Abstract: The present invention provides a reliable die bonder that can accurately bond a die and a semiconductor manufacturing method. The present invention is provided with a bonding head that adsorbs a die from a wafer and bonds it to a substrate, a positioning mechanism that is provided with a first adjustment mechanism that positions a position of the die at predetermined accuracy, and positions the bonding head, a positioning controller that controls the positioning mechanism and a second adjustment mechanism that is provided to the bonding head, and adjusts a position of the die at higher accuracy than the first adjustment mechanism.

Abstract: There is provided a motor control system and motor control method which can shorten settling time by restraining vibration and deviation relative to an advancing direction during operation. Moreover, according to the present invention, it is possible to cause a motor to be operated with an ideal track and, since it is possible to always monitor a present position, it is made easy to cause a plurality of axes to be synchronously operated. The motor control system is provided with a unit generating command waveforms from a jerk data which has significant effects on the vibration relative to the advancing direction, and a unit performing a real time real position control of regenerating future command waveforms according to a deviation amount, while always performing jerk-limit, whereby the vibration and the deviation relative to the advancing direction when the motor operates at high speed are restrained.

Abstract: The present invention provides a reliable die bonder that can accurately bond a die and a semiconductor manufacturing method. The present invention is provided with a bonding head that adsorbs a die from a wafer and bonds it to a substrate, a positioning mechanism that is provided with a first adjustment mechanism that positions a position of the die at predetermined accuracy, and positions the bonding head, a positioning controller that controls the positioning mechanism and a second adjustment mechanism that is provided to the bonding head, and adjusts a position of the die at higher accuracy than the first adjustment mechanism.

Abstract: There is provided a motor control system and motor control method which can shorten settling time by restraining vibration and deviation relative to an advancing direction during operation. Moreover, according to the present invention, it is possible to cause a motor to be operated with an ideal track and, since it is possible to always monitor a present position, it is made easy to cause a plurality of axes to be synchronously operated. The motor control system is provided with a unit generating command waveforms from a jerk data which has significant effects on the vibration relative to the advancing direction, and a unit performing a real time real position control of regenerating future command waveforms according to a deviation amount, while always performing jerk-limit, whereby the vibration and the deviation relative to the advancing direction when the motor operates at high speed are restrained.

Abstract: The present invention is a tire inspecting apparatus comprising: a rotating unit, which rotates a tire having a specific point and a mark indicating a reference point; a sensor, which detects that the mark has been positioned in a predetermined direction with respect to a center of the tire; a detecting unit, which detects a position of the specific point; and a controller, which drives the rotating unit; stops the rotation of the tire when the mark has been positioned in the predetermined direction with respect to the center of the tire; causes the detecting unit to detect the position of the specific point; and detects an angle in a clockwise direction, between a direction connecting the detected position of the specific point and the center of the tire, and the predetermined direction.