Abstract: A light detection device detects incident light according to a detection start timing. The light detection device includes photosensors, a signal combining circuit, a detection circuit, a time measurement circuit, and a timing extraction circuit. The photosensors receive light to generate output signals indicating light reception results, respectively. The signal combining circuit sums output signals from the respective photosensors to generate a combined signal. The detection circuit detects a timing at which the combined signal reaches a first threshold or larger to generate a detection signal. The time measurement circuit measures a count period between the detection start timing and the detected timing based on the detection signal. The timing extraction circuit extracts timing information from a predetermined period defined by the detected timing as a reference, the timing information indicating a timing at which the combined signal increases.

Abstract: A light detection device detects incident light according to a detection start timing. The light detection device includes a plurality of photosensors, a signal combining circuit, a detection circuit, and at least one time measurement circuit. The plurality of photosensors receive light to generate output signals indicating light reception results, respectively. The signal combining circuit sums a plurality of output signals from the respective photosensors to generate a combined signal. The detection circuit detects a timing, at which the combined signal is maximized after the detection start timing, to generate a detection signal indicating the detected timing. The time measurement circuit measures a count period between the detection start timing and the detected timing based on the detection signal.

Abstract: A light detection device detects incident light according to a detection start timing. The light detection device includes photosensors, a signal combining circuit, a detection circuit, a time measurement circuit, and a timing extraction circuit. The photosensors receive light to generate output signals indicating light reception results, respectively. The signal combining circuit sums output signals from the respective photosensors to generate a combined signal. The detection circuit detects a timing at which the combined signal reaches a first threshold or larger to generate a detection signal. The time measurement circuit measures a count period between the detection start timing and the detected timing based on the detection signal. The timing extraction circuit extracts timing information from a predetermined period defined by the detected timing as a reference, the timing information indicating a timing at which the combined signal increases.

Abstract: A photoelectric sensor capable of preventing a malfunction caused by mutual interference is provided. The photoelectric sensor includes: a light projecting unit that repetitively emits a set of pulse light, which follows a projected light pattern in which a light projecting period is made different by a fixed time, as signal light; a light receiving element that receives the signal light; and a light receiving controller that distinguishes a light incident state and a light blocked state based on a received light signal from the light receiving element. The light projecting unit has a first pattern having the light projecting period increased by a fixed time and a second pattern having the light projecting period reduced by a fixed time as the projected light pattern, and in the first and second patterns, a pulse indicating a shortest period is included in the light projecting period other than the shortest period.

Abstract: A photoelectric sensor capable of preventing a malfunction caused by mutual interference is provided. The photoelectric sensor includes: a light projecting unit that repetitively emits a set of pulse light, which follows a projected light pattern in which a light projecting period is made different by a fixed time, as signal light; a light receiving element that receives the signal light; and a light receiving controller that distinguishes a light incident state and a light blocked state based on a received light signal from the light receiving element. The light projecting unit has a first pattern having the light projecting period increased by a fixed time and a second pattern having the light projecting period reduced by a fixed time as the projected light pattern, and in the first and second patterns, a pulse indicating a shortest period is included in the light projecting period other than the shortest period.

Abstract: A solder material test apparatus includes a control unit and a storage unit which stores master data in advance in which a printing process time when a printing process is performed by using a test-sample solder material is associated with deterioration degree data of the test-sample solder material at the printing process time. The control unit includes a deterioration degree data acquiring unit which acquires deterioration degree data for indicating a deterioration degree of a test-sample solder material, a reading unit which reads a printing process time associated with deterioration degree data set as a limit value with reference to master data and reads a printing process time associated with the deterioration degree data acquired by the deterioration degree data acquiring unit, an operating unit which operates an available remaining time that indicates difference between the printing process times, and a display control unit which informs the available remaining time to a user.

Abstract: Before an electronic component is mounted on a board 2, only a cream solder 3 printed on the board 2 is irradiated with a light beam which the board 2 is scanned based on printing position information obtained by printing position obtaining means such as CAD data, and thereby inspection object intensity of an infrared ray having a specific wave number, which is reflected from the cream solder 3, is detected by the irradiation of the cream solder 3 with the light beam. The cream solder 3 printed on the board 2 is set to an inspection object, and a deterioration parameter indicating a relative degree of deterioration of the cream solder 3 of the inspection object to a cream solder 3 of a comparison object is computed based on comparison object intensity of the infrared ray having the specific wave number and the inspection object intensity. The comparison object intensity of the infrared ray is detected as a reflected light beam when the cream solder 3 of the comparison object is irradiated with the light beam.

Abstract: Provided is a solder material test method that reduces labor and time and is preferred in operation hygiene. Detected are a first intensity at a particular wave number of infrared radiation reflected from a test-sample solder material by illuminating light to the test-sample solder material and a second intensity at the particular wave number of infrared radiation reflected from a comparative-sample solder material by illuminating light to the comparative-sample solder material. Depending upon the first and second intensities detected, intensity differences and ratios are determined. Those may be absorbance differences or intensities of between an infrared radiation absorbance to test-sample solder material and an infrared radiation absorbance to comparative-sample solder material. From the intensity difference, intensity ratio, absorbance difference and absorbance ratio, the test-sample solder material is tested for deterioration degree relatively to the comparative sample.

Abstract: Provided is a solder material test method that reduces labor and time and is preferred in operation hygiene. Detected are a first intensity at a particular wave number of infrared radiation reflected from a test-sample solder material by illuminating light to the test-sample solder material and a second intensity at the particular wave number of infrared radiation reflected from a comparative-sample solder material by illuminating light to the comparative-sample solder material. Depending upon the first and second intensities detected, intensity differences and ratios are determined. Those may be absorbance differences or intensities of between an infrared radiation absorbance to test-sample solder material and an infrared radiation absorbance to comparative-sample solder material. From the intensity difference, intensity ratio, absorbance difference and absorbance ratio, the test-sample solder material is tested for deterioration degree relatively to the comparative sample.

Abstract: A solder material test apparatus includes a control unit and a storage unit which stores master data in advance in which a printing process time when a printing process is performed by using a test-sample solder material is associated with deterioration degree data of the test-sample solder material at the printing process time. The control unit includes a deterioration degree data acquiring unit which acquires deterioration degree data for indicating a deterioration degree of a test-sample solder material, a reading unit which reads a printing process time associated with deterioration degree data set as a limit value with reference to master data and reads a printing process time associated with the deterioration degree data acquired by the deterioration degree data acquiring unit, an operating unit which operates an available remaining time that indicates difference between the printing process times, and a display control unit which informs the available remaining time to a user.