Patents by Inventor Masamitsu Okamura

Masamitsu Okamura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8774241
    Abstract: To constitute an optical module comprising a mount and a board that supports the mount, wherein a solid-state laser device that oscillates fundamental laser light, a pump light source that pumps the solid-state laser device, and a wavelength converting device that converts a wavelength of the fundamental laser light oscillated by the solid-state laser device are mounted on the mount, the mount is divided into three blocks, that is, a first block on which a laser medium is mounted, a second block on which the pump light source is mounted, and a third block on which the wavelength converting device is mounted. A side surface or a bottom surface of only the second block is fixed to the board, the first block is fixed to the other side surface of the second block, and the third block is fixed to a side surface of the first block.
    Type: Grant
    Filed: March 18, 2008
    Date of Patent: July 8, 2014
    Assignee: Mitsubishi Electric Corporation
    Inventors: Akira Nakamura, Masamitsu Okamura, Keiichi Fukuda, Chise Nanba, Kazutaka Ikeda
  • Patent number: 8265111
    Abstract: When a laser light source module includes a heat sink in which a solid laser element, an excitation light source, and a wavelength conversion element are arranged and a stem that supports the heat sink, wherein the heat sink is separated into three blocks, namely a first block including a laser oscillating unit for the solid laser element is arranged, a second block including a semiconductor laser element that emits excitation light for the laser oscillating unit and a first temperature sensor are arranged and on a specific surface of which the first heater is arranged, and a third block including the wavelength conversion element that converts the wavelength of the fundamental laser beam and a second temperature sensor are arranged and on a specific surface of which a second heater is arranged, enabling thus downsizing of the module and improvement of the positioning accuracy of the elements.
    Type: Grant
    Filed: March 18, 2008
    Date of Patent: September 11, 2012
    Assignee: Mitsubishi Electric Corporation
    Inventors: Motoaki Tamaya, Chise Nanba, Akira Nakamura, Keiichi Fukuda, Koji Funaoka, Manabu Kawakami, Masamitsu Okamura
  • Publication number: 20110026548
    Abstract: When a laser light source module includes a heat sink in which a solid laser element, an excitation light source, and a wavelength conversion element are arranged and a stem that supports the heat sink, wherein the heat sink is separated into three blocks, namely a first block including a laser oscillating unit for the solid laser element is arranged, a second block including a semiconductor laser element that emits excitation light for the laser oscillating unit and a first temperature sensor are arranged and on a specific surface of which the first heater is arranged, and a third block including the wavelength conversion element that converts the wavelength of the fundamental laser beam and a second temperature sensor are arranged and on a specific surface of which a second heater is arranged, enabling thus downsizing of the module and improvement of the positioning accuracy of the elements.
    Type: Application
    Filed: March 18, 2008
    Publication date: February 3, 2011
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Motoaki Tamaya, Chise Nanba, Akira Nakamura, Keiichi Fukuda, Koji Funaoka, Manabu Kawakami, Masamitsu Okamura
  • Publication number: 20100309946
    Abstract: To constitute an optical module comprising a mount and a board that supports the mount, wherein a solid-state laser device that oscillates fundamental laser light, a pump light source that pumps the solid-state laser device, and a wavelength converting device that converts a wavelength of the fundamental laser light oscillated by the solid-state laser device are mounted on the mount, the mount is divided into three blocks, that is, a first block on which a laser medium is mounted, a second block on which the pump light source is mounted, and a third block on which the wavelength converting device is mounted. A side surface or a bottom surface of only the second block is fixed to the board, the first block is fixed to the other side surface of the second block, and the third block is fixed to a side surface of the first block.
    Type: Application
    Filed: March 18, 2008
    Publication date: December 9, 2010
    Applicant: Mitsubishi Electric Corporation
    Inventors: Akira Nakamura, Masamitsu Okamura, Keiichi Fukuda, Chise Nanba, Kazutaka Ikeda
  • Patent number: 6497082
    Abstract: A sandwich panel is manufactured-by providing: a first step (a), (b) of attaching another end portion of an insert 1 whose one end portion is made sharp to an inner side of a facing member 2 in which a hole is cut in advance; a second step (c) of pressing the insert 1 into the core member 4 such that the one end portion of the insert 1 force-cuts a core member 4; and a third step (d) of attaching another facing member 2 to a side of the core member 4 opposing the insert-inserting side thereof.
    Type: Grant
    Filed: March 13, 2000
    Date of Patent: December 24, 2002
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Norihiko Toyoda, Masamitsu Okamura, Hiroshi Takayama, Toshiaki Kunugi, Masakatsu Kawasaki
  • Patent number: 5879840
    Abstract: A film-forming method and an apparatus for a X-ray mask and a film-forming apparatus which are able to diminish stress unevenness in the X-ray mask to zero when a X-ray absorber is formed on a mask substrate by sputtering a target 3 during rotation of the mask substrate. Firstly, a dummy mask substrate is prepared instead of a mask substrate. A dummy X-ray absorber 6 is formed on this dummy X-ray substrate 5 within a sputtering range. Secondly, a stress distribution is measured at every position along a straight line passing through a center of the dummy X-ray absorber 6 and then a desirable stress distribution range X is selected at such a location so as to have a good linear characteristic in a portion of a compressive stress curve which decreases toward an outer periphery of the dummy X-ray absorber 6 in the stress distribution.
    Type: Grant
    Filed: August 1, 1997
    Date of Patent: March 9, 1999
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Hideki Yabe, Kaeko Kitamura, Masao Kouhashi, Masamitsu Okamura, Kei Sasaki
  • Patent number: 5749760
    Abstract: An electron gun assembling apparatus has a cathode driving mechanism (12,13) for moving a cathode (1), a laser displacement gage (14) to measure a height of a surface of the cathode (1) in a non-contact manner at a cathode surface measuring position outside an electron gun assembly (24), an electric micrometer (11) to measure a height of an upper surface of a first electrode (3) in the electron gun assembly (24), and an electric micrometer (8) to measure a height of a lower surface of a second electrode (4) in the electron gun assembly (24).
    Type: Grant
    Filed: July 25, 1996
    Date of Patent: May 12, 1998
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Yasuki Kimura, Takashi Shirase, Masamitsu Okamura, Shuichi Maezono