Abstract: The present invention provides a object detection device for vehicle capable of performing distance measurement more reliably than in the past and having high compatibility for distance measurement. The present invention provides an object detection device 100 for vehicle including a first detection unit 10, a second detection unit 20, an error quantity calculation unit 30, a correction quantity calculation unit 40, and a distance correction unit 50. The error quantity calculation unit 30 compares the distances D1 and D1? of the same object detected by the first detection unit 10 and the second detection unit 20 to calculate the error quantity ?D. The correction quantity calculation unit 40 calculates the correction quantity CAt based on the error quantity ?D. The distance correction unit 50 corrects the distances D1? and D2? of the object detected by the second detection unit 20 based on the correction quantity CAt.

Abstract: A plating method can fill a plated metal into interconnect recesses at a higher rate without forming voids in the plated metal embedded in the interconnect recesses. The plating method includes: preparing a substrate having interconnect recesses in a surface; carrying out first pretreatment of the substrate by immersing the substrate in a first pretreatment solution containing an accelerator, a metal ion and an acid; carrying out second pretreatment of the substrate by immersing the substrate in a second pretreatment solution containing an additive which inhibits the effect of the accelerator contained in the first pretreatment solution, and not containing an accelerator; and then carrying out electroplating of the substrate surface by using a plating solution containing at least a metal ion, an acid and a suppressor, and not containing an accelerator, thereby filling the plated metal into the interconnect recesses.

Abstract: A substrate plating method makes it possible to plate a metal, such as copper or a copper alloy, uniformly into fine recesses in a substrate without forming voids in the metal-filled recesses. The substrate plating method for filling a metal into fine recesses in a surface to be plated of a substrate includes carrying out first plating on the surface to be plated in a plating solution containing a plating accelerator as an additive, carrying out plating accelerator removal processing by bringing a remover, having the property of removing or decreasing the plating accelerator adsorbed on the plating surface, into contact with the plating surface, and then carrying out second plating on the plating surface at a constant electric potential.

Abstract: A substrate plating method makes it possible to plate a metal, such as copper or a copper alloy, uniformly into fine recesses in a substrate without forming voids in the metal-filled recesses. The substrate plating method for filling a metal into fine recesses in a surface to be plated of a substrate includes carrying out first plating on the surface to be plated in a plating solution containing a plating accelerator as an additive, carrying out plating accelerator removal processing by bringing a remover, having the property of removing or decreasing the plating accelerator adsorbed on the plating surface, into contact with the plating surface, and then carrying out second plating on the plating surface at a constant electric potential.