Abstract: An object is to scribe a small-sized substrate made of a brittle material with high workability. A plurality of brittle material-made substrates 107a to 107i are arranged on the table 106 while being positioned by their respective positioning pins 109. A recipe data table is prepared in advance for each of the brittle material-made substrates on an individual basis. On the basis of the recipe data table, the brittle material-made substrate and the scribing head are moved relatively to each other to perform inside scribing or outside scribing on each of the substrates. This makes it possible to subject a plurality of substrates to scribing operation at one time under automatic control.

Abstract: An object is to scribe a small-sized substrate made of a brittle material with high workability. A plurality of brittle material-made substrates 107a to 107i are arranged on the table 106 while being positioned by their respective positioning pins 109. A recipe data table is prepared in advance for each of the brittle material-made substrates on an individual basis. On the basis of the recipe data table, the brittle material-made substrate and the scribing head are moved relatively to each other to perform inside scribing or outside scribing on each of the substrates. This makes it possible to subject a plurality of substrates to scribing operation at one time under automatic control.

Abstract: [Object] To provide a scribing apparatus with which fine adjustment with a low load is possible, thin films on the solar cell substrate can be shaved off with precision, thin films can be prevented from peeling irregularly, and straight and precise scribe lines can be created.

Abstract: To be able to accurately adjust an angle using a simple operation when mounting a groove machining tool into a holder, there is provided a groove machining tool for use with a thin-film solar cell. The groove machining tool is retained by a holder, is caused to move together with the holder over a thin film of an integrated thin-film solar cell in one direction, and forms a groove on the thin film extending in one direction and has a tool body. The blade tip part is formed on a tip end of the tool body and has blade tips for machining grooves disposed at a tip end. An angle regulation unit is disposed on the tool body so that the blade tip part is fixed in a predetermined orientation with regard to the direction of formation of the groove when being retained by the holder.

Abstract: There is provided a groove machining tool supported in a holder and caused to move together with the holder in relative fashion along a scheduled scribe line over an integrated thin-film solar cell substrate to form a groove. The groove machining tool includes a tool body supported in the holder, and a blade tip part formed in a distal part of the tool body. The blade tip part includes a blade extending along a direction intersecting a direction of movement of the tool, at a first end along the direction of movement of the tool. The blade is tilted backward from the direction of movement of the tool in relation to a direction orthogonal to the direction of movement of the groove tool, as viewed from a bottom face of the blade tip part.

Abstract: A scribing apparatus where the width of a scribe line to be created is easy to adjust is provided. The scribing apparatus is provided with a support means for supporting the substrate of a thin film solar cell, a scribe head for pressing the blade installed at one end against the line to be scribed on one surface of the substrate, and a moving means for moving the scribe head over the substrate. When the scribe head moves over the substrate, a scribe line is created on one surface of the substrate. In the scribe head, the end of the blade is in cylindrical form, and the blade is positioned so that the direction in which the scribe head moves is approximately the same as the direction of the center line of the cylindrical form.

Abstract: A method and an apparatus for creating a scribe line are provided, so that a brittle material substrate can be divided into pieces along highly straight scribe lines. The surface of a brittle material substrate is heated with a laser beam along a line along which a scribed line is created at a temperature lower than the point at which the brittle material substrate softens, and the heated region is cooled immediately after heating so that a first crack is created, and after that, a cutter is moved over the surface of the substrate in a pressed state along the scribe line, and thus, a crack which is deeper than the first crack is created in the substrate.

Abstract: A substrate processing table is constituted, in layer form, of a first sub-table, a second sub-table, a rubber plate and a metal plate. A plurality of substrate adsorbing holes are provided which penetrate through the sub-tables, the rubber plate and the metal plate to suck the substrate. Further, a plurality of hard-sheet adsorbing holes are provided which penetrate through the second sub-table and the rubber plate to suck the metal plate. At the time of fixing the substrate, air is discharged via a cavity portion formed on the lower side of the second sub-table, and the pressure of each of the adsorbing holes is made negative. With such a configuration, it is possible to improve a method for holding a substrate so as to improve a scribe function in a scribe step and a break function in a break step at the time of dividing the substrate.