Abstract: An apparatus for transporting an electronic component includes a head for holding the component when the component is picked up from a suitable storage device. The head is movable relative to a base with an imaging apparatus being fixed to the head and allowing position of the component relative to the head to be determined while the component is being transported. A movable optical component is provided on the head which, in one position, contributes to defining an optical path between the component and the imaging apparatus, and in another position, is withdrawn. A further imaging apparatus may be provided, on the base or on the head with the further imaging apparatus detecting the position of large components, if the first imaging apparatus has a narrow filed of view for small components. Alternatively, when the further imaging apparatus is on the head, the imaging apparatus may detect the position to which the component is to be transported.

Abstract: Method and apparatus for detecting vertical and horizontal deformations of leads of a semiconductor device by illuminating the leads with a planar light beam and determining relative positions of the planar light beam on the leads on the basis of distribution of light rays reflected from the leads. Different lead deformations can be detected with one and the same mechanism within a short time. By applying the invention to a semiconductor device mounting apparatus, a single detector can be employed in common both for the detection of the semiconductor device position and the detection of reflections of the planar beam.

Abstract: An electronic parts mounting device roughly turns a mounting head to which an electronic part is sucked in multiple actions in a plurality of steps in accordance with the direction in which the electronic part is to be mounted. Then, the attitude of the electronic part is detected and the mounting head is precisely turned in accordance with the results of the detection so as to correct the attitude of the electronic part so that the electronic part can be accurately mounted on a printed circuit board.