Abstract: The present invention provides an annealed steel material having a composition containing, in mass %, 0.28?C?0.42, 0.01?Si?1.50, 0.20?Mn?1.20, 4.80?Cr?6.00, 0.80?Mo?3.20, 0.40?V?1.20, and 0.002?N?0.080, with the balance being Fe and unavoidable impurities; in which the annealed steel material has a cross-sectional size of a thickness of 200 mm or more and a width of 250 mm or more, and a hardness of 100 HRB or less; and in which a diameter of a largest ferritic grain observed in a microstructure is 120 ?m or less in terms of a perfect circle equivalent, an area ratio of carbides is 3.0% or more and less than 10.5%, and an average particle diameter of the carbides is 0.18 ?m or more and 0.29 ?m or less.

Abstract: The mold steel according to the present invention contains 0.35<C<0.55 mass %, 0.003?Si<0.300 mass %, 0.30<Mn<1.50 mass %, 2.00?Cr<3.50 mass %, 0.003?Cu<1.200 mass %, 0.003?Ni<1.380 mass %, 0.50<Mo<3.29 mass %, 0.55<V<1.13 mass %, and 0.0002?N<0.1200 mass %, with a balance being Fe and unavoidable impurities, and satisfies 0.55<Cu+Ni+Mo<3.29 mass %, and the molding tool according to the present invention contains a mold and/or a mold component formed of the mold steel.

Abstract: The present invention relates to a mold steel having a composition including, in terms of mass %: 0.220%?C?0.360%; 0.65%?Si<1.05%; 0.43%?Mn?0.92%; 0.43%?Ni?0.92%; 0.67%?0.5Mn+Ni?1.30%; 10.50%?Cr<12.50%; 0.05%?Mo<0.50%; 0.002%?V<0.50%; 0.001%?N?0.160%; and 0.300%?C+N?0.420%, with the remainder being Fe and unavoidable impurities.

Abstract: The present invention relates to a steel and a mold constituted of the steel, in which the steel contains as essential elements, in terms of % by mass, 0.58%?C?0.70%, 0.010%?Si?0.30%, 0.50%?Mn?2.00%, 0.50%?Cr<2.0%, 1.8%?Mo?3.0%, and 0.050%<V?0.80%, with the balance being Fe and unavoidable impurities.

Abstract: The present invention relates to a steel powder having a composition containing, in mass %, 0.10?C<0.25, 0.005?Si?0.600, 2.00?Cr?6.00, ?0.0125×[Cr]+0.125?Mn??0.100×[Cr]+1.800 in which the [Cr] represents the value of Cr content in mass %, 0.01?Mo?1.80, ?0.00447×[Mo]+0.010?V??0.1117×[Mo]+0.901 in which the [Mo] represents the value of Mo content in mass %, 0.0002?N?0.3000, and the balance being Fe and unavoidable impurities.

Abstract: The present invention relates to a steel for a mold, having a composition containing, on a % by mass basis, 0.25%<C<0.38%, 0.01%<Si<0.30%, 0.92%<Mn<1.80%, 0.8%<Cr<2.2%, 0.8%<Mo<1.4%, and 0.25%<V<0.58%, with the balance being Fe and inevitable impurities, and a mold manufactured by additive manufacturing by using the steel for a mold.

Abstract: A semiconductor manufacturing apparatus includes: a calculation unit having at least one computer for processing semiconductor design information; a control unit for controlling radiation of an electron in accordance with a processing result of the semiconductor design information; a writing unit for radiating an electron in accordance with instructions of the control unit; and at least one storage device. The semiconductor manufacturing apparatus permits a communication between the storage device, the calculation unit, the control unit, and the writing unit. The semiconductor manufacturing apparatus further includes a communication pass through which the storage device can be controlled.

Abstract: A semiconductor manufacturing apparatus includes: a calculation unit having at least one computer for processing semiconductor design information; a control unit for controlling radiation of an electron in accordance with a processing result of the semiconductor design information; a writing unit for radiating an electron in accordance with instructions of the control unit; and at least one storage device. The semiconductor manufacturing apparatus permits a communication between the storage device, the calculation unit, the control unit, and the writing unit. The semiconductor manufacturing apparatus further includes a communication pass through which the storage device can be controlled.

Abstract: A semiconductor manufacturing apparatus includes: a calculation unit having at least one computer for processing semiconductor design information; a control unit for controlling radiation of an electron in accordance with a processing result of the semiconductor design information; a writing unit for radiating an electron in accordance with instructions of the control unit; and at least one storage device. The semiconductor manufacturing apparatus permits a communication between the storage device, the calculation unit, the control unit, and the writing unit. The semiconductor manufacturing apparatus further includes a communication pass through which the storage device can be controlled.

Abstract: The present invention provides a semiconductor device furnished with tamper-resistant identification information by forming a circuit pattern 2B which differs from one semiconductor chip to another in a semiconductor chip 2 packaged in a semiconductor device 1 in addition to an original circuit pattern 2A and expressing the identification information by this circuit pattern 2B and the invention further provides a semiconductor manufacturing management system targeted at a product mounted with this semiconductor device, capable of managing the product from the manufacturing to the mode of use of the semiconductor device.

Abstract: In the case of drawing an oblique figure pattern, when drawing an oblique figure by using a slender rectangular beam, a problem occurs that edge roughness occurs at an oblique-side portion to deteriorate the drawing accuracy. The present invention solves the above problem and provides an electron-beam drawing apparatus and an electron-beam drawing method capable of accurately drawing even an oblique figure. A first rectangular aperture and a second parallelogrammatic aperture are used and a variable parallelogrammatic electron beam formed by two apertures is used to draw a desired pattern on the surface of a sample. Moreover, oblique-side-portion-contour decomposition means is used to draw an oblique-side portion by a variable parallelogram and the inside of an oblique side by a triangle and a quadrangle (rectangle).

Abstract: A semiconductor manufacturing apparatus includes: a calculation unit having at least one computer for processing semiconductor design information; a control unit for controlling radiation of an electron in accordance with a processing result of the semiconductor design information; a writing unit for radiating an electron in accordance with instructions of the control unit; and at least one storage device. The semiconductor manufacturing apparatus permits a communication between the storage device, the calculation unit, the control unit, and the writing unit. The semiconductor manufacturing apparatus further includes a communication pass through which the storage device can be controlled.

Abstract: A semiconductor manufacturing apparatus includes: a calculation unit having at least one computer for processing semiconductor design information; a control unit for controlling radiation of an electron in accordance with a processing result of the semiconductor design information; a writing unit for radiating an electron in accordance with instructions of the control unit; and at least one storage device. The semiconductor manufacturing apparatus permits a communication between the storage device, the calculation unit, the control unit, and the writing unit. The semiconductor manufacturing apparatus further includes a communication pass through which the storage device can be controlled.

Abstract: In the case of drawing an oblique figure pattern, when drawing an oblique figure by using a slender rectangular beam, a problem occurs that edge roughness occurs at an oblique-side portion to deteriorate the drawing accuracy. The present invention solves the above problem and provides an electron-beam drawing apparatus and an electron-beam drawing method capable of accurately drawing even an oblique figure.

Abstract: A semiconductor manufacturing apparatus includes: a calculation unit having at least one computer for processing semiconductor design information; a control unit for controlling radiation of an electron in accordance with a processing result of the semiconductor design information; a writing unit for radiating an electron in accordance with instructions of the control unit; and at least one storage device. The semiconductor manufacturing apparatus permits a communication between the storage device, the calculation unit, the control unit, and the writing unit. The semiconductor manufacturing apparatus further includes a communication pass through which the storage device can be controlled.

Abstract: An improved method of forging a precipitation hardening type stainless steel. The method comprises the steps of soaking the precipitation hardening type stainless steel at a temperature of austenitizing range, cooling the steel to a temperature in the range of 200-700° C., preferably 400-600° C., and subjecting the steel to forging at the temperature in this range. Conventional lubricants and die cooling oils can be used without being deteriorated due to high temperature. It is preferable to forcibly cool the soaked steel to adjust the temperature of the steel at which it is forged. The forged steel is then age hardened to exhibit inherent hardness.

Abstract: In the case of drawing an oblique figure pattern, when drawing an oblique figure by using a slender rectangular beam, a problem occurs that edge roughness occurs at an oblique-side portion to deteriorate the drawing accuracy. The present invention solves the above problem and provides an electron-beam drawing apparatus and an electron-beam drawing method capable of accurately drawing even an oblique figure.

Abstract: A charged particle beam exposure apparatus includes an irradiator for irradiating a sample with a charged particle beam, an analog controller for analog controlling the charged particle beam, a digital controller for digital controlling the analog controller, and a digital transmission path connecting the analog controller to the digital controller. The analog controller is disposed inside a room, and the digital controller is disposed outside the room.

Abstract: A column section is disposed within a thermostatic chamber within a clean room, a section for analog controlling each portion of the column section is disposed within the clean room and outside of the thermostatic chamber, and a section for digital controlling the analog control section is disposed outside of the clean room.