Abstract: A laminated wiring board comprising: a first wiring board forming wiring layers on the upper surface and on the lower surface of a first ceramic insulated substrate; and a second wiring board forming wiring layers on the upper surface and on the lower surface of a second ceramic insulated substrate; the wiring layer on the lower surface of the first wiring board and the wiring layer on the upper surface of the second wiring board being connected together through connecting electrodes; wherein a coefficient ?1 of thermal expansion of the first ceramic insulated substrate at 0 to 150° C. and a coefficient ?2 of thermal expansion of the second ceramic insulated substrate at 0 to 150° C. are satisfying the following conditions: ?1<?2 ?2??1?9×10?6/° C.

Abstract: A laminated wiring board comprising: a first wiring board forming wiring layers on the upper surface and on the lower surface of a first ceramic insulated substrate; and a second wiring board forming wiring layers on the upper surface and on the lower surface of a second ceramic insulated substrate; the wiring layer on the lower surface of the first wiring board and the wiring layer on the upper surface of the second wiring board being connected together through connecting electrodes; wherein a coefficient ?1 of thermal expansion of the first ceramic insulated substrate at 0 to 150° C. and a coefficient ?2 of thermal expansion of the second ceramic insulated substrate at 0 to 150° C. are satisfying the following conditions: ?1<?2 ?2??1?9×10?6/° C.

Abstract: Disclosed is a glass ceramic sintered product which contains as crystal phases: (i) a gahnite crystal phase; (ii) a celsian crystal phase containing needle-like crystals having an aspect ratio of not smaller than 3; and (iii) at least one kind of crystal phase selected from the group consisting of AlN, Si3N4, SiC, Al2O3, ZrO2, 3Al2O3.2SiO2 and Mg2SiO4; and has an open porosity of not larger than 0.3%. The glass ceramic sintered product is highly strong, has a high heat conductivity, a high Young's modulus, is dense, and can be produced through the firing at a low temperature of not higher than 1000° C., and is very useful as an insulating substrate that has wiring layers of a low-resistance conductor such as Cu, Ag or Au on the surface thereof or in the inside thereof.

Abstract: A ceramic wiring board provided with an insulating layer of a high dielectric constant formed of a ceramic sintered product having a high dielectric constants wherein the ceramic sintered product contains a crystal phase of lanthanum titanate and a glass phase present on the grain boundaries of the crystal phase, and has a coefficient of thermal expansion at 40 to 400° C. of not smaller than 8×10−6/° C. and a specific inductive capacity at 1 MHz of not smaller than 10. The wiring board contains a capacitor and is very useful in realizing various electric circuit devices in small sizes, and can be further reliably mounted on a printed board that uses an organic resin as an insulating material.

Abstract: Disclosed is a glass ceramic sintered product which contains as crystal phases:

Abstract: A ceramic wiring board provided with an insulating layer of a high dielectric constant formed of a ceramic sintered product having a high dielectric constants wherein the ceramic sintered product contains a crystal phase of lanthanum titanate and a glass phase present on the grain boundaries of the crystal phase, and has a coefficient of thermal expansion at 40 to 400° C. of not smaller than 8×10−6/° C. and a specific inductive capacity at 1 MHz of not smaller than 10. The wiring board contains a capacitor and is very useful in realizing various electric circuit devices in small sizes, and can be further reliably mounted on a printed board that uses an organic resin as an insulating material.

Abstract: A structure for mounting a wiring board in which the wiring board including a ceramics insulating board, metallized wiring layers arranged on said insulating board, and a plurality of connection terminals mounted on said insulating board and electrically connected to said metallized wiring layer, is placed on a mother board having wiring conductors formed on the surface of an insulator which contains an organic resin, and the connection terminals of said wiring board are connected by brazing to the wiring conductors of said mother board, wherein a value F1 defined by the following formula (1):F1=L.times..DELTA..alpha./H.sup.2 (1)wherein L is a distance (mm) between the two connection terminals which are most separated away from each other among a plurality of connection terminals mounted on said insulating board, .DELTA..alpha. is a difference in the coefficient of thermal expansion (ppm/.degree. C.) between the insulating board of said wiring board and said mother board at 40 to 400.degree. C.