Abstract: [Object] To provide a technique for controlling a dimension and/or a shape of an opening formed in an etching film. [Solution] A substrate processing method according to the present disclosure includes: preparing a substrate having (a) an etching film, (b) a mask film formed on the etching film and having a sidewall that defines at least one opening on the etching film, and (c) a protective film formed to surround the opening on at least the sidewall of the mask film and containing at least one element selected from the group consisting of boron, phosphorus, sulfur, and tin; and etching the etching film by using the protective film and the mask film as a mask.

Abstract: A manufacturing method of an electronic component comprises the steps of: mounting components on a sheet substrate having a plurality of component-mounting substrates and a plurality of through holes on which shield case-mounting electrodes are respectively formed; establishing a state in which a plurality of shield case pawls are inserted into the plurality of through holes to cover the components with shield cases, and solder is buried in the plurality of through holes; thereafter securing the plurality of shield cases to the sheet substrate to cover the components by melting the solder to secure the shield case pawls to the shield case-mounting electrodes of the through holes by the solder; and thereafter dividing the sheet substrate into the plurality of component-mounting substrates by cutting the sheet substrate, thereby producing a plurality of the electronic components each including the component-mounting substrate, the component mounted on the component-mounting substrate and the shield case secured