Abstract: A semiconductor device constituting a decoder circuit for memory selection and having a smaller area is provided by using surrounding gate transistors (SGTs), which are vertical transistors. In a decoder circuit formed by a plurality of MOS transistors arranged in m rows and n columns, the MOS transistors that constitute the decoder circuit are arranged on a planar silicon layer formed on a substrate. Each has a structure including a drain, a gate, and a source arranged in a vertical direction, the gate surrounding a semiconductor pillar. The planar silicon layer is formed by a first active region of a first conductivity type and a second active region of a second conductivity type, and the regions are connected to each other via a conductive region formed on the surface of the planar silicon layer. Consequently, a semiconductor device that constitutes a decoder circuit having a smaller area is provided.

Abstract: A semiconductor device constituting a decoder circuit for memory selection and having a smaller area is provided by using surrounding gate transistors (SGTs), which are vertical transistors. In a decoder circuit formed by a plurality of MOS transistors arranged in m rows and n columns, the MOS transistors that constitute the decoder circuit are arranged on a planar silicon layer formed on a substrate. Each has a structure including a drain, a gate, and a source arranged in a vertical direction, the gate surrounding a semiconductor pillar. The planar silicon layer is formed by a first active region of a first conductivity type and a second active region of a second conductivity type, and the regions are connected to each other via a conductive region formed on the surface of the planar silicon layer. Consequently, a semiconductor device that constitutes a decoder circuit having a smaller area is provided.

Abstract: A semiconductor device constituting a decoder circuit for memory selection and having a smaller area is provided by using surrounding gate transistors (SGTs), which are vertical transistors. In a decoder circuit formed by a plurality of MOS transistors arranged in m rows and n columns, the MOS transistors that constitute the decoder circuit are arranged on a planar silicon layer formed on a substrate. Each has a structure including a drain, a gate, and a source arranged in a vertical direction, the gate surrounding a silicon pillar. The planar silicon layer is formed by a first active region of a first conductivity type and a second active region of a second conductivity type, and the regions are connected to each other via a silicide layer formed on the surface of the planar silicon layer. Consequently, a semiconductor device that constitutes a decoder circuit having a smaller area is provided.

Abstract: A semiconductor device includes a 3-input NAND decoder having six MOS transistors arranged in a line. The MOS transistors of the decoder are formed in a planar silicon layer disposed on a substrate and each have a structure in which a drain, a gate, and a source are arranged vertically and the gate surrounds a silicon pillar. The planar silicon layer includes a first active region having a first conductivity type and a second active region having a second conductivity type. The first and second active regions are connected to each other via a silicon layer on a surface of the planar silicon layer.

Abstract: A semiconductor device employs surrounding gate transistors (SGTs) which are vertical transistors to constitute a CMOS NAND circuit. The NAND circuit is formed by using a plurality of MOS transistors arranged in m rows and n columns. The MOS transistors constituting the NAND circuit are formed on a planar silicon layer disposed on a substrate, and each have a structure in which a drain, a gate, and a source are arranged in a vertical direction, the gate surrounding a silicon pillar. The planar silicon layer includes a first active region having a first conductivity type and a second active region having a second conductivity type. The first active region and the second active region are connected to one another via a silicon layer formed on a surface of the planar silicon layer. This provides for a semiconductor device that constitutes a NAND circuit.

Abstract: A semiconductor device employs surrounding gate transistors (SGTs) which are vertical transistors to constitute a CMOS NOR circuit. The NOR circuit is formed by using a plurality of MOS transistors arranged in m rows and n columns. The MOS transistors constituting the NOR circuit are formed on a planar silicon layer disposed on a substrate, and each have a structure in which a drain, a gate, and a source are arranged in a vertical direction, the gate surrounding a silicon pillar. The planar silicon layer includes a first active region having a first conductivity type and a second active region having a second conductivity type. The first active region and the second active region are connected to one another via a silicon layer formed on a surface of the planar silicon layer. This provides for a semiconductor device that constitutes a NOR circuit.

Abstract: A semiconductor device includes a 3-input NOR decoder having six MOS transistors arranged in a line. The MOS transistors of the decoder are formed in a planar silicon layer disposed on a substrate and each have a structure in which a drain, a gate, and a source are arranged vertically and the gate surrounds a silicon pillar. The planar silicon layer includes a first active region having a first conductivity type and a second active region having a second conductivity type. The first and second active regions are connected to each other via a silicon layer on a surface of the planar silicon layer.

Abstract: A semiconductor device includes a two-input NOR circuit including four MOS transistors arranged in a line. Each of the MOS transistors is disposed on a planar silicon layer disposed on a substrate. The drain, gate, and source of the MOS transistor are arranged in the vertical direction. The gate surrounds a silicon pillar. The planar silicon layer is constituted by a first activation region of a first conductivity type and a second activation region of a second conductivity type. The first and second activation regions are connected to each other via a silicon layer disposed on a surface of the planar silicon layer, so as to form a NOR circuit having a small area.

Abstract: A semiconductor device includes a 2-input NOR decoder and an inverter that have six MOS transistors arranged in a line. The MOS transistors of the decoder are formed in a planar silicon layer disposed on a substrate and each have a structure in which a drain, a gate, and a source are arranged vertically and the gate surrounds a silicon pillar. The planar silicon layer includes a first active region having a first conductivity type and a second active region having a second conductivity type. The first and second active regions are connected to each other via a silicon layer on a surface of the planar silicon layer.

Abstract: A semiconductor device has a small area and constitutes a CMOS 3-input NAND circuit by using surrounding gate transistors (SGTs) that are vertical transistors. In a 3-input NAND circuit including six MOS transistors arranged in a line, the MOS transistors constituting the NAND circuit have the following configuration. Planar silicon layers are disposed on a substrate. The drain, gate, and source of the MOS transistors are arranged in a vertical direction, and the gate surrounds a silicon pillar. The planer silicon layers include a first active region having a first conductivity type and a second active region having a second conductivity type. The first and second active regions are connected to each other via a silicide layer disposed on surfaces of the planar silicon layers. In this way, a semiconductor device constituting a NAND circuit with a small area is provided.

Abstract: A semiconductor device includes a 2-input NAND decoder and an inverter that have six MOS transistors arranged in a line. The MOS transistors of the decoder are formed in a planar silicon layer disposed on a substrate and each have a structure in which a drain, a gate, and a source are arranged vertically and the gate surrounds a silicon pillar. The planar silicon layer includes a first active region having a first conductivity type and a second active region having a second conductivity type. The first and second active regions are connected to each other via a silicon layer on a surface of the planar silicon layer.

Abstract: A semiconductor device employs surrounding gate transistors (SGTs) which are vertical transistors to constitute a CMOS NAND circuit. The NAND circuit is formed by using a plurality of MOS transistors arranged in m rows and n columns. The MOS transistors constituting the NAND circuit are formed on a planar silicon layer disposed on a substrate, and each have a structure in which a drain, a gate, and a source are arranged in a vertical direction, the gate surrounding a silicon pillar. The planar silicon layer includes a first active region having a first conductivity type and a second active region having a second conductivity type. The first active region and the second active region are connected to one another via a silicon layer formed on a surface of the planar silicon layer. This provides for a semiconductor device that constitutes a NAND circuit.

Abstract: A semiconductor device includes a 2-input NAND decoder and an inverter that have six MOS transistors arranged in a line. The MOS transistors of the decoder are formed in a planar silicon layer disposed on a substrate and each have a structure in which a drain, a gate, and a source are arranged vertically and the gate surrounds a silicon pillar. The planar silicon layer includes a first active region having a first conductivity type and a second active region having a second conductivity type. The first and second active regions are connected to each other via a silicon layer on a surface of the planar silicon layer.

Abstract: A semiconductor device includes a 2-input NOR decoder and an inverter that have six MOS transistors arranged in a line. The MOS transistors of the decoder are formed in a planar silicon layer disposed on a substrate and each have a structure in which a drain, a gate, and a source are arranged vertically and the gate surrounds a silicon pillar. The planar silicon layer includes a first active region having a first conductivity type and a second active region having a second conductivity type. The first and second active regions are connected to each other via a silicon layer on a surface of the planar silicon layer.

Abstract: A semiconductor device includes a 3-input NOR decoder having six MOS transistors arranged in a line. The MOS transistors of the decoder are formed in a planar silicon layer disposed on a substrate and each have a structure in which a drain, a gate, and a source are arranged vertically and the gate surrounds a silicon pillar. The planar silicon layer includes a first active region having a first conductivity type and a second active region having a second conductivity type. The first and second active regions are connected to each other via a silicon layer on a surface of the planar silicon layer.

Abstract: A semiconductor device includes a 3-input NAND decoder having six MOS transistors arranged in a line. The MOS transistors of the decoder are formed in a planar silicon layer disposed on a substrate and each have a structure in which a drain, a gate, and a source are arranged vertically and the gate surrounds a silicon pillar. The planar silicon layer includes a first active region having a first conductivity type and a second active region having a second conductivity type. The first and second active regions are connected to each other via a silicon layer on a surface of the planar silicon layer.

Abstract: A semiconductor device includes a two-input NAND circuit including four MOS transistors arranged in a line. Each of the MOS transistors is disposed on a planar silicon layer disposed on a substrate. The drain, gate, and source of the MOS transistor are arranged in the vertical direction. The gate surrounds a silicon pillar. The planar silicon layer is constituted by a first activation region of a first conductivity type and a second activation region of a second conductivity type. The first and second activation regions are connected to each other via a silicon layer disposed on a surface of the planar silicon layer, so as to form a NAND circuit having a small area.

Abstract: A semiconductor device has a small area and constitutes a CMOS 3-input NOR circuit by using surrounding gate transistors (SGTs) which are vertical transistors. In the 3-input NOR circuit including six MOS transistors arranged in a line, the MOS transistors constituting the NOR circuit have the following configuration: Planar silicon layers are disposed on a substrate. The drain, the gate, and the source of the MOS transistors are arranged in a vertical direction, and the gate surrounds a silicon pillar. The planar silicon layers include a first active region having a first conductivity type and a second active region having a second conductivity type. The first and second active regions are connected to each other via a silicide layer disposed on surfaces of the planar silicon layers. In this way, a semiconductor device constituting a NOR circuit with a small area is provided.

Abstract: A semiconductor device employs surrounding gate transistors (SGTs) which are vertical transistors to constitute a CMOS NAND circuit. The NAND circuit is formed by using a plurality of MOS transistors arranged in m rows and n columns. The MOS transistors constituting the NAND circuit are formed on a planar silicon layer disposed on a substrate, and each have a structure in which a drain, a gate, and a source are arranged in a vertical direction, the gate surrounding a silicon pillar. The planar silicon layer includes a first active region having a first conductivity type and a second active region having a second conductivity type. The first active region and the second active region are connected to one another via a silicon layer formed on a surface of the planar silicon layer. This provides for a semiconductor device that constitutes a NAND circuit.

Abstract: A semiconductor device employs surrounding gate transistors (SGTs) which are vertical transistors to constitute a CMOS NOR circuit. The NOR circuit is formed by using a plurality of MOS transistors arranged in m rows and n columns. The MOS transistors constituting the NOR circuit are formed on a planar silicon layer disposed on a substrate, and each have a structure in which a drain, a gate, and a source are arranged in a vertical direction, the gate surrounding a silicon pillar. The planar silicon layer includes a first active region having a first conductivity type and a second active region having a second conductivity type. The first active region and the second active region are connected to one another via a silicon layer formed on a surface of the planar silicon layer. This provides for a semiconductor device that constitutes a NOR circuit.