Abstract: An electrical circuit board is prepared by application, over a conductive foil which is supported on a substrate, of a hot-melt resin in accordance with the desired circuit pattern. The resin may be applied by screen printing and, after curing, will function as a resist coating for the conductive material during subsequent chemical removal of the foil from unprotected areas to form the individual conductors of the pattern. During subsequent connection of the circuit to other components contact areas on the individual conductors may be exposed by contacting the resin coating with molten solder.