Abstract: A soldered product manufacturing device 1 includes a stage 13 on which a substrate W is placed, solder being arranged on the substrate W; a cover 16 configured to cover at least an upper part of the substrate W placed on the stage 13 at a predetermined distance therefrom; a chamber 11 configured to house the stage 13 and the cover 16; a heater 15 configured to heat the substrate W on the stage 13; and a reducing gas supply device 19 configured to supply a reducing gas F. A method for manufacturing a soldered product includes, by using the soldered product manufacturing device 1, placing the substrate W on the stage 13; covering the substrate W placed on the stage 13 with the cover 16; heating the substrate W; and supplying the reducing gas F into the chamber 11.

Abstract: To provide a heating apparatus and a method for producing a plate-like object that can heat a heating target object uniformly. The heating apparatus includes a heater 10 for heating target object W, and a support member 20 disposed on a front face 11f of the heater 10 and for supporting a face Wf of the heating target object W. The support member 20 supports the heating target object W in such a manner that: the support member 20 prevents direct heat transfer between the face Wf and the support member 20; a clearance between the front face 11f and the face Wf is maintained in a predetermined clearance S, wherein the predetermined clearance S allows a fluid to be present in the clearance but does not induce convection of the fluid. The method includes supporting the heating target object W with the support member 20, and heating the heating target object W with the heater 10 to produce the plate-like object.

Abstract: A method for manufacturing a bonded member is disclosed in which spread of an adhesive between two members can be performed in a short time and manufacturing time of a bonded member can be reduced. A predetermined area of at least either one of bonded surfaces of two members is coated with an adhesive, while a spreading adhesive is applied on at least either one of the bonded surfaces of the two members, and the bonded surfaces of the two members are caused to face each other, the spreading adhesive is brought into contact with the coating adhesive of the other member or the other member, the two members are pressurized so as to spread the spreading adhesive, and the two members are bonded together so as to manufacture a bonded member.