Patents by Inventor Masanobu YAMANOBE

Masanobu YAMANOBE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11230651
    Abstract: An adhesive film includes a resin film; and an adhesive layer provided on the resin film. The adhesive layer includes a resin composition including 2 parts by mass or more of an epoxy resin including two or more epoxy groups in molecules and having epoxy equivalents of 300 g/eq or less, per 100 parts by mass of an amorphous resin, which is soluble to a solvent and has a plurality of carboxyl groups in molecules, and which has a glass transition temperature of 100° C. or less and an acid value of 5 KOHmg/g or more. A flat wiring member includes a conductor and the adhesive film as described above.
    Type: Grant
    Filed: November 7, 2017
    Date of Patent: January 25, 2022
    Assignee: HITACHI METALS, LTD.
    Inventors: Daisuke Shanai, Akinari Nakayama, Kenichi Murakami, Kazuhiko Sasada, Masanobu Yamanobe
  • Publication number: 20180057720
    Abstract: An adhesive film includes a resin film; and an adhesive layer provided on the resin film. The adhesive layer comprises a resin composition including 2 parts by mass or more of an epoxy resin including two or more epoxy groups in molecules and having epoxy equivalents of 300 g/eq or less, per 100 parts by mass of an amorphous resin, which is soluble to a solvent and has a plurality of carboxyl groups in molecules, and which has a glass transition temperature of 100° C. or less and an acid value of 5 KOHmg/g or more. A flat wiring member includes a conductor and the adhesive film as described above.
    Type: Application
    Filed: November 7, 2017
    Publication date: March 1, 2018
    Inventors: Daisuke SHANAI, Akinari NAKAYAMA, Kenichi MURAKAMI, Kazuhiko SASADA, Masanobu YAMANOBE