Patents by Inventor Masanobu Azukawa

Masanobu Azukawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Physical quantity sensor and method of making the same
    Patent number: 9366534
    Abstract: A physical quantity sensor includes a sensor portion, a casing, and a vibration isolator. The casing includes a supporting portion with a supporting surface that is located to face an end surface of the sensor portion. The vibration isolator is located between the end surface of the sensor portion and the supporting surface of the casing to join the sensor portion to the casing. The vibration isolator reduces a relative vibration between the sensor portion and the casing.
    Type: Grant
    Filed: October 31, 2013
    Date of Patent: June 14, 2016
    Assignees: DENSO CORPORATION, TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Tameharu Ohta, Tetsuo Fujii, Masanobu Azukawa, Takeshi Ito, Itaru Ishii
  • PHYSICAL QUANTITY SENSOR AND METHOD OF MAKING THE SAME
    Publication number: 20140053648
    Abstract: A physical quantity sensor includes a sensor portion, a casing, and a vibration isolator. The casing includes a supporting portion with a supporting surface that is located to face an end surface of the sensor portion. The vibration isolator is located between the end surface of the sensor portion and the supporting surface of the casing to join the sensor portion to the casing. The vibration isolator reduces a relative vibration between the sensor portion and the casing.
    Type: Application
    Filed: October 31, 2013
    Publication date: February 27, 2014
    Applicants: TOYOTA JIDOSHA KABUSHIKI KAISHA, DENSO CORPORATION
    Inventors: Tameharu OHTA, Tetsuo FUJII, Masanobu AZUKAWA, Takeshi ITO, Itaru ISHII
  • Physical quantity sensor and method of making the same
    Patent number: 8601871
    Abstract: A physical quantity sensor includes a sensor portion, a casing, and a vibration isolator. The casing includes a supporting portion with a supporting surface that is located to face an end surface of the sensor portion. The vibration isolator is located between the end surface of the sensor portion and the supporting surface of the casing to join the sensor portion to the casing. The vibration isolator reduces a relative vibration between the sensor portion and the casing.
    Type: Grant
    Filed: December 12, 2012
    Date of Patent: December 10, 2013
    Assignees: DENSO CORPORATION, Toyota Jidosha Kabushiki Kaisha
    Inventors: Tameharu Ohta, Tetsuo Fujii, Masanobu Azukawa, Takeshi Ito, Itaru Ishii
  • Physical quantity sensor
    Patent number: 8359923
    Abstract: A physical quantity sensor includes a sensor portion, a casing, and a vibration isolator. The casing includes a supporting portion with a supporting surface that is located to face an end surface of the sensor portion. The vibration isolator is located between the end surface of the sensor portion and the supporting surface of the casing to join the sensor portion to the casing. The vibration isolator reduces a relative vibration between the sensor portion and the casing.
    Type: Grant
    Filed: December 21, 2010
    Date of Patent: January 29, 2013
    Assignees: Denso Corporation, Toyota Jidosha Kabushiki Kaisha
    Inventors: Tameharu Ohta, Tetsuo Fujii, Masanobu Azukawa, Takeshi Ito, Itaru Ishii
  • System and method for removing foreign particles from semiconductor device
    Patent number: 8141570
    Abstract: A vibration device separates foreign particles from a semiconductor device, and a suction interface of a suction device covers an opening portion of the semiconductor device. A space connected with a vacuum passage and a communication passage is formed between the semiconductor device and the suction interface. The suction device suctions the space, and fresh air is introduced into the space through the communication passage. As a result, a current of air is generated from the communication passage to the vacuum passage, and foreign particles are suctioned and removed from the space.
    Type: Grant
    Filed: February 22, 2007
    Date of Patent: March 27, 2012
    Assignee: DENSO CORPORATION
    Inventors: Yuta Hasebe, Hiroshi Tanaka, Masanobu Azukawa, Junichi Tanaka, Tadashi Kobayashi, Kenta Iwahana
  • Physical quantity sensor and method of making the same
    Publication number: 20110094303
    Abstract: A physical quantity sensor includes a sensor portion, a casing, and a vibration isolator. The casing includes a supporting portion with a supporting surface that is located to face an end surface of the sensor portion. The vibration isolator is located between the end surface of the sensor portion and the supporting surface of the casing to join the sensor portion to the casing. The vibration isolator reduces a relative vibration between the sensor portion and the casing.
    Type: Application
    Filed: December 21, 2010
    Publication date: April 28, 2011
    Applicant: DENSO CORPORATION
    Inventors: Tameharu Ohta, Tetsuo Fujii, Masanobu Azukawa, Takeshi Ito, Itaru Ishii
  • Method of making a physical quantity sensor
    Patent number: 7891244
    Abstract: A physical quantity sensor includes a sensor portion, a casing, and a vibration isolator. The casing includes a supporting portion with a supporting surface that is located to face an end surface of the sensor portion. The vibration isolator is located between the end surface of the sensor portion and the supporting surface of the casing to join the sensor portion to the casing. The vibration isolator reduces a relative vibration between the sensor portion and the casing.
    Type: Grant
    Filed: May 12, 2009
    Date of Patent: February 22, 2011
    Assignee: DENSO CORPORATION
    Inventors: Tameharu Ohta, Tetsuo Fujii, Masanobu Azukawa, Takeshi Ito, Itaru Ishii
  • Physical quantity sensor and method of making the same
    Publication number: 20090282915
    Abstract: A physical quantity sensor includes a sensor portion, a casing, and a vibration isolator. The casing includes a supporting portion with a supporting surface that is located to face an end surface of the sensor portion. The vibration isolator is located between the end surface of the sensor portion and the supporting surface of the casing to join the sensor portion to the casing. The vibration isolator reduces a relative vibration between the sensor portion and the casing.
    Type: Application
    Filed: May 12, 2009
    Publication date: November 19, 2009
    Applicant: DENSO CORPORATION
    Inventors: Tameharu Ohta, Tetsuo Fujii, Masanobu Azukawa, Takeshi Ito, Itaru Ishii
  • System and method for removing foreign particles from semiconductor device
    Publication number: 20070199580
    Abstract: A vibration device separates foreign particles from a semiconductor device, and a suction interface of a suction device covers an opening portion of the semiconductor device. A space connected with a vacuum passage and a communication passage is formed between the semiconductor device and the suction interface. The suction device suctions the space, and fresh air is introduced into the space through the communication passage. As a result, a current of air is generated from the communication passage to the vacuum passage, and foreign particles are suctioned and removed from the space.
    Type: Application
    Filed: February 22, 2007
    Publication date: August 30, 2007
    Applicant: DENSO CORPORATION
    Inventors: Yuta Hasebe, Hiroshi Tanaka, Masanobu Azukawa, Junichi Tanaka, Tadashi Kobayashi, Kenta Iwahana