Abstract: Arrays of memory cells might include a first upper data line, a second upper data line, a lower data line, a first pass gate selectively connected to the lower data line, a second pass gate connected to the first pass gate and selectively connected to the lower data line, a third pass gate selectively connected to the lower data line, a fourth pass gate connected to the third pass gate and selectively connected to the lower data line, unit column structures selectively connected to a respective one of the upper data lines and capacitively coupled to a first channel of a respective one of the pass gates, and control lines capacitively coupled to a second channel of a respective one of the pass gates.

Abstract: Arrays of memory cells might include a data line, a source, a plurality of pass gates connected in series between the data line and the source, a plurality of unit column structures each having a respective plurality of series-connected non-volatile memory cells connected in series with a respective plurality of series-connected field-effect transistors, wherein a channel of each non-volatile memory cell of its respective plurality of series-connected non-volatile memory cells and a channel of each field-effect transistor of its respective plurality of series-connected field-effect transistors are selectively connected to one another, and a plurality of backside gate lines each connected to the second control gate of a respective pass gate of the plurality of pass gates, wherein, for each unit column structure of the plurality of unit column structures, the channel of a particular field-effect transistor of its respective plurality of field-effect transistors is capacitively coupled to the first channel of a

Abstract: Memory might include a plurality of series-connected non-volatile memory cells, a plurality of series-connected first field-effect transistors connected in series with the plurality of series-connected non-volatile memory cells, and a second field-effect transistor, wherein the channel of the second field-effect transistor is capacitively coupled to channels of the plurality of series-connected first field-effect transistors.

Abstract: Apparatus might include an array of memory cells comprising a plurality of strings of series-connected memory cells, a data line, a first field-effect transistor between the data line and a first string of series-connected memory cells, and a second field-effect transistor between the data line and a second string of series-connected memory cells, wherein a control gate of the first field-effect transistor is connected to a control gate of the second field-effect transistor, and wherein a channel of the first field-effect transistor was fabricated to have a first threshold voltage and a channel of the second field-effect transistor was fabricated to have a second threshold voltage, different than the first threshold voltage.

Abstract: Methods of forming integrated circuit structures for a capacitive sense NAND memory include forming a first semiconductor overlying a dielectric, forming a second semiconductor to be in contact with a first end of the first semiconductor, forming a third semiconductor to be in contact with a second end of the first semiconductor opposite the first end of the first semiconductor, forming a vertical channel material structure overlying the first semiconductor and having a channel material capacitively coupled to the first semiconductor, and forming a plurality of series-connected field-effect transistors adjacent the vertical channel material structure.

Abstract: Memory might include a plurality of series-connected non-volatile memory cells, a plurality of series-connected first field-effect transistors connected in series with the plurality of series-connected non-volatile memory cells, and a second field-effect transistor, wherein the channel of the second field-effect transistor is capacitively coupled to channels of the plurality of series-connected first field-effect transistors.

Abstract: An array of memory cells might include a first data line, a second data line, a source, a capacitance selectively connected to the first data line, a string of series-connected non-volatile memory cells between the first data line and the capacitance, and a pass gate selectively connected between the second data line and the source, wherein an electrode of the capacitance is capacitively coupled to a channel of the pass gate.

Abstract: Memory might include a non-volatile memory cell, a capacitance selectively connected to the non-volatile memory cell, a field-effect transistor having a channel capacitively coupled to an electrode of the capacitance, and a controller for access of the non-volatile memory cell configured to cause the memory to increase a voltage level of the electrode of the capacitance, selectively discharge the voltage level of the electrode of the capacitance through the non-volatile memory cell responsive to a data state stored in the non-volatile memory cell, and determine whether the field-effect transistor is activated in response to a remaining voltage level of the electrode of the capacitance.

Abstract: An array of memory cells might include a first data line, a second data line, a source, a capacitance selectively connected to the first data line, a string of series-connected non-volatile memory cells between the first data line and the capacitance, and a pass gate selectively connected between the second data line and the source, wherein an electrode of the capacitance is capacitively coupled to a channel of the pass gate.

Abstract: Memory might include a non-volatile memory cell, a capacitance selectively connected to the non-volatile memory cell, a field-effect transistor having a channel capacitively coupled to an electrode of the capacitance, and a controller for access of the non-volatile memory cell configured to cause the memory to increase a voltage level of the electrode of the capacitance, selectively discharge the voltage level of the electrode of the capacitance through the non-volatile memory cell responsive to a data state stored in the non-volatile memory cell, and determine whether the field-effect transistor is activated in response to a remaining voltage level of the electrode of the capacitance.

Abstract: Arrays of memory cells might include a data line, a source, a plurality of pass gates connected in series between the data line and the source, a plurality of unit column structures each having a respective plurality of series-connected non-volatile memory cells connected in series with a respective plurality of series-connected field-effect transistors, wherein a channel of each non-volatile memory cell of its respective plurality of series-connected non-volatile memory cells and a channel of each field-effect transistor of its respective plurality of series-connected field-effect transistors are selectively connected to one another, and a plurality of backside gate lines each connected to the second control gate of a respective pass gate of the plurality of pass gates, wherein, for each unit column structure of the plurality of unit column structures, the channel of a particular field-effect transistor of its respective plurality of field-effect transistors is capacitively coupled to the first channel of a

Abstract: Arrays of memory cells might include a first upper data line, a second upper data line, a lower data line, a first pass gate selectively connected to the lower data line, a second pass gate connected to the first pass gate and selectively connected to the lower data line, a third pass gate selectively connected to the lower data line, a fourth pass gate connected to the third pass gate and selectively connected to the lower data line, unit column structures selectively connected to a respective one of the upper data lines and capacitively coupled to a first channel of a respective one of the pass gates, and control lines capacitively coupled to a second channel of a respective one of the pass gates.

Abstract: Arrays of memory cells a plurality of sense lines each having a respective plurality of pass gates connected in series between a second data line and a source, and having a respective subset of unit column structures capacitively coupled to first channels of its respective plurality of pass gates, wherein, for each sense line of the plurality of sense lines, each unit column structure of its respective subset of unit column structures is connected to a respective first data line of a respective subset of first data lines.

Abstract: A vacuum evacuation system which can prevent an increase in pressure in one process chamber when evacuating an atmospheric-pressure gas from another process chamber is disclosed. The vacuum evacuation system can be used for evacuating a gas from a plurality of process chambers. The vacuum evacuation system includes: first vacuum pumps; buffer tanks coupled to the first vacuum pumps, respectively; a second vacuum pump; and a collecting pipe providing a communication between the first vacuum pumps and the second vacuum pump.

Abstract: Some embodiments include apparatuses and methods of using and forming such apparatuses. An apparatus among the apparatuses includes first and second conductive materials located in respective first and second levels of the apparatus, a pillar including a length extending between the first and second conductive materials, memory cells and control lines located along the pillar, a first select gate and a first select line located along the pillar between the first conductive material and the memory cells, a second select gate and a second select line located along the pillar between the first conductive material and the first select line, a first transistor and a first transistor gate line located along the pillar between the first conductive material and the first select line, and a second transistor and a second transistor gate line located along the pillar between the first conductive material and the first transistor.

Abstract: Some embodiments include apparatuses and methods of using and forming such apparatuses. An apparatus among the apparatuses includes first and second conductive materials located in respective first and second levels of the apparatus, a pillar including a length extending between the first and second conductive materials, memory cells and control lines located along the pillar, a first select gate and a first select line located along the pillar between the first conductive material and the memory cells, a second select gate and a second select line located along the pillar between the first conductive material and the first select line, a first transistor and a first transistor gate line located along the pillar between the first conductive material and the first select line, and a second transistor and a second transistor gate line located along the pillar between the first conductive material and the first transistor.

Abstract: Some embodiments include apparatuses and methods of using and forming such apparatuses. An apparatus among the apparatuses includes first and second conductive materials located in respective first and second levels of the apparatus, a pillar including a length extending between the first and second conductive materials, memory cells and control lines located along the pillar, a first select gate and a first select line located along the pillar between the first conductive material and the memory cells, a second select gate and a second select line located along the pillar between the first conductive material and the first select line, a first transistor and a first transistor gate line located along the pillar between the first conductive material and the first select line, and a second transistor and a second transistor gate line located along the pillar between the first conductive material and the first transistor.

Abstract: It is determined that indoor condensation of hydrogen peroxide vapor is to occur, if there is a solution with which both (Equation 1): PT·y1=P01·x1·?1 and (Equation 2): PT·y2=P02·x2·?2 hold. With this, it is possible to accurately determine whether indoor condensation of hydrogen peroxide vapor is to occur or not in decontamination.

Abstract: It is determined that indoor condensation of hydrogen peroxide vapor is to occur, if there is a solution with which both (Equation 1): PT·y1=P01·x1·?1 and (Equation 2): PT·y2=P02·x2·?2 hold. With this, it is possible to accurately determine whether indoor condensation of hydrogen peroxide vapor is to occur or not in decontamination.

Abstract: Embodiments of the present invention include an image bearing member arranged to bear an electrostatic latent image, a charging member contacting the image bearing member to charge a surface of the image bearing member with application of a DC voltage to the charging member, a current detection unit arranged to detect a DC current flowing in the charging member, and a control unit configured to control the voltage applied to the charging member, wherein a plurality of different DC voltages are successively applied to the charging member during a period of no image formation until a change amount of change in the DC current with respect to change in the DC voltage becomes not larger than a predetermined value, and the control unit controls a DC voltage applied to the charging member during a period of image formation based on a result detected by the current detection unit.