Patents by Inventor Masanori ASAHARA

Masanori ASAHARA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11373895
    Abstract: An etching method is performed using a plasma processing apparatus that includes a processing chamber equipped with a support stage that accommodates a substrate, a first annular member disposed around the substrate and at least a part of the first annular member is disposed in a space between a lower surface of an outer peripheral portion of the substrate and an upper surface of the support stage, and a second annular member disposed outside the first annular member. The etching method includes adjusting a dielectric constant in the space using the first annular member in accordance with consumption of the second annular member; and etching the substrate.
    Type: Grant
    Filed: June 30, 2020
    Date of Patent: June 28, 2022
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Fumiaki Ariyoshi, Masanori Asahara, Shunsuke Aizawa, Akihito Fushimi
  • Patent number: 11037763
    Abstract: There is provision of a member used in a plasma processing apparatus configured to generate plasma from a gas in a processing vessel and to process a substrate disposed on a mounting base in the processing vessel using the plasma. The member includes a surface exposed to the plasma in the processing vessel in a state installed in the processing vessel, and a coating layer including cobalt which covers a part of the surface.
    Type: Grant
    Filed: May 25, 2018
    Date of Patent: June 15, 2021
    Assignee: Tokyo Electron Limited
    Inventors: Yuki Sugawara, Masanori Asahara, Masafumi Urakawa
  • Publication number: 20210142990
    Abstract: A plasma processing apparatus includes a placing table configured to place a substrate thereon; a chamber accommodating the placing table therein; a gas supply unit configured to supply a processing gas into the chamber; a plasma forming device configured to form plasma within the chamber; a consumption member which is disposed in a space in which the plasma is formed, and which is consumed by the plasma; and a controller. The consumption member includes a base member made of a material including an oxygen element; and a cover member made of a material which does not include the oxygen element. At least a part of a surface of the base member exposed to the space in which the plasma is formed is covered with the cover member.
    Type: Application
    Filed: November 11, 2020
    Publication date: May 13, 2021
    Inventor: Masanori Asahara
  • Publication number: 20210005503
    Abstract: An etching method is performed using a plasma processing apparatus that includes a processing chamber equipped with a support stage that accommodates a substrate, a first annular member disposed around the substrate and at least a part of the first annular member is disposed in a space between a lower surface of an outer peripheral portion of the substrate and an upper surface of the support stage, and a second annular member disposed outside the first annular member. The etching method includes adjusting a dielectric constant in the space using the first annular member in accordance with consumption of the second annular member; and etching the substrate.
    Type: Application
    Filed: June 30, 2020
    Publication date: January 7, 2021
    Applicant: TOKYO ELECTRON LIMITED
    Inventors: Fumiaki ARIYOSHI, Masanori ASAHARA, Shunsuke AIZAWA, Akihito FUSHIMI
  • Publication number: 20180350567
    Abstract: There is provision of a member used in a plasma processing apparatus configured to generate plasma from a gas in a processing vessel and to process a substrate disposed on a mounting base in the processing vessel using the plasma. The member includes a surface exposed to the plasma in the processing vessel in a state installed in the processing vessel, and a coating layer including cobalt which covers a part of the surface.
    Type: Application
    Filed: May 25, 2018
    Publication date: December 6, 2018
    Inventors: Yuki SUGAWARA, Masanori ASAHARA, Masafumi URAKAWA