Abstract: A radio-frequency module includes a hybrid filter for 5th Generation New Radio (5G-NR) n77, a filter for 5G-NR n79, power amplifiers, a third inductor coupled to the power amplifier, and a fourth inductor coupled to a power amplifier. When a module substrate is viewed in plan view, the power amplifiers are disposed in a first quadrant, the third inductor and the fourth inductor are disposed in a second quadrant, the hybrid filter and the filter are disposed in a third quadrant, the power amplifier is disposed closer to a reference point than the power amplifier, the third inductor is disposed closer to the reference point than the fourth inductor, and the hybrid filter is disposed closer to the reference point than the filter.

Abstract: A radio-frequency module includes a module substrate, a hybrid filter for 5th Generation New Radio (5G-NR) n77 including a first acoustic wave resonator element, a first inductor, and a first capacitor, a filter for 5G-NR n79 including a second acoustic wave resonator element and a second inductor, power amplifiers, a third inductor coupled between the power amplifier and the hybrid filter, and a fourth inductor coupled between the power amplifier and the filter. The first inductor, the second inductor, the third inductor, and the fourth inductor are disposed at a major surface or inside the module substrate. The distance between the first inductor and the third inductor is larger than the distance between the second inductor and the fourth inductor.

Abstract: A radio-frequency module includes a module substrate having main surfaces opposite to each other, a hybrid filter having a first acoustic wave resonator, a first inductor, and a first capacitor, a switch for connecting and disconnecting an antenna connection terminal and the hybrid filter, and a coupler disposed on a path linking the antenna connection terminal and the switch. The first acoustic wave resonator is disposed on the main surface, the switch is included in a semiconductor IC disposed on the main surface, the coupler is disposed inside the module substrate, and in plan view of the module substrate, the semiconductor IC at least partially overlaps the first acoustic wave resonator, and the semiconductor IC and the coupler at least partially overlaps.

Abstract: A radio-frequency module includes a module substrate having main surfaces opposite to each other, a hybrid filter having a first acoustic wave resonator, a first inductor, and a first capacitor, and a first radio-frequency component, wherein a pass band width of the hybrid filter is greater than a resonant band width of the first acoustic wave resonator, one of the first acoustic wave resonator, the first inductor, and the first capacitor is disposed on the main surface, and the first radio-frequency component is disposed on the main surface.

Abstract: A high-frequency module is capable of two-uplink of a transmission signal in Band A and transmission of Band C, and includes a module substrate, a metal shield plate arranged on a principal surface, power amplifiers, a transmission filter of Band A, and a transmission filter of Band C. In a plan view, the metal shield plate is arranged between a first transmission component and a second transmission component. The first transmission component is one of the power amplifier, the transmission filter, a switch circuit, and a first inductor and a first capacitor arranged in a first transmission path, and the second transmission component is one of the power amplifier, the transmission filter, a switch circuit, and a second inductor and a second capacitor arranged in a second transmission path.

Abstract: A hybrid filter includes a module substrate having a major surface and a major surface that are opposite to each other, acoustic wave resonator elements disposed at the module substrate, inductors disposed at the module substrate, and a capacitor disposed at the module substrate. The pass band of the hybrid filter is wider than the resonance band width of the acoustic wave resonator elements. One of the acoustic wave resonator elements, the inductors, and the capacitor is a first circuit element, and the first circuit element is disposed at the major surface. Another of the acoustic wave resonator elements, the inductors, and the capacitor is a second circuit element, and the second circuit element is disposed at the major surface.

Abstract: A radio frequency circuit includes a transmit filter for B66-Tx connected to a power amplifier, a transmit filter for B25-Tx connected to a power amplifier, a switch circuit having terminals, a switch circuit having a common terminal and terminals, and a switch circuit having a common terminal and terminals. The terminal is connected to the common terminal, the terminal is connected to the common terminal, the terminal is connected to the transmit filter, and the terminal is connected to the transmit filter. The switch circuit has a smaller stack number than the switch circuit, and the switch circuit has a smaller stack number than the switch circuit.

Abstract: A first filter is prevented from being affected by the coplanarity of a mounting substrate and a degradation of the filter characteristics of the first filter is reduced. A first filter, a second filter, a third filter, and a first switch are mounted on a first principal surface of a mounting substrate. The first filter passes a first high-frequency signal and a second high-frequency signal, the second filter passes a third high-frequency signal, and the third filter passes a fourth high-frequency signal. The first switch is capable of simultaneously connecting the first filter and the second filter to an antenna terminal. In a plan view from a thickness direction of the mounting substrate, the first filter is larger than the second filter and the third filter and located between the second filter and the third filter. A first wire and a second wire are each shorter than a third wire.

Abstract: A radio frequency module, capable of simultaneously transporting a transmission signal in a communication band B for TDD and a reception signal in a communication band A for FDD, includes a filter connected to an antenna connection terminal and having a pass band, the communication band B, a filter connected to the antenna connection terminal and having a pass band, a reception band of the communication band A, a switch to change over between the filter and a transmission input terminal to receive a transmission signal in the communication band B from an outside and the filter and a reception output terminal to supply a reception signal in the communication band B to the outside, and a band elimination filter connected between the transmission input terminal and the switch and having a stop band including the reception band of the communication band A.

Abstract: A radio frequency module includes: a radio frequency input terminal for receiving an amplified transmission signal from the outside; radio frequency output terminals for supplying a reception signal to the outside; a filter connected between the radio frequency input terminal/the radio frequency output terminal and an antenna connection terminal, and having a passband including communication band D for TDD; and a filter connected between the radio frequency output terminal and the antenna connection terminal and having a passband including at least part of communication band A allowed for simultaneous communication with communication band D. The radio frequency input terminal is arranged in a region extending along a side of the module substrate, and the radio frequency output terminal is arranged in a region extending along a side facing the side of the module substrate.

Abstract: A radio frequency (RF) module including a module substrate; a filter with a passband including communication band for TDD; a switch connected to the filter; a power amplifier that is arranged on a first surface of the module substrate and connected to the filter via the switch; a low-noise amplifier that is arranged on a second surface of the module substrate and connected to the filter via the switch; a filter with a passband including communication band; a low-noise amplifier that is arranged on the second surface and connected to the filter; and a conductive member arranged between the low-noise amplifiers on the second surface.

Abstract: A high-frequency circuit includes: a diplexer that is composed of a filter which has a pass band including a first frequency band group and a filter which has a pass band including a second frequency band group; a notch filter that is connected with the filter and whose stop band is a frequency band which is not included in a first communication band; a notch filter that is connected with the filter and whose stop band is a frequency band which is not included in a second communication band; and switches that are connected with the notch filters. A band pass filter whose pass band is the first communication band and a band pass filter whose pass band is the second communication band are not connected between the filter and the switches.

Abstract: A radio frequency (RF) module including a module substrate; a filter with a passband including communication band for TDD; a switch connected to the filter; a power amplifier that is arranged on a first surface of the module substrate and connected to the filter via the switch; a low-noise amplifier that is arranged on a second surface of the module substrate and connected to the filter via the switch; a filter with a passband including communication band; a low-noise amplifier that is arranged on the second surface and connected to the filter; and a conductive member arranged between the low-noise amplifiers on the second surface.