Abstract: A method for manufacturing a housing for an electronic equipment containing metal housing configured to house an electronic equipment therein and a resin film with which the metal housing is coated includes the steps of heating a resin film so as to soften the resin film, coating a metal housing with the heated resin film, and adhering the coated resin film to the metal housing. The preferred housing is one in which an adhesive layer, a print layer, or both thereof is disposed between a resin layer contained in the resin film and the metal housing, and in which the resin film contains at least one thermoplastic resin selected from the group consisting of polycarbonate (PC), polyethylene terephthalate (PET), polymethyl methacrylate (PMMA), and polylactic acid (PLA).

Abstract: A method for manufacturing a housing for an electronic equipment containing metal housing configured to house an electronic equipment therein and a resin film with which the metal housing is coated includes the steps of heating a resin film so as to soften the resin film, coating a metal housing with the heated resin film, and adhering the coated resin film to the metal housing. The preferred housing is one in which an adhesive layer, a print layer, or both thereof is disposed between a resin layer contained in the resin film and the metal housing, and in which the resin film contains at least one thermoplastic resin selected from the group consisting of polycarbonate (PC), polyethylene terephthalate (PET), polymethyl methacrylate (PMMA), and polylactic acid (PLA).

Abstract: A body flow path in a first housing having an MPU element communicates with an inner flow path and outer flow path formed in an inner heat-dissipating board and an outer heat-dissipating board, respectively, and a pump drives a cooling liquid to circulate in these flow paths. A beam is arranged between a pivot provided in a second housing and a pivot provided in the inner heat-dissipating board, a beam is arranged between the pivot of the inner heat-dissipating board and a pivot provided in the outer heat-dissipating board, and the inner heat-dissipating board and the outer heat-dissipating board are movable to the second housing. According to the operation of opening the second housing, a distance between the second housing and the inner heat-dissipating board, and a distance between the inner flow path and the outer flow path are increased.

Abstract: The housing for an electronic equipment of the present invention contains a metal housing configured to house an electronic equipment therein and a resin film with which the metal housing is coated. The preferable embodiments are the one in which an adhesive layer, a print layer, or both thereof is disposed between a resin layer contained in the resin film and the metal housing, the one in which the resin film contains at least one thermoplastic resin selected from the group consisting of polycarbonate (PC), polyethylene terephthalate (PET), polymethyl methacrylate (PMMA), and polylactic acid (PLA).

Abstract: Electronic components differing in height (a CPU 2a, a capacitor 2b, and coil elements 2c) are mounted on a printed circuit board 1. A heat-absorbing member 3 is provided above the printed circuit board 1 in such a way that the member 3 contacts not only the top surface of the CPU 2a that is the shortest but the sides of the capacitor 2b and the coil elements 2c. To circulate a cooling medium, a flow path 4 is formed in the heat-absorbing member 3. Heat generated at the CPU 2a is transmitted from its top surface to the cooling medium in the flow path 4 via the heat-absorbing member 3; heat generated at the capacitor 2b and the coil elements 2c is transmitted from their sides to the cooling medium in the flow path 4 via the heat-absorbing member 3.

Abstract: A body flow path in a first housing having an MPU element communicates with an inner flow path and outer flow path formed in an inner heat-dissipating board and an outer heat-dissipating board, respectively, and a pump drives a cooling liquid to circulate in these flow paths. A beam is arranged between a pivot provided in a second housing and a pivot provided in the inner heat-dissipating board, a beam is arranged between the pivot of the inner heat-dissipating board and a pivot provided in the outer heat-dissipating board, and the inner heat-dissipating board and the outer heat-dissipating board are movable to the second housing. According to the operation of opening the second housing, a distance between the second housing and the inner heat-dissipating board, and a distance between the inner flow path and the outer flow path are increased.

Abstract: A body flow path in a first housing having an MPU element communicates with an inner flow path and outer flow path formed in an inner heat-dissipating board and an outer heat-dissipating board, respectively, and a pump drives a cooling liquid to circulate in these flow paths. A beam is arranged between a pivot provided in a second housing and a pivot provided in the inner heat-dissipating board, a beam is arranged between the pivot of the inner heat-dissipating board and a pivot provided in the outer heat-dissipating board, and the inner heat-dissipating board and the outer heat-dissipating board are movable to the second housing. According to the operation of opening the second housing, a distance between the second housing and the inner heat-dissipating board, and a distance between the inner flow path and the outer flow path are increased.

Abstract: A plant-based resin-containing composition according to the present invention includes polyamide 11 and an amorphous resin. The amorphous resin is at least one resin selected from the group consisting of ABS resin, AS resin, ASA resin, polyvinyl chloride, polystyrene, polycarbonate, polymethylmethacrylate, modified polyphenylene ether, polysulfone, polyethersulfone and polyarylate. A plant-based resin-containing molded product according to the present invention is formed from the aforementioned plant-based resin-containing composition of the present invention.

Abstract: Electronic components differing in height (a CPU 2a, a capacitor 2b, and coil elements 2c) are mounted on a printed circuit board 1. A heat-absorbing member 3 is provided above the printed circuit board 1 in such a way that the member 3 contacts not only the top surface of the CPU 2a that is the shortest but the sides of the capacitor 2b and the coil elements 2c. To circulate a cooling medium, a flow path 4 is formed in the heat-absorbing member 3. Heat generated at the CPU2a is transmitted from its top surface to the cooling medium in the flow path 4 via the heat-absorbing member 3; heat generated at the capacitor 2b and the coil elements 2c is transmitted from their sides to the cooling medium in the flow path 4 via the heat-absorbing member 3.

Abstract: A heat receiving sheet for receiving heat from electronic components comprises a heat transfer part and a heat insulation part. A heat-generating component which is an electronic component having a high heat generation rate contacts with the heat transfer part of the heat receiving sheet, while a low-temperature component which is an electronic component having a low heat generation rate and having thermal weakness contacts with the heat insulation part of the heat receiving sheet. The heat generated in the heat-generating component is transmitted to the heat receiving sheet (heat transfer part) in a contacted state, so that the heat-generating component is cooled. The low-temperature component contacts with the heat insulation part, hence does not receive via the heat receiving sheet the heat generated in the heat-generating component.

Abstract: An adhesive as a heat resistant rubber-based adhesive is applied to a region (peripheral region) of integration of a metal sheet (Al sheet) and a resin and to a region (peripheral region) of integration of a fiber sheet (CF sheet) and a resin. The metal sheet and fiber sheet are temporarily fixed to dry the adhesive, then, the joined article is accommodated in an injection molding machine, a polycarbonate resin is injected, and the joined article (metal sheet and fiber sheet) is integrally molded with the polycarbonate resin.

Abstract: A heat receiving sheet for receiving heat from electronic components comprises a heat transfer part and a heat insulation part. A heat-generating component which is an electronic component having a high heat generation rate contacts with the heat transfer part of the heat receiving sheet, while a low-temperature component which is an electronic component having a low heat generation rate and having thermal weakness contacts with the heat insulation part of the heat receiving sheet. The heat generated in the heat-generating component is transmitted to the heat receiving sheet (heat transfer part) in a contacted state, so that the heat-generating component is cooled. The low-temperature component contacts with the heat insulation part, hence does not receive via the heat receiving sheet the heat generated in the heat-generating component.

Abstract: A body flow path in a first housing having an MPU element communicates with an inner flow path and outer flow path formed in an inner heat-dissipating board and an outer heat-dissipating board, respectively, and a pump drives a cooling liquid to circulate in these flow paths. A beam is arranged between a pivot provided in a second housing and a pivot provided in the inner heat-dissipating board, a beam is arranged between the pivot of the inner heat-dissipating board and a pivot provided in the outer heat-dissipating board, and the inner heat-dissipating board and the outer heat-dissipating board are movable to the second housing. According to the operation of opening the second housing, a distance between the second housing and the inner heat-dissipating board, and a distance between the inner flow path and the outer flow path are increased.

Abstract: A metal casting fabrication method is provided. In accordance with the method, first a metal plate is disposed in the cavity of molding dies. This metal plate includes a first surface formed with a heat insulating layer, and a second surface opposite to the first surface. With the metal plate placed in the cavity, the heat insulating layer is held in contact with the dies, while the opposite or second surface is partially exposed to the cavity. The injected molten metal properly fills the cavity from end to end since its heat is not conducted unduly to the dies via the metal plate.

Abstract: A metal casting fabrication method is provided. In accordance with the method, first a metal plate is disposed in the cavity of molding dies. This metal plate includes a first surface formed with a heat insulating layer, and a second surface opposite to the first surface. With the metal plate placed in the cavity, the heat insulating layer is held in contact with the dies, while the opposite or second surface is partially exposed to the cavity. The injected molten metal properly fills the cavity from end to end since its heat is not conducted unduly to the dies via the metal plate.

Abstract: A metal casting fabrication method is provided. In accordance with the method, first a metal plate is disposed in the cavity of molding dies. This metal plate includes a first surface formed with a heat insulating layer, and a second surface opposite to the first surface. With the metal plate placed in the cavity, the heat insulating layer is held in contact with the dies, while the opposite or second surface is partially exposed to the cavity. The injected molten metal properly fills the cavity from end to end since its heat is not conducted unduly to the dies via the metal plate.

Abstract: A metal object forming method includes a preliminary step and a metal-injecting step. At the preliminary step, flowability-improving material is put in a molding die. Then, at the metal-injecting step, molten metal is poured into the die for producing a casting. Due to the high temperature of the molten metal, the flowability-improving material melts into the molten metal, to cause the freezing point depression of the molten metal.

Abstract: A metal object forming method includes a preliminary step and a metal-injecting step. At the preliminary step, flowability-improving material is put in a molding die. Then, at the metal-injecting step, molten metal is poured into the die for producing a casting. Due to the high temperature of the molten metal, the flowability-improving material melts into the molten metal, to cause the freezing point depression of the molten metal.

Abstract: A metal casting fabrication method is provided. In accordance with the method, first a metal plate is disposed in the cavity of molding dies. This metal plate includes a first surface formed with a heat insulating layer, and a second surface opposite to the first surface. With the metal plate placed in the cavity, the heat insulating layer is held in contact with the dies, while the opposite or second surface is partially exposed to the cavity. The injected molten metal properly fills the cavity from end to end since its heat is not conducted unduly to the dies via the metal plate.