Abstract: Provided is a brake device (2) which has reduced manufacturing cost, is compact, and can generate sufficient braking force. Also provided is a crane (1) which comprises the brake device (2). The brake device (2) is installed in a movable body (1) which travels. The brake device (2) is provided with a receiving section (22) affixed to the movable body (1) and is also provided with a brake shoe (21) disposed below the receiving section (21). The brake shoe (21) has a brake shoe upper surface (24) provided with sloped sections (24u, 24d). The receiving section (22) has a receiving lower surface (26) corresponding to the brake shoe upper surface (24) and provided with sloped sections (26u, 26d). The brake device (2) is configured so that, when the brake device (2) is activated, the brake shoe (21) drops, and the receiving section (22) rides over the brake shoe upper surface (24) when the movable body (1) moves.

Abstract: Provided is a brake device (2) which has reduced manufacturing cost, is compact, and can generate sufficient braking force. Also provided is a crane (1) which comprises the brake device (2). The brake device (2) is installed in a movable body (1) which travels. The brake device (2) is provided with a receiving section (22) affixed to the movable body (1) and is also provided with a brake shoe (21) disposed below the receiving section (21). The brake shoe (21) has a brake shoe upper surface (24) provided with sloped sections (24u, 24d). The receiving section (22) has a receiving lower surface (26) corresponding to the brake shoe upper surface (24) and provided with sloped sections (26u, 26d). The brake device (2) is configured so that, when the brake device (2) is activated, the brake shoe (21) drops, and the receiving section (22) rides over the brake shoe upper surface (24) when the movable body (1) moves.

Abstract: A circuit board has holes extending therethrough, and a solder layer disposed on a first side of the board. Terminals have been pushed through respective holes and into contact with the solder layer. The terminals have been welded to the first side of the circuit board in a fluxless manner by an irradiated energy beam.

Abstract: Load terminals are mounted to a circuit board by providing a solder layer on each lead terminal and on each conductive inner wall surface of respective holes formed in the circuit board. The lead terminals are thrust into respective holes, and contacting portions of the solder layers are irradiated with an energy beam, to produce sufficient heat for welding in a fluxless manner each lead terminal to the inner wall surface of its respective hole.