Patents by Inventor Masamori Sanaka

Masamori Sanaka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHOD AND APPARATUS FOR LAMP HOUSING CRACK DETECTION
    Publication number: 20240027295
    Abstract: Methods and apparatus for lamp housing crack detection are provided herein. For example, a method associated with a process chamber having a lamp housing comprises sequentially processing a plurality of substrates in the process chamber, during processing of the plurality of substrates, collecting lamp housing data indicative of a fluid leak in the lamp housing from a sensor operably connected to the lamp housing of the process chamber, determining from the lamp housing data whether lamp housing crack is present, and responsive to determining lamp housing crack is present, at least one of triggering an alert or stopping processing of the process chamber.
    Type: Application
    Filed: July 19, 2022
    Publication date: January 25, 2024
    Inventors: Philip MATHEW, Mehran BEHDJAT, Masamori SANAKA, Koji NAKANISHI, Ryan MURDOCH, Mark David JOHNSON, Jun QIAN, Yuchun CHANG, George GOVEL
  • Method of determining thermal property of substrate and method of deciding heat treatment condition
    Patent number: 8308350
    Abstract: [Problem] To provide a method that can determine a thermal property of a substrate in a short time and a method that can determine a thermal process condition of an open-loop step. [Solving Means] In accordance with the substrate thermal property determining method of the present invention in a rapid thermal processing apparatus 1 comprising lamps 9 for heating a wafer W and temperature sensors T1 to T7 arranged so as to oppose the lamps 9, temperature data sequentially outputted from the temperature sensors T1 to T7 is obtained, while subjecting the wafer W arranged between the lamps 9 and temperature sensors T1 to T7 to pulsed heating with the lamps 9. Thereafter, the thermal property of the wafer W is determined by using the temperature data.
    Type: Grant
    Filed: August 9, 2005
    Date of Patent: November 13, 2012
    Assignee: Applied Materials, Inc.
    Inventors: Yoichiro Yasuda, Toshiyuki Tsukamoto, Masamori Sanaka, Hiroshi Asechi, Atsuhiro Ogura
  • Method Of Determining Thermal Property Of Substrate And Method Of Deciding Heat Treatment Condition
    Publication number: 20070291818
    Abstract: [Problem] To provide a method that can determine a thermal property of a substrate in a short time and a method that can determine a thermal process condition of an open-loop step. [Solving Means] In accordance with the substrate thermal property determining method of the present invention in a rapid thermal processing apparatus 1 comprising lamps 9 for heating a wafer W and temperature sensors T1 to T7 arranged so as to oppose the lamps 9, temperature data sequentially outputted from the temperature sensors T1 to T7 is obtained, while subjecting the wafer W arranged between the lamps 9 and temperature sensors T1 to T7 to pulsed heating with the lamps 9. Thereafter, the thermal property of the wafer W is determined by using the temperature data.
    Type: Application
    Filed: August 9, 2005
    Publication date: December 20, 2007
    Applicant: APPLIED MATERIALS INC.
    Inventors: Yoichiro Yasuda, Toshiyuki Tsukamoto, Masamori Sanaka, Hiroshi Asechi, Atsuhiro Ogura