Patents by Inventor Masanori Iriyama

Masanori Iriyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Manufacturing method and manufacturing apparatus of printed wiring board
    Patent number: 7823762
    Abstract: A solder ball is loaded on a bump having a small height (FIG. 5(B)) and the height of the bump is intensified by melting the solder ball by heating with laser (FIG. 5(C)). Thus, the heights of the bumps are adjusted within a requested allowable range. Because the bump is not removed by heating when the height of the low bump is intensified, the printed wiring board is not subjected to local heat history thereby intensifying reliability of the bump of a printed wiring board.
    Type: Grant
    Filed: September 28, 2006
    Date of Patent: November 2, 2010
    Assignee: IBIDEN Co., Ltd.
    Inventors: Yoichiro Kawamura, Katsuhiko Tanno, Masanori Iriyama, Sho Akai
  • Manufacturing method and manufacturing apparatus of printed wiring board
    Publication number: 20080078810
    Abstract: A solder ball is loaded on a bump having a small height (FIG. 5(B)) and the height of the bump is intensified by melting the solder ball by heating with laser (FIG. 5(C)). Thus, the heights of the bumps are adjusted within a requested allowable range. Because the bump is not removed by heating when the height of the low bump is intensified, the printed wiring board is not subjected to local heat history thereby intensifying reliability of the bump of a printed wiring board.
    Type: Application
    Filed: September 28, 2006
    Publication date: April 3, 2008
    Applicant: IBIDEN CO., LTD.
    Inventors: Yoichiro Kawamura, Katsuiko Tanno, Masanori Iriyama, Sho Akai