Patents by Inventor Masamichi SHIKO

Masamichi SHIKO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • CONCENTRATION DEVICE AND CONCENTRATION METHOD
    Publication number: 20220162536
    Abstract: A concentration device for concentrating a liquid containing a target object, the concentration device including: a container configured to store the liquid containing the target object; a filter in the container; and a position control portion configured to change a position of the filter in the container.
    Type: Application
    Filed: February 8, 2022
    Publication date: May 26, 2022
    Inventors: Takashi KONDO, Shunsuke KITAMURA, Masamichi SHIKO, Takashi ITO, Satoshi MURATA
  • Method of manufacturing solid electrolytic capacitor, and solid electrolytic capacitor
    Patent number: 10032566
    Abstract: A method of manufacturing a solid electrolytic capacitor wherein a resistance increasing process is performed on at least one of a bonding portion of an anode lead terminal and a bonding portion of an anode in order to increase contact resistance between the anode lead terminal and the anode. Thereafter, the anode and the anode lead terminal are welded to each other by resistance welding at the bonding portions.
    Type: Grant
    Filed: June 5, 2015
    Date of Patent: July 24, 2018
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Takaharu Matsubara, Masamichi Shiko, Daisuke Kasahara
  • METHOD OF MANUFACTURING SOLID ELECTROLYTIC CAPACITOR, AND SOLID ELECTROLYTIC CAPACITOR
    Publication number: 20150357122
    Abstract: A method of manufacturing a solid electrolytic capacitor wherein a resistance increasing process is performed on at least one of a bonding portion of an anode lead terminal and a bonding portion of an anode in order to increase contact resistance between the anode lead terminal and the anode. Thereafter, the anode and the anode lead terminal are welded to each other by resistance welding at the bonding portions.
    Type: Application
    Filed: June 5, 2015
    Publication date: December 10, 2015
    Inventors: Takaharu Matsubara, Masamichi Shiko, Daisuke Kasahara
  • ELECTRONIC COMPONENT WITH LEAD WIRE
    Publication number: 20100066482
    Abstract: In an electronic component, first and second lead wires include coated portions and first and second metal wire exposed portions. The coated portions include metal wires that are coated with insulating members. Each of the first and second metal wire exposed portions have a flat shape. The first lead wire and the second lead wire are arranged parallel or substantially parallel to each other. The second lead wire is shorter than the first lead wire. The first metal wire exposed portion is soldered to the side surface folded portion of the terminal electrode. The second metal wire exposed portion is soldered to the side surface folded portion of the terminal electrode. The first and second metal wire exposed portions are located substantially in the same plane. A solder fillet is provided not only on the side surface folded portions, but also on end surface portions and in a gap.
    Type: Application
    Filed: August 13, 2009
    Publication date: March 18, 2010
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Masamichi SHIKO, Shingo OKUYAMA, Yuichi SHINOMIYA, Hideyuki SHIRAKI, Kazuo MIYAKE