Patents by Inventor Masanari Seki

Masanari Seki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device
    Patent number: 11769715
    Abstract: The semiconductor device of the present embodiment includes a lead frame having a projection portion, the projection portion having an upper face and a side face, a semiconductor chip provided above the projection portion, and a bonding material provided between the projection portion and the semiconductor chip, the bonding material being in contact with the upper face and the side face, the bonding material bonding the lead frame and the semiconductor chip.
    Type: Grant
    Filed: April 22, 2022
    Date of Patent: September 26, 2023
    Assignees: Kabushiki Kaisha Toshiba, Toshiba Electronic Devices & Storage Corporation
    Inventors: Masanari Seki, Daisuke Koike, Masahiko Hori
  • SEMICONDUCTOR DEVICE
    Publication number: 20220246504
    Abstract: The semiconductor device of the present embodiment includes a lead frame having a projection portion, the projection portion having an upper face and a side face, a semiconductor chip provided above the projection portion, and a bonding material provided between the projection portion and the semiconductor chip, the bonding material being in contact with the upper face and the side face, the bonding material bonding the lead frame and the semiconductor chip.
    Type: Application
    Filed: April 22, 2022
    Publication date: August 4, 2022
    Inventors: Masanari Seki, Daisuke Koike, Masahiko Hori
  • Semiconductor device
    Patent number: 11342249
    Abstract: The semiconductor device of the present embodiment includes a lead frame having a projection portion, the projection portion having an upper face and a side face, a semiconductor chip provided above the projection portion, and a bonding material provided between the projection portion and the semiconductor chip, the bonding material being in contact with the upper face and the side face, the bonding material bonding the lead frame and the semiconductor chip.
    Type: Grant
    Filed: February 10, 2020
    Date of Patent: May 24, 2022
    Assignees: KABUSHIKI KAISHA TOSHIBA, TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
    Inventors: Masanari Seki, Daisuke Koike, Masahiko Hori
  • SEMICONDUCTOR DEVICE
    Publication number: 20210074611
    Abstract: The semiconductor device of the present embodiment includes a lead frame having a projection portion, the projection portion having an upper face and a side face, a semiconductor chip provided above the projection portion, and a bonding material provided between the projection portion and the semiconductor chip, the bonding material being in contact with the upper face and the side face, the bonding material bonding the lead frame and the semiconductor chip.
    Type: Application
    Filed: February 10, 2020
    Publication date: March 11, 2021
    Inventors: Masanari Seki, Daisuke Koike, Masahiko Hori