Patents by Inventor Masamichi Nakashiba

Masamichi Nakashiba has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and apparatus for gasifying fluidized bed
    Patent number: 6709636
    Abstract: Combustibles such as wastes are gasified in a fluidized bed. A fluidized-bed furnace has a heat recovery region in addition to a combustion region. The temperature of a fluidized bed or the temperature of a freeboard is controlled so as to be kept at a predetermined value by adjusting the heat recovery rate in the heat recovery region.
    Type: Grant
    Filed: November 10, 1998
    Date of Patent: March 23, 2004
    Assignee: Ebara Corporation
    Inventors: Takahiro Oshita, Tetsuhisa Hirose, Shuichi Nagato, Norihisa Miyoshi, Masamichi Nakashiba
  • Apparatus for polishing workpiece
    Patent number: 6350346
    Abstract: A polishing apparatus for polishing a workpiece such as a semiconductor wafer has a turntable with an abrasive cloth mounted on an upper surface thereof, and a top ring for holding a workpiece and pressing the workpiece against the abrasive cloth under a first pressing force to polish the workpiece. The top ring has a recess defined therein for accommodating the workpiece therein. A presser ring is vertically movably disposed around the top ring, and pressed against the abrasive cloth under a variable second pressing force. The first and second pressing forces are variable independently of each other, and the second pressing force is determined based on the first pressing force.
    Type: Grant
    Filed: April 9, 1999
    Date of Patent: February 26, 2002
    Assignee: Ebara Corporation
    Inventors: Masamichi Nakashiba, Norio Kimura, Isamu Watanabe, Yoko Hasegawa
  • Apparatus for and method of polishing workpiece
    Patent number: 5916412
    Abstract: A polishing apparatus for polishing a workpiece such as a semiconductor wafer has a turntable with an abrasive cloth mounted on an upper surface thereof, and a top ring for holding a workpiece and pressing the workpiece against the abrasive cloth under a first pressing force to polish the workpiece. The top ring has a recess defined therein for accommodating the workpiece therein. A presser ring is vertically movably disposed around the top ring, and pressed against the abrasive cloth under a variable second pressing force. The first and second pressing forces are variable independently of each other, and the second pressing force is determined based on the first pressing force.
    Type: Grant
    Filed: October 9, 1996
    Date of Patent: June 29, 1999
    Assignee: Ebara Corporation
    Inventors: Masamichi Nakashiba, Norio Kimura, Isamu Watanabe, Yoko Hasegawa
  • Apparatus for and method for polishing workpiece
    Patent number: 5762539
    Abstract: A polishing apparatus for polishing a workpiece such as a semiconductor wafer has a turntable with a polishing surface, and a top ring for holding a workpiece and pressing the workpiece against the polishing surface under a first pressing. The polishing apparatus has a pressurized fluid source for supplying pressurized fluid, and a plurality of openings provided in the holding surface of the top ring for ejecting the pressurized fluid supplied from the pressurized fluid source. A plurality of areas each having the openings are defined on the holding surface so that the pressurized fluid is selectively ejectable from the openings in the respective areas.
    Type: Grant
    Filed: February 27, 1997
    Date of Patent: June 9, 1998
    Assignee: Ebara Corporation
    Inventors: Masamichi Nakashiba, Norio Kimura, Isamu Watanabe, Kaori Yoshida
  • Apparatus for and method for polishing workpiece
    Patent number: RE38826
    Abstract: A polishing apparatus for polishing a workpiece such as a semiconductor wafer has a turntable with a polishing surface, and a top ring for holding a workpiece and pressing the workpiece against the polishing surface under a first pressing. The polishing apparatus has a pressurized fluid source for supplying pressurized fluid, and a plurality of openings provided in the holding surface of the top ring for ejecting the pressurized fluid supplied from the pressurized fluid source. A plurality of areas each having the openings are defined on the holding surface so that the pressurized fluid is selectively ejectable from the openings in the respective areas.
    Type: Grant
    Filed: June 8, 2000
    Date of Patent: October 11, 2005
    Assignee: EBARA Corporation
    Inventors: Masamichi Nakashiba, Norio Kimura, Isamu Watanabe, Kaori Yoshida
  • Apparatus for and method for polishing workpiece
    Patent number: RE38854
    Abstract: A polishing apparatus for polishing a workpiece such as a semiconductor wafer has a turntable with a polishing surface, and a top ring for holding a workpiece and pressing the workpiece against the polishing surface under a first pressing. The polishing apparatus has a pressurized fluid source for supplying pressurized fluid, and a plurality of openings provided in the holding surface of the top ring for ejecting the pressurized fluid supplied from the pressurized fluid source. A plurality of areas each having the openings are defined on the holding surface so that the pressurized fluid is selectively ejectable from the openings in the respective areas.
    Type: Grant
    Filed: May 13, 2002
    Date of Patent: October 25, 2005
    Assignee: Ebara Corporation
    Inventors: Masamichi Nakashiba, Norio Kimura, Isamu Watanabe, Kaori Yoshida
  • Apparatus for and method for polishing workpiece
    Patent number: RE39471
    Abstract: A polishing apparatus for polishing a workpiece such as a semiconductor wafer has a turntable with a polishing surface, and a top ring for holding a workpiece and pressing the workpiece against the polishing surface under a first pressing. The polishing apparatus has a pressurized fluid source for supplying pressurized fluid, and a plurality of openings provided in the holding surface of the top ring for ejecting the pressurized fluid supplied from the pressurized fluid source. A plurality of areas each having the openings are defined on the holding surface so that the pressurized fluid is selectively ejectable from the openings in the respective areas.
    Type: Grant
    Filed: October 29, 2004
    Date of Patent: January 16, 2007
    Assignee: Ebara Corporation
    Inventors: Masamichi Nakashiba, Norio Kimura, Isamu Watanabe, Kaori Yoshida