Abstract: A solid-state image pickup device includes plural pixels, a voltage generator that generates a reference voltage, plural comparators that are aligned in one direction, and compare respective voltages output from the pixels with the reference voltage, a counter that counts in tandem with a change in the reference voltage generated by the voltage generator, plural buffer circuits that are connected in series with the counter, and each sequentially receives an output of the counter; plural latch circuits that take in a value input to an input terminal thereof according to respective trigger signals output from the comparators, a common signal line that is commonly connected to respective inputs of the latch circuits, and plural signal lines that are connected to respective outputs of the buffer circuits, and allow the output of the counter to propagate therethrough.

Abstract: A solid-state image pickup device includes plural pixels, a voltage generator that generates a reference voltage, plural comparators that are aligned in one direction, and compare respective voltages output from the pixels with the reference voltage, a counter that counts in tandem with a change in the reference voltage generated by the voltage generator, plural buffer circuits that are connected in series with the counter, and each sequentially receives an output of the counter; plural latch circuits that take in a value input to an input terminal thereof according to respective trigger signals output from the comparators, a common signal line that is commonly connected to respective inputs of the latch circuits, and plural signal lines that are connected to respective outputs of the buffer circuits, and allow the output of the counter to propagate therethrough.

Abstract: An internal power supply potential generation circuit includes an overcharge prevention circuit connected to an internal power supply node. The overcharge prevention circuit includes a circuit outputting a signal to be determined that is determined by an internal power supply potential, a differential amplification circuit amplifying a difference in potential between the signal to be determined and a reference potential for output to a node as a signal indicating that current should be drawn, and a current draw circuit drawing current from the internal power supply node in response to the signal indicating that current should be drawn. Thus the semiconductor integrated circuit device of interest can provide a steady internal power supply potential.

Abstract: In the present laser illumination method, laser radiation can illuminate a Cu fuse layer in a direction traversing a longitudinal direction of the Cu fuse layer to allow the laser radiation to illuminate a single location continuously without dispersing its energy. As a result the fuse layer can effectively be heated and completely be cut.

Abstract: An internal power supply potential generation circuit includes an overcharge prevention circuit connected to an internal power supply node. The overcharge prevention circuit includes a circuit outputting a signal to be determined that is determined by an internal power supply potential, a differential amplification circuit amplifying a difference in potential between the signal to be determined and a reference potential for output to a node as a signal indicating that current should be drawn, and a current draw circuit drawing current from the internal power supply node in response to the signal indicating that current should be drawn. Thus the semiconductor integrated circuit device of interest can provide a steady internal power supply potential.

Abstract: First and second memory banks are provided with M memory blocks each having first and second memory regions, M representing an even number of no less than two, and (M+1) sense amplifier bands arranged on opposite sides of each memory block, and have first and second select lines arranged therefor to select the first and second memory regions, respectively, the first select line being connected to an odd-numbered sense amplifier band of the first memory bank and an even-numbered sense amplifier band of the second memory bank, the second select line being connected to an even-numbered sense amplifier band of the first memory bank and an odd-numbered sense amplifier band of the second memory bank.

Abstract: A first power supply voltage is supplied to a power supply node of a sense amplifier. A bit line driver outputs a column select signal composed of a second power supply voltage to the gate terminals of N channel MOS transistors of a GIO line gate circuit. When input/output data is [1], a third power supply voltage lower than the first power supply voltage is supplied onto a global data line. In this case, with a threshold voltage of N channel MOS transistors used, a relation is established: second power supply voltage≦third power supply voltage+threshold voltage. As a result, a leakage current can be reduced in a semiconductor memory device driven by plural power supply voltages with respective different voltage levels.

Abstract: Burst pressure P of an insulating layer positioned immediately on a fuse layer is defined by using planar width W of fuse layer and thickness t of insulating layer. The value of the planar width W of fuse layer and the value of the thickness t of insulating layer are set such that the value of burst pressure P is at most about 1000 kg/cm.sup.2. The value of the thickness t and the value of the planar width W are set such that the value t/W is at least 0.45 and at most 0.91. Consequently, stable fuse blowing becomes possible while reducing manufacturing cost.