Abstract: An adhesive for semiconductors, the adhesive containing a thermoplastic resin, a thermosetting resin, a curing agent having a reactive group, and a flux compound having an acid group. The adhesive has a calorific value of 20 J/g or less at 60° C. to 155° C. on a DSC curve, which is obtained by differential scanning calorimetry involving heating the adhesive at a rate of temperature increase of 10° C./min.

Abstract: A double-faced adhesive film including: a supporting film; a first adhesive layer laminated on one surface of the supporting film; and a second adhesive layer laminated on the other surface of the supporting film, wherein the glass transition temperatures, after curing, of the first adhesive layer and the second adhesive layer are each 100° C. or lower, and the first adhesive layer and the second adhesive layer are the layers capable of being formed by a method including the steps of directly applying a varnish to the supporting film and drying the applied varnish.

Abstract: An adhesive composition that is capable of achieving a superior combination of process characteristics such as adherend fill properties (embedability) and low-temperature lamination properties, and semiconductor device reliability such as reflow resistance, as well as a film-like adhesive, an adhesive sheet that exhibits excellent process characteristics including ready releasability from dicing sheets, and a semiconductor device that exhibits excellent productivity, superior adhesive strength when heated and superior moisture resistance, all of which use the adhesive composition. The adhesive composition comprises (A) a thermoplastic resin, (B) a bisallylnadimide represented by a general formula (I) shown below, and (C) a bifunctional or higher (meth)acrylate compound. (wherein, R1 represents a bivalent organic group containing an aromatic ring and/or a straight-chain, branched or cyclic aliphatic hydrocarbon).