Patents by Inventor Masanobu Yagi
Masanobu Yagi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240117192Abstract: A method for manufacturing a surface-treated gas-phase-process silica particle, the method including steps of: adding 1,3-divinyl-1,1,3,3-tetramethyldisilazane to a raw material gas-phase-process silica particle and introducing a vinyldimethylsilyl group on a surface of the raw material gas-phase-process silica particle to obtain a preliminarily treated silica particle; and adding hexamethyldisilazane to the preliminarily treated silica particle and introducing a trimethylsilyl group on a surface of the preliminarily treated silica particle to obtain a surface-treated gas-phase-process silica particle.Type: ApplicationFiled: December 22, 2021Publication date: April 11, 2024Applicant: SHIN-ETSU CHEMICAL CO., LTD.Inventors: Kazuyuki MATSUMURA, Masanobu NISHIMINE, Yusuke ITOH, Hisashi YAGI, Tsutomu NAKAMURA, Yoshiteru SAKATSUME
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Patent number: 8112881Abstract: A process for manufacturing a multilayer wiring board including the steps of forming an insulating layer on a base provided with a bump for interlayer connection, bonding a copper foil onto the insulating layer by a thermocompression bonding by sandwiching the copper foil between stainless steel plates, and patterning the copper foil, in which a metal foil is interposed at least between each of the stainless plates and the copper foil at the time of the thermocompression bonding. At this time, a mold release layer is formed on a surface of the metal foil to be imposed. Thus, such a multilayer wiring board can be manufactured that prevents sticking of a product after molding (cementing of the copper foil) and excels in dimensional stability without occurrence of wrinkling and ruggedness.Type: GrantFiled: September 29, 2005Date of Patent: February 14, 2012Assignees: Tessera Interconnect Materials, Inc., Sony Chemical & Information Device CorporationInventors: Kazuhiro Shimizu, Masanobu Yagi, Kenichiro Hanamura, Mitsuyuki Takayasu, Kiyoe Nagai, Tomoo Iijima
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Publication number: 20080110018Abstract: A process for manufacturing a multilayer wiring board including the steps of forming an insulating layer on a base provided with a bump for interlayer connection, bonding a copper foil onto the insulating layer by a thermocompression bonding by sandwiching the copper foil between stainless steel plates, and patterning the copper foil, in which a metal foil is interposed at least between each of the stainless plates and the copper foil at the time of the thermocompression bonding. At this time, a mold release layer is formed on a surface of the metal foil to be imposed. Thus, such a multilayer wiring board can be manufactured that prevents sticking of a product after molding (cementing of the copper foil) and excels in dimensional stability without occurrence of wrinkling and ruggedness.Type: ApplicationFiled: September 29, 2005Publication date: May 15, 2008Applicants: SONY CHEMICAL & INFORMATION DEVICE CORPORATION, TESSERA INTERCONNECT MATERIALS, INC.Inventors: Kazuhiro Shimizu, Masanobu Yagi, Kenichiro Hanamura, Mitsuyuki Takayasu, Kiyoe Nagai, Tomoo Iijima
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Patent number: 7223349Abstract: A printed wiring board having a conductor pattern on which a pre-flux film of a stabilized quality is to be formed using a water-soluble pre-flux liquid. To this end, such an apparatus is used which includes an etching unit 12 for etching lands 5b, 6b formed on the printed wiring board 1, a rinsing unit 13 for rinsing the printed wiring board 1, a bubble removing 14 for removing air bubbles 58 attached to the printed wiring board 1 on immersing the printed wiring board 1 in a water-soluble pre-flux liquid 9a in a processing vessel 56, a pre-flux forming unit 15 for forming a pre-flux film 9 on the lands 5b, 6b of the printed wiring board 1 in the pre-flux liquid 9a using an in-liquid spraying unit 61, a liquid removing unit 16 for removing the pre-flux liquid 9a from the printed wiring board 1 transported from the processing vessel 56 and a rinsing unit 17 for rinsing the printed wiring board 1.Type: GrantFiled: March 14, 2005Date of Patent: May 29, 2007Assignee: Sony CorporationInventors: Atsuhiro Uratsuji, Tatsutoshi Narita, Masanobu Yagi, Yoshiyuki Ukeda
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Publication number: 20050155948Abstract: A printed wiring board having a conductor pattern on which a pre-flux film of a stabilized quality is to be formed using a water-soluble pre-flux liquid. To this end, such an apparatus is used which includes an etching unit 12 for etching lands 5b, 6b formed on the printed wiring board 1, a rinsing unit 13 for rinsing the printed wiring board 1, a bubble removing 14 for removing air bubbles 58 attached to the printed wiring board 1 on immersing the printed wiring board 1 in a water-soluble pre-flux liquid 9a in a processing vessel 56, a pre-flux forming unit 15 for forming a pre-flux film 9 on the lands 5b, 6b of the printed wiring board 1 in the pre-flux liquid 9a using an in-liquid spraying unit 61, a liquid removing unit 16 for removing the pre-flux liquid 9a from the printed wiring board 1 transported from the processing vessel 56 and a rinsing unit 17 for rinsing the printed wiring board 1.Type: ApplicationFiled: March 14, 2005Publication date: July 21, 2005Inventors: Atsuhiro Uratsuji, Tatsutoshi Narita, Masanobu Yagi, Yoshiyuki Ukeda
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Patent number: 6878296Abstract: A printed wiring board having a conductor pattern on which a pre-flux film of a stabilized quality is to be formed using a water-soluble pre-flux liquid. To this end, such an apparatus is used which includes an etching unit 12 for etching lands 5b, 6b formed on the printed wiring board 1, a rinsing unit 13 for rinsing the printed wiring board 1, a bubble removing unit 14 for removing air bubbles 58 attached to the printed wiring board 1 on immersing the printed wiring board 1 in a water-soluble pre-flux liquid 9a in a processing vessel 56, a pre-flux forming unit 15 for forming a pre-flux film 9 on the lands 5b, 6b of the printed wiring board 1 in the pre-flux liquid 9a using an in-liquid spraying unit 61, a liquid removing unit 16 for removing the pre-flux liquid 9a from the printed wiring board 1 transported from the processing vessel 56 and a rinsing unit 17 for rinsing the printed wiring board 1.Type: GrantFiled: October 6, 2003Date of Patent: April 12, 2005Assignee: Sony CorporationInventors: Atsuhiro Uratsuji, Tatsutoshi Narita, Masanobu Yagi, Yoshiyuki Ukeda
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Publication number: 20040065639Abstract: A printed wiring board having a conductor pattern on which a pre-flux film of a stabilized quality is to be formed using a water-soluble pre-flux liquid. To this end, such an apparatus is used which includes an etching unit 12 for etching lands 5b, 6b formed on the printed wiring board 1, a rinsing unit 13 for rinsing the printed wiring board 1, a bubble removing unit 14 for removing air bubbles 58 attached to the printed wiring board 1 on immersing the printed wiring board 1 in a water-soluble pre-flux liquid 9a in a processing vessel 56, a pre-flux forming unit 15 for forming a pre-flux film 9 on the lands 5b, 6b of the printed wiring board 1 in the pre-flux liquid 9a using an in-liquid spraying unit 61, a liquid removing unit 16 for removing the pre-flux liquid 9a from the printed wiring board 1 transported from the processing vessel 56 and a rinsing unit 17 for rinsing the printed wiring board 1.Type: ApplicationFiled: October 6, 2003Publication date: April 8, 2004Inventors: Atsuhiro Uratsuji, Tatsutoshi Narita, Masanobu Yagi, Yoshiyuki Ukeda
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Patent number: 6673194Abstract: A printed wiring board having a conductor pattern on which a pre-flux film of a stabilized quality is to be formed using a water-soluble pre-flux liquid. To this end, such an apparatus is used which includes an etching unit 12 for etching lands 5b, 6b formed on the printed wiring board 1, a rinsing unit 13 for rinsing the printed wiring board 1, a bubble removing unit 14 for removing air bubbles 58 attached to the printed wiring board 1 on immersing the printed wiring board 1 in a water-soluble pre-flux liquid 9a in a processing vessel 56, a pre-flux forming unit 15 for forming a pre-flux film 9 on the lands 5b, 6b of the printed wiring board 1 in the pre-flux liquid 9a using an in-liquid spraying unit 61, a liquid removing unit 16 for removing the pre-flux liquid 9a from the printed wiring board 1 transported from the processing vessel 56 and a rinsing unit 17 for rinsing the printed wiring board 1.Type: GrantFiled: May 25, 2001Date of Patent: January 6, 2004Assignee: Sony CorporationInventors: Atsuhiro Uratsuji, Tatsutoshi Narita, Masanobu Yagi, Yoshiyuki Ukeda
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Publication number: 20020014469Abstract: A printed wiring board having a conductor pattern on which a pre-flux film of a stabilized quality is to be formed using a water-soluble pre-flux liquid. To this end, such an apparatus is used which includes an etching unit 12 for etching lands 5b, 6b formed on the printed wiring board 1, a rinsing unit 13 for rinsing the printed wiring board 1, a bubble removing unit 14 for removing air bubbles 58 attached to the printed wiring board 1 on immersing the printed wiring board 1 in a water-soluble pre-flux liquid 9a in a processing vessel 56, a pre-flux forming unit 15 for forming a pre-flux film 9 on the lands 5b, 6b of the printed wiring board 1 in the pre-flux liquid 9a using an in-liquid spraying unit 61, a liquid removing unit 16 for removing the pre-flux liquid 9a from the printed wiring board 1 transported from the processing vessel 56 and a rinsing unit 17 for rinsing the printed wiring board 1.Type: ApplicationFiled: May 25, 2001Publication date: February 7, 2002Inventors: Atsuhiro Uratsuji, Tatsutoshi Narita, Masanobu Yagi, Yoshiyuki Ukeda