A polyamic acid that includes a polyamic acid (A) obtained by reacting a tetracarboxylic anhydride containing 3,3?,4,4?-biphenyltetracarboxylic dianhydride with a diamine compound containing 4,4?-oxydianiline, a conductivity-imparting agent (B), and an imidization accelerator (C) and in which the conductivity-imparting agent is dispersed is used as a coating liquid; the coating liquid is applied onto a support; the obtained coating film is dried and imidized; and an electrically conductive polyimide film having a desired electric resistivity and good mechanical properties is consequently produced with good productivity.Type: ApplicationFiled: October 28, 2011Publication date: October 17, 2013Applicant: KANEKA CORPORATIONInventors: Satoshi Oku, Masami Yanagida, Yusuke Kato, Masahiro Kojima, Takashi Ito
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Patent number: 8124241Abstract: It is an object of the present invention to provide a method for manufacturing a multilayer polyimide film, uniform in film thickness and rate of dimensional change in the width direction of the film, which has a thermoplastic polyimide layer or the like serving as an adhesive layer. The object is attained by a method for manufacturing a multilayer polyimide film by width-spreading and flow-casting at least two types of polyimide resin solutions or polyimide precursor resin solutions fed into a multilayer coextrusion die including a plurality of flow channels, the method being characterized in that the thickness of each layer of the multilayer film is controlled by adding a solvent to the resin solutions to be fed into at least one of the flow channels and by adjusting, independently of the amounts of the resin solutions to be fed, the amount of the solvent to be added.Type: GrantFiled: February 19, 2007Date of Patent: February 28, 2012Assignee: Kaneka CorporationInventors: Masami Yanagida, Kenji Ueshima, Yuzuru Saito
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Patent number: 7858200Abstract: Disclosed in an adhesive film which enables to obtain a flexible metal clad laminate which is suppressed in dimensional change when produced by heat roll lamination. Such an adhesive film comprises a heat-resistant layer containing a highly heat resistant polyimide and an adhesive layer which is formed on at least one surface of the heat-resistant layer and contains a thermoplastic polyimide. In this adhesive film, the thermal shrinkage ratio in the TD direction is not less than +0.01%, and the thermal shrinkage ratio in the MD direction is not more than ?0.02%. Consequently, when a metal layer and the adhesive film are bonded together by heat roll lamination and the resulting laminate is subjected to a treatment with heating, occurrence of dimensional changes can be sufficiently suppressed.Type: GrantFiled: July 20, 2005Date of Patent: December 28, 2010Assignee: Kaneka CorporationInventors: Masami Yanagida, Hisayasu Kaneshiro
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Patent number: 7678315Abstract: A process for producing an adhesive film includes laminating an adhesive layer containing thermoplastic polyimide onto at least one surface of a highly heat-resistant polyimide layer by coextrusion casting method, wherein a chemical dehydrator and a catalyst are contained in a precursor solution of the highly heat-resistant polyimide and/or a solution containing either the thermoplastic polyimide or a precursor of the thermoplastic polyimide.Type: GrantFiled: November 17, 2006Date of Patent: March 16, 2010Assignee: Kaneka CorporationInventors: Masami Yanagida, Hisayasu Kaneshiro, Takashi Kikuchi, Hiroyuki Tsuji
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Publication number: 20090104465Abstract: It is an object of the present invention to provide a method for manufacturing a multilayer polyimide film, uniform in film thickness and rate of dimensional change in the width direction of the film, which has a thermoplastic polyimide layer or the like serving as an adhesive layer. The object is attained by a method for manufacturing a multilayer polyimide film by width-spreading and flow-casting at least two types of polyimide resin solutions or polyimide precursor resin solutions fed into a multilayer coextrusion die including a plurality of flow channels, the method being characterized in that the thickness of each layer of the multilayer film is controlled by adding a solvent to the resin solutions to be fed into at least one of the flow channels and by adjusting, independently of the amounts of the resin solutions to be fed, the amount of the solvent to be added.Type: ApplicationFiled: February 19, 2007Publication date: April 23, 2009Inventors: Masami Yanagida, Kenji Ueshima, Yuzuru Saito
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Publication number: 20090022939Abstract: An adhesive film, having lubricity, which can be favorably used as an FPC board even when a dense circuit pattern is formed is provided. The adhesive film is obtained by providing a highly heat-resistant polyimide layer and thermoplastic polyimide layers on both surfaces of the highly heat-resistant polyimide layer. The highly heat-resistant polyimide layer, serving as a central layer, has substantially no lubricant existing therein. Each of the thermoplastic polyimide layers has a lubricant, uniformly dispersed in the thermoplastic polyimide layer, which has a median average particle diameter of 1 ?m to 10 ?m. The lubricant existing in the thermoplastic polyimide layer is covered with a thermoplastic polyimide resin.Type: ApplicationFiled: February 28, 2007Publication date: January 22, 2009Inventors: Masami Yanagida, Kenji Ueshima
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Publication number: 20080305346Abstract: Disclosed in an adhesive film which enables to obtain a flexible metal clad laminate which is suppressed in dimensional change when produced by heat roll lamination. Such an adhesive film comprises a heat-resistant layer containing a highly heat resistant polyimide and an adhesive layer which is formed on at least one surface of the heat-resistant layer and contains a thermoplastic polyimide. In this adhesive film, the thermal shrinkage ratio in the TD direction is not less than +0.01%, and the thermal shrinkage ratio in the MD direction is not more than ?0.02%. Consequently, when a metal layer and the adhesive film are bonded together by heat roll lamination and the resulting laminate is subjected to a treatment with heating, occurrence of dimensional changes can be sufficiently suppressed.Type: ApplicationFiled: July 20, 2005Publication date: December 11, 2008Applicant: Kaneka CorporationInventors: Masami Yanagida, Hisayasu Kaneshiro
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Publication number: 20080138637Abstract: An object of the present invention is to provide a polyimide multilayer adhesive film in which the thicknesses of the respective layers can be precisely measured by an infrared absorption method and a method for producing the same. In an adhesive film including a highly heat-resistant polyimide layer and an adhesive layer that contains a thermoplastic polyimide and that is disposed on at least one surface of the highly heat-resistant polyimide layer, the adhesive film is produced by a coextrusion-flow casting method and either of the highly heat-resistant polyimide layer or the adhesive layer contains, as a principal component, a polyimide resin having a functional group showing a characteristic infrared absorption wavelength.Type: ApplicationFiled: December 7, 2005Publication date: June 12, 2008Inventors: Masami Yanagida, Kenji Ueshima, Toshiyuki Komatsu
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Publication number: 20070178323Abstract: Disclosed is a polyimide laminate wherein a thermoplastic polyimide layer is formed on at least one side of a highly heat resistant polyimide layer. This polyimide laminate is characterized in that the highly heat-resistant polyimide layer contains molecules of a polyimide having a reactive functional group, and the thermoplastic polyimide layer contains molecules of a thermoplastic polyimide having a reactive functional group which is capable of forming at least one bond selected from an imide bond, amide bond and benzimidazole bond with the reactive functional group of the polyimide of contained in the highly heat-resistant polyimide layer. By having such an arrangement, the polyimide laminate is improved in the adhesion strength between the polyimides.Type: ApplicationFiled: May 24, 2005Publication date: August 2, 2007Applicant: KANEKA CORPORATIONInventors: Masami Yanagida, Hiroyuki Tuji
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Publication number: 20070158869Abstract: A process for producing an adhesive film includes laminating an adhesive layer containing thermoplastic polyimide onto at least one surface of a highly heat-resistant polyimide layer by coextrusion casting method, wherein a chemical dehydrator and a catalyst are contained in a precursor solution of the highly heat-resistant polyimide and/or a solution containing either the thermoplastic polyimide or a precursor of the thermoplastic polyimide.Type: ApplicationFiled: November 17, 2006Publication date: July 12, 2007Inventors: Masami Yanagida, Hisayasu Kaneshiro, Takashi Kikuchi, Hiroyuki Tsuji
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Publication number: 20040024107Abstract: The present invention provides a polyimide intermediate transfer belt having a medium resistivity, little non-uniformity, and high insulating reliability, in which its volume resistivity at the measured voltage of 100V is within the range of 1×106to 1×1012 &OHgr;·cm because of the containing of 0.5 to 20 parts by weight of carbon black and 5 to 40 parts by weight of a plate-like or pillar-like electrically conductive powder based on 100 parts by weight of a polyimide resin. It is possible to obtain a most suitable intermediate transfer belt by the formation of a fluorocarbon resin layer including an electrically conductive material where the surface resistivity is within the range of 1×108 to 1×1013 &OHgr;/cm2.Type: ApplicationFiled: March 12, 2003Publication date: February 5, 2004Inventors: Hitoshi Nojiri, Masami Yanagida, Koji Sezaki
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Publication number: 20030090031Abstract: The present invention provides a method and an apparatus for producing a polyimide molding which have superior productivity and accuracy of dimension. The invention particularly relates to a tubular polyimide applicable to an electrophotographic device, such as a laser-beam printer and a copying machine, or a precision driving belt required for high strength and high dimensional stability.Type: ApplicationFiled: June 21, 2002Publication date: May 15, 2003Inventors: Hitoshi Nojiri, Masami Yanagida, Koji Sezaki, Teruo Matsutani