Patents by Inventor Masanobu Ishizuka

Masanobu Ishizuka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Polyamide resin composition and housing for electronic equipment
    Patent number: 5631070
    Abstract: A polyamide resin composition including 100 parts by weight of a resin composition containing of 20 to 80% by weight of an aromatic polyamide resin and 80 to 20% by weight of a modified polyphenylene ether resin (the total amount in% by weight of the aromatic polyamide resin and the modified polyphenylene ether resin being 100% by weight) and, incorporated in the resin composition, 0.5 to 30 parts by weight of a liquid-crystalline polymer, 0.01 to 3 parts by weight of a compatibilizing agent and 2 to 40 parts by weight of an inorganic filler and optionally a rubber component. The plate thickness of the resin molded articles may be reduced to 2 mm or less, and even further to 1 mm or less without deterioration of the properties thereof.
    Type: Grant
    Filed: June 7, 1995
    Date of Patent: May 20, 1997
    Assignee: Fujitsu Limited
    Inventors: Kota Nishii, Kouichi Kimura, Masanobu Ishizuka, Katsura Adachi
  • Method of manufacturing a casing for an electronic apparatus
    Patent number: 5531950
    Abstract: A method of manufacturing a casing for electronic apparatus use in which metal and resin are subjected to a hybrid formation, so that the mechanical strength of the casing is improved and the thickness is reduced so as to reduce the weight. An electronic apparatus casing having a rib (16) and boss (18) is manufactured when metal (10) and resin (12) are integrally formed. Adhesive (14) is coated on the metal, and after the coated adhesive has been dried, the resin (12) is injected onto the adhesive layer from a portion which composes the rib or boss, so that the metal and resin are subjected to a hybrid formation.
    Type: Grant
    Filed: May 31, 1994
    Date of Patent: July 2, 1996
    Assignee: Fujitsu Limited
    Inventors: Kouichi Kimura, Kouta Nishii, Masanobu Ishizuka
  • Polyamide resin composition and housing for electronic equipment
    Patent number: 5470909
    Abstract: A polyamide resin composition including 100 parts by weight of a resin composition containing of 20 to 80% by weight of an aromatic polyamide resin and 80 to 20% by weight of a modified polyphenylene ether resin (the total amount in % by weight of the aromatic polyamide resin and the modified polyphenylene ether resin being 100% by weight) and, incorporated in the resin composition, 0.5 to 30 parts by weight of a liquid-crystalline polymer, 0.01 to 3 parts by weight of a compatibilizing agent and 2 to 40 parts by weight of an inorganic filler and optionally a rubber component. The plate thickness of the resin molded articles may be reduced to 2 mm or less, and even further to 1 mm or less without deterioration of the properties thereof.
    Type: Grant
    Filed: August 25, 1993
    Date of Patent: November 28, 1995
    Assignee: Fujitsu Limited
    Inventors: Kota Nishii, Kouichi Kimura, Masanobu Ishizuka, Katsura Adachi