Patents by Inventor Masanao Araki

Masanao Araki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Lead frame and a resin-sealed semiconductor device exhibiting improved resin balance, and a method for manufacturing the same
    Patent number: 6828661
    Abstract: A lead frame has a die pad portion supported internally of a framework portion by suspension leads and a plurality of leads each having one end connected to the framework portion and the other end opposed to the die pad portion. The die pad portion has a holding region formed from a part of an upper surface of the die pad portion which has been elevated above the remaining part of the upper surface. Openings are formed in the holding region to extend therethrough in a front-to-back direction of the die pad portion.
    Type: Grant
    Filed: May 24, 2002
    Date of Patent: December 7, 2004
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Masanao Araki, Hideo Uchida, Takashi Ono
  • Lead frame, resin-sealed semiconductor device, and method for fabricating the same
    Publication number: 20030001244
    Abstract: A lead frame has a die pad portion supported internally of a framework portion by suspension leads and a plurality of leads each having one end connected to the framework portion and the other end opposed to the die pad portion. The die pad portion has a holding region formed from a part of an upper surface of the die pad portion which has been elevated above the remaining part of the upper surface. Openings are formed in the holding region to extend therethrough in a front-to-back direction of the die pad portion.
    Type: Application
    Filed: May 24, 2002
    Publication date: January 2, 2003
    Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
    Inventors: Masanao Araki, Hideo Uchida, Takashi Ono