Patents by Inventor Masanori Hiyoshi
Masanori Hiyoshi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9686894Abstract: A size S1 of each of projections 32b provided on an outer perimeter of a sprocket 32 in a proceeding direction of a tape member 20 at a height where each of the projections 32b is engaged with each of feed holes 22 of the tape member 20 is larger than a diameter D of each of the feed holes 22 of the tape member 20, and a size S2 of each of the projections 32b in a direction perpendicular to the proceeding direction of the tape member 20 at a height where each of the projections 32b is engaged with each of the feed holes 22 of the tape member 20 is smaller than the diameter D of each of the feed holes 22 of the tape member 20.Type: GrantFiled: August 16, 2012Date of Patent: June 20, 2017Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Kazunori Kanai, Masanori Hiyoshi, Shigekazu Yoneyama, Satoshi Kawaguchi
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Publication number: 20140150256Abstract: A size S1 of each of projections 32b provided on an outer perimeter of a sprocket 32 in a proceeding direction of a tape member 20 at a height where each of the projections 32b is engaged with each of feed holes 22 of the tape member 20 is larger than a diameter D of each of the feed holes 22 of the tape member 20, and a size S2 of each of the projections 32b in a direction perpendicular to the proceeding direction of the tape member 20 at a height where each of the projections 32b is engaged with each of the feed holes 22 of the tape member 20 is smaller than the diameter D of each of the feed holes 22 of the tape member 20.Type: ApplicationFiled: August 16, 2012Publication date: June 5, 2014Applicant: PANASONIC CORPORATIONInventors: Kazunori Kanai, Masanori Hiyoshi, Shigekazu Yoneyama, Satoshi Kawaguchi
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Patent number: 8152049Abstract: The present invention aims at providing an electronic component mounting apparatus and an electronic component mounting method that perform automated setting of a thickness of a paste film.Type: GrantFiled: August 23, 2007Date of Patent: April 10, 2012Assignee: Panasonic CorporationInventors: Takeshi Morita, Masanori Hiyoshi
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Patent number: 7870991Abstract: In a mounting system having a height measuring instrument for measuring the height of solder paste printed on the electrodes and an electronic component placing apparatus, whether the height of solder paste is right or wrong is determined based on the measurement result of measuring the height of solder paste printed on the electrode. Further, whether or not the transfer of solder paste to the solder bump is required based on the determination result, and if it is determined that the transfer is required, the paste is transferred to an electronic component held in a mounting head. Thereby, the mounting quality can be assured by adding adequately an amount of solder in treating the board causing a shortage of the solder amount due to printing failure.Type: GrantFiled: September 6, 2007Date of Patent: January 18, 2011Assignee: Panasonic CorporationInventors: Kazuo Okamoto, Syoichi Nishi, Takeshi Morita, Masanori Hiyoshi, Kazuhiko Tomoyasu
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Publication number: 20100230472Abstract: In a mounting system having a height measuring instrument for measuring the height of solder paste printed on the electrodes and an electronic component placing apparatus, whether the height of solder paste is right or wrong is determined based on the measurement result of measuring the height of solder paste printed on the electrode. Further, whether or not the transfer of solder paste to the solder bump is required based on the determination result, and if it is determined that the transfer is required, the paste is transferred to an electronic component held in a mounting head. Thereby, the mounting quality can be assured by adding adequately an amount of solder in treating the board causing a shortage of the solder amount due to printing failure.Type: ApplicationFiled: September 6, 2007Publication date: September 16, 2010Applicant: PANASONIC CORPORATIONInventors: Kazuo Okamoto, Syoichi Nishi, Takeshi Morita, Masanori Hiyoshi, Kazuhiko Tomoyasu
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Patent number: 7793817Abstract: To provide an electronic component placing apparatus and an electronic component mounting method that can prevent a cold joint from occurring when an electronic component likely to cause warp deformation is mounted by means of soldering. In the electronic component placing apparatus for placing the electronic component 16 with a plurality of solder bumps 16a formed on a lower surface on a board, a film 7a having a film thickness distribution for transferring a desired transfer amount of solder paste according to a state of warp deformation to each of the plurality of solder bumps is formed in a paste transfer unit 24, based on the component warp information indicating the state of warp deformation in a reflow process of the electronic component. Thereby, it is possible to prevent a cold joint from occurring when the electronic component likely to cause warp deformation is mounted by means of soldering by additionally supplying a just enough amount of solder to each solder bump 16a.Type: GrantFiled: September 6, 2007Date of Patent: September 14, 2010Assignee: Panasonic CorporationInventors: Kazuo Okamoto, Syoichi Nishi, Takeshi Morita, Masanori Hiyoshi, Kazuhiko Tomoyasu
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Publication number: 20100163602Abstract: To provide an electronic component placing apparatus and an electronic component mounting method that can prevent a cold joint from occurring when an electronic component likely to cause warp deformation is mounted by means of soldering. In the electronic component placing apparatus for placing the electronic component 16 with a plurality of solder bumps 16a formed on a lower surface on a board, a film 7a having a film thickness distribution for transferring a desired transfer amount of solder paste according to a state of warp deformation to each of the plurality of solder bumps is formed in a paste transfer unit 24, based on the component warp information indicating the state of warp deformation in a reflow process of the electronic component. Thereby, it is possible to prevent a cold joint from occurring when the electronic component likely to cause warp deformation is mounted by means of soldering by additionally supplying a just enough amount of solder to each solder bump 16a.Type: ApplicationFiled: September 6, 2007Publication date: July 1, 2010Applicant: PANASONIC CORPORATIONInventors: Kazuo Okamoto, Syoichi Nishi, Takeshi Morita, Masanori Hiyoshi, Kazuhiko Tomoyasu
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Patent number: 7712652Abstract: First components and second components in which bumps are formed on the lower surface thereof and laminate structures are formed by mounting them to stack with each other on a circuit board 13 are picked up from a component supply unit 1 using a placement head 16, and by lifting and lowering the placement head 16 holding the first components and the second components relative to a paste transfer device 5 supplying a flux 10 in the manner such as coating films having two types of different thicknesses, the flux 10 is supplied to the bumps of the plurality of components in a bundle using a transfer coating method. With such a configuration, it is possible to efficiently perform a component mounting with a satisfactory adhesiveness by ensuring an optimal amount of application quantity of a paste.Type: GrantFiled: May 3, 2007Date of Patent: May 11, 2010Assignee: Panasonic CorporationInventors: Takeshi Morita, Masanori Hiyoshi
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Patent number: 7684061Abstract: An electronic component mounting apparatus includes a beam projector for projecting a laser beam, a beam receiver which is placed in opposition to the beam projector and which receives a laser beam projected from the beam projector, a light-reception-sensitivity setting unit for adjusting light-reception sensitivity of the beam receiver, a projection-side orifice provided in the beam projector to narrow a projection spot diameter of the laser beam, and a reception-side orifice provided in the beam receiver to narrow a light-reception spot diameter, where the light-reception sensitivity of the beam receiver is improved. As a result, an electronic component mounting apparatus capable of accurately detecting height size of small components by using a relatively inexpensive photoelectric sensor can be provided.Type: GrantFiled: June 29, 2006Date of Patent: March 23, 2010Assignee: Panasonic CorporationInventors: Masanori Hiyoshi, Hidehiro Saho, Noboru Yamasaki, Tadashi Endo
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Publication number: 20090321499Abstract: The present invention aims at providing an electronic component mounting apparatus and an electronic component mounting method that perform automated setting of a thickness of a paste film.Type: ApplicationFiled: August 23, 2007Publication date: December 31, 2009Applicant: PANASONIC CORPORATIONInventors: Takeshi Morita, Masanori Hiyoshi
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Publication number: 20090225304Abstract: An electronic component mounting apparatus includes a beam projector for projecting a laser beam, a beam receiver which is placed in opposition to the beam projector and which receives a laser beam projected from the beam projector, a light-reception-sensitivity setting unit for adjusting light-reception sensitivity of the beam receiver, a projection-side orifice provided in the beam projector to narrow a projection spot diameter of the laser beam, and a reception-side orifice provided in the beam receiver to narrow a light-reception spot diameter, where the light-reception sensitivity of the beam receiver is improved. As a result, an electronic component mounting apparatus capable of accurately detecting height size of small components by using a relatively inexpensive photoelectric sensor can be provided.Type: ApplicationFiled: June 29, 2006Publication date: September 10, 2009Inventors: Masanori Hiyoshi, Hidehiro Saho, Noboru Yamasaki, Tadashi Endo
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Publication number: 20070262118Abstract: First components and second components in which bumps are formed on the lower surface thereof and laminate structures are formed by mounting them to stack with each other on a circuit board 13 are picked up from a component supply unit 1 using a placement head 16, and by lifting and lowering the placement head 16 holding the first components and the second components relative to a paste transfer device 5 supplying a flux 10 in the manner such as coating films having two types of different thicknesses, the flux 10 is supplied to the bumps of the plurality of components in a bundle using a transfer coating method. With such a configuration, it is possible to efficiently perform a component mounting with a satisfactory adhesiveness by ensuring an optimal amount of application quantity of a paste.Type: ApplicationFiled: May 3, 2007Publication date: November 15, 2007Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.Inventors: Takeshi MORITA, Masanori HIYOSHI