Patents by Inventor Masanobu MATSUYAMA

Masanobu MATSUYAMA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Molded laying interior material for vehicle
    Patent number: 8727417
    Abstract: The present invention discloses a molded laying interior material for a vehicle includes a decorative layer that faces a vehicle compartment and a buffer material layer that faces a vehicle body panel. The decorative layer has a first concavo-convex shape formed by press molding on a side of the vehicle compartment. The buffer material layer has a second concavo-convex shape formed by press molding a buffer material on a side of the vehicle body panel. The buffer material has a fiber structure in which fibers are oriented in a thickness direction in the fiber structure The decorative layer and the buffer material layer are at least laminated and integrated.
    Type: Grant
    Filed: January 12, 2011
    Date of Patent: May 20, 2014
    Assignee: Hayashi Engineering Inc.
    Inventors: Hiroyuki Eguchi, Toshiyuki Nakamura, Masanobu Matsuyama
  • MOLDED LAYING INTERIOR MATERIAL FOR VEHICLE
    Publication number: 20110206891
    Abstract: The present invention discloses a molded laying interior material for a vehicle includes a decorative layer that faces a vehicle compartment and a buffer material layer that faces a vehicle body panel. The decorative layer has a first concavo-convex shape formed by press molding on a side of the vehicle compartment. The buffer material layer has a second concavo-convex shape formed by press molding a buffer material on a side of the vehicle body panel. The buffer material has a fiber structure in which fibers are oriented in a thickness direction in the fiber structure The decorative layer and the buffer material layer are at least laminated and integrated.
    Type: Application
    Filed: January 12, 2011
    Publication date: August 25, 2011
    Applicant: HAYASHI ENGINEERING INC.
    Inventors: Hiroyuki EGUCHI, Toshiyuki NAKAMURA, Masanobu MATSUYAMA