Abstract: The radar device comprises: a transmission unit that transmits, to an object, a transmission wave; a reception unit that receives a reflected wave, and generates a reception signal; and an object detection unit that acquires information relating to the object on the basis of the transmission signal and the reception signal. The object detection unit calculates, for each of a plurality of detection points within the same object: an azimuth angle ? indicating the azimuth of the detection point with respect to the radar device; and a velocity component V(?) of the relative velocity A of the object along the azimuth. The object detection unit derives a relational expression for the azimuth angle ? and the velocity component V(?), and derives a movement angle ? (=?/2??) indicating the movement direction of the object from the azimuth angle ? when V(?)=0.

Abstract: A signal processing device includes a mixer 6 to perform frequency conversion of a received high-frequency signal into an intermediate-frequency signal corresponding to signal components of a desired channel, an ADC 8 to convert the intermediate-frequency signal into a digital signal, and a digital demodulation unit 300 to demodulate the digital signal. The demodulation unit 300 includes a band limiting filter 9 to switch a pass band for the digital signal, and a detecting unit 10 to detect a power distribution of the signal components of the desired channel and a power distribution of signal components of a neighboring channel adjacent to the desired channel from the digital signal before being input to the filter 9, wherein the pass band of the filter 9 is switched to a pass band selected based on the power distributions of the desired and neighboring channels detected by the detecting unit 10.

Abstract: An encapsulating epoxy resin molding material comprising (A) an epoxy resin, (B) a curing agent, and (C) a silane coupling agent having a secondary amino group or (D) a phosphate, and semiconductor devices encapsulated therein. The encapsulating epoxy resin molding material for thin semiconductor devices according to this invention is excellent in fluidity, and the semiconductor device encapsulated therein, which is a semiconductor device having a semiconductor chip arranged on a thin, multi-pin, long wire, narrow-pad-pitch, or on a mounted substrate such as organic substrate or organic film, is free of molding defects such as wire sweep, voids etc. as shown in the Examples, and thus its industrial value is significant.

Abstract: An encapsulating epoxy resin molding material comprising (A) an epoxy resin, (B) a curing agent, and (C) a silane coupling agent having a secondary amino group or (D) a phosphate, and semiconductor devices encapsulated therein. The encapsulating epoxy resin molding material for thin semiconductor devices according to this invention is excellent in fluidity, and the semiconductor device encapsulated therein, which is a semiconductor device having a semiconductor chip arranged on a thin, multi-pin, long wire, narrow-pad-pitch, or on a mounted substrate such as organic substrate or organic film, is free of molding defects such as wire sweep, voids etc. as shown in the Examples, and thus its industrial value is significant.

Abstract: In a flexible printed circuit (10) for electrically connecting between a fixed portion and a movable portion comprising a flexible base layer (11), a conductive layer (13) formed on a principal surface (11a) of the flexible base layer through a first adhesive agent (12), and a cover lay (15) formed on the conductive layer through a second adhesive agent (14), copper foil (22) is pasted on an upper surface (15a) of the cover lay through a conductive adhesive agent (21). The copper foil is electrically connected to a ground portion (110) using solder. The fixed portion may be an optical disc drive's body (300). The movable portion may be an optical pickup unit (100) comprising an electromagnetic radiation source (200). The copper foil is for shielding electromagnetic noises radiated from the electromagnetic radiation source. The copper foil may be disposed only the vicinity of the electromagnetic radiation source.

Abstract: An encapsulating epoxy resin molding material comprising (A) an epoxy resin, (B) a curing agent, and (C) a silane coupling agent having a secondary amino group or (D) a phosphate, and semiconductor devices encapsulated therein.

Abstract: In a flexible printed circuit (10) for electrically connecting between a fixed portion and a movable portion comprising a flexible base layer (11), a conductive layer (13) formed on a principal surface (11a) of the flexible base layer through a first adhesive agent (12), and a cover lay (15) formed on the conductive layer through a second adhesive agent (14), copper foil (22) is pasted on an upper surface (15a) of the cover lay through a conductive adhesive agent (21). The copper foil is electrically connected to a ground portion (110) using solder. The fixed portion may be an optical disc drive's body (300). The movable portion may be an optical pickup unit (100) comprising an electromagnetic radiation source (200). The copper foil is for shielding electromagnetic noises radiated from the electromagnetic radiation source. The copper foil may be disposed only the vicinity of the electromagnetic radiation source.

Abstract: An LOC structure semiconductor device having a good solder heat resistance without electrical characteristic failures due to damages to the passivation film and the diffusion layer thereunder attributing to the filler can be obtained by encapsulating an LOC structure semiconductor chip with an encapsulating material comprising an epoxy resin, a curing agent, a curing promoter, and an inorganic filler, the filler having a smaller particle size than the distance between a inner lead and a semiconductor chip and being in an amount of 80 to 95% by weight based on the total weight of the encapsulating material.

Abstract: An epoxy resin composition comprises (A) a biphenyl epoxy resin, (B) a phenolic resin curing agent having a naphthalene structure, (C) a curing accelerator comprising an addition product of a triphenylphosphine and benzoquinone, and (D) an inorganic filler contained in an amount of 85 to 95% by weight based on the total amount of the composition, and a semiconductor device encapsulated by this resin composition.

Abstract: A seat arrangement comprises first, second, and third groups of seats arranged lengthwise in order on a vehicle floor. Each of the second and third groups of seats includes left and right side seats arranged abreast with a center space defined therebetween. A rail structure extends longitudinally between the center space of the second group of seats and that of the third group of seats. A center seat is slidably mounted on the rail structure, so that the center seat can move between a front position where the center seat is positioned between the side seats of the second group of seats and a rear position wherein the center seat is put between the side seats of the third group of seats.

Abstract: Disclosed herein is a method of producing a trim board, which comprises by steps: (a) hot-pressing trimming and piercing a resin-impregnated substrate at the same time to produce a shaped substrate; (b) laying an outer skin member onto one surface of the shaped substrate with an interposal of a hot-melt sheet therebetween; (c) pressing the outer skin member against the shaped substrate while the shaped substrate is still hot, thereby to produce a skin covered unfinished trim board; (d) trimming and piercing the outer skin member at portions which correspond to the portions of the shaped substrate at which the trimming and piercing have been carried out at the step (a), the step (d) being so made that a peripheral portion of the outer skin member at which the trimming and piercing have been effected protrudes by a certain degree beyond a peripheral edge of the shaped substrate at which the trimming and piercing have been effected; and (e) turning back the protruding peripheral portion of the outer skin member

Abstract: A heating appliance including a heat source for heating air, a convection fan for blowing the heated air into a heating chamber, and an infrared radiator disposed in the path of the heated air.

Abstract: A heating appliance including a microwave heating source for heating an object, and an infrared ray heating source for heating the object in response to the operation of the microwave heating source by receiving energy from the microwave heating source and thus radiating infrared rays. Therefore, infrared ray heating is carried out in addition to the microwave heating.

Abstract: A humidity detecting circuit for detecting the ambient humidity in a cooking chamber, which includes a constant current source, a first temperature-detecting resistor self-heated by the constant current source to detect the ambient humidity and having one terminal connected to an output terminal of the constant current source, and a second temperature-detecting resistor having one terminal connected to the one terminal of the first temperature-detecting resistor to detect the ambient temperature. An operational amplifier having an inverting input terminal, a noninverting input terminal and an output terminal is provided, the inverting input terminal being connected to the other terminal of the second temperature-detecting resistor so that the terminal voltage of the first temperature-detecting resistor may be inputted into the inverting input terminal through the second temperature-detecting resistor.

Abstract: A humidity detector includes a first heat-sensing element for an electric signal corresponding to the temperature of steam to be detected and a second heat-sensing element for an atmosphere temperature whose vapor is to be detected or a temperature close to it. A comparator compares the electric signals from the first and second heat-sensing elements. The vapor detection characteristics may be adjusted through variation in the heating temperature of the first heat-sensing element.