Abstract: Forceps include a tubular shaft, an inserted member, a gripping portion, a handle, and a fixing portion. The inserted member is a rod-like member that is inserted inside the tubular shaft and is movable in an axial direction inside the tubular shaft. The gripping portion is provided at a distal end of the inserted member and is coupled to a distal end of the tubular shaft. The handle is coupled to a terminal end of the inserted member. The fixing portion detachably fixes the handle to the tubular shaft in a state where the handle is coupled to the inserted member. The distal end of the tubular shaft has a larger diameter than the diameter of a main body of the tubular shaft. A joint portion, having a smaller diameter than the diameter of the main body of the tubular shaft, is formed at the terminal end of the inserted member. The handle is provided with a joint receptacle that houses the joint portion and is advanced and retracted by manipulation of the handle.

Abstract: To obtain a sugar-plum shaped composite particle, a reaction vessel with 300 parts by weight of water placed therein is charged with 30 parts by weight of polymethyl methacraylate resin particles of 2 ?m average particle diameter, and ultrasonic waves are applied to the mixture for 1 minute to obtain a particle dispersion liquid. Subsequently, 15 parts by weight of methyltrimethoxysilane is added to the dispersion liquid to obtain methyltrimethoxysilane hydrolyzates in the dispersion liquid. Thereafter, 10 parts by weight of 1 weight % aqueous ammonia is added thereto and agitated. One minute later, the agitation is discontinued, and the mixture is allowed to stand still for 10 hours to effect maturation. The resultant mixture is filtered and dried to obtain sugar-plum-shaped particles provided on their surfaces with polyorganosiloxane projections.

Abstract: Forceps include a tubular shaft, an inserted member, a gripping portion, a handle, and a fixing portion. The inserted member is a rod-like member that is inserted inside the tubular shaft and is movable in an axial direction inside the tubular shaft. The gripping portion is provided at a distal end of the inserted member and is coupled to a distal end of the tubular shaft. The handle is coupled to a terminal end of the inserted member. The fixing portion detachably fixes the handle to the tubular shaft in a state where the handle is coupled to the inserted member. The distal end of the tubular shaft has a larger diameter than the diameter of a main body of the tubular shaft. A joint portion, having a smaller diameter than the diameter of the main body of the tubular shaft, is formed at the terminal end of the inserted member. The handle is provided with a joint receptacle that houses the joint portion and is advanced and retracted by manipulation of the handle.

Abstract: To obtain a sugar-plum shaped composite particle, a reaction vessel with 300 parts by weight of water placed therein is charged with 30 parts by weight of polymethyl methacraylate resin particles of 2 ?m average particle diameter, and ultrasonic waves are applied to the mixture for 1 minute to obtain a particle dispersion liquid. Subsequently, 15 parts by weight of methyltrimethoxysilane is added to the dispersion liquid to obtain methyltrimethoxysilane hydrolyzates in the dispersion liquid. Thereafter, 10 parts by weight of 1 weight % aqueous ammonia is added thereto and agitated. One minute later, the agitation is discontinued, and the mixture is allowed to stand still for 10 hours to effect maturation. The resultant mixture is filtered and dried to obtain sugar-plum-shaped particles provided on their surfaces with polyorganosiloxane projections.

Abstract: A cover tape comprising at least a substrate layer and a heat sealing layer, wherein (1) an antistatic layer containing an antistatic agent and an anticorrosive agent, is formed on the heat sealing layer, or (2) the heat sealing layer side has an average surface roughness (Ra) of from 0.3 to 1.0 ?m, and has an antistatic agent applied thereon to form an antistatic layer.

Abstract: A carrier tape body having an embossed tape continuously having pockets which contain an electronic component sealed with a cover tape, where the cover tape has a peeling static electrification amount of from ?9 to +9 nC when the cover tape has a surface resistivity of at least 1011 ?, and where the cover tape has a peeling static electrification amount of from ?3 to +3 nC when the cover tape has a surface resistivity of less than 1011 ?.

Abstract: A heat-sealing film having a haze of not more than 30% and having a sealant layer made of a resin composition which comprises from 50 to 100 wt % of the total of the following components (a) to (c): (a) from 5 to 50 wt % of a block copolymer of from 50 to 95 wt % of a styrene-type hydrocarbon and from 5 to 50 wt % of a conjugated diene-type hydrocarbon, (b) from 5 to 50 wt % of an ethylene/?-olefin random copolymer, and (c) from 5 to 70 wt % of a block copolymer of from 10 to 50 wt % of a styrene-type hydrocarbon and from 50 to 90 wt % of a conjugated diene-type hydrocarbon, and (d) from 0 to 50 wt % of an impact-resistant polystyrene.

Abstract: A cover tape comprising at least a substrate layer and a heat sealing layer, wherein (1) an antistatic layer containing an antistatic agent and an anticorrosive agent, is formed on the heat sealing layer, or (2) the heat sealing layer side has an average surface roughness (Ra) of from 0.3 to 1.0 ?m, and has an antistatic agent applied thereon to form an antistatic layer.

Abstract: A heat-sealing film having a haze of not more than 30% and having a sealant layer made of a resin composition which comprises from 50 to 100 wt % of the total of the following components (a) to (c): (a) from 5 to 50 wt % of a block copolymer of from 50 to 95 wt % of a styrene-type hydrocarbon and from 5 to 50 wt % of a conjugated diene-type hydrocarbon, (b) from 5 to 50 wt % of an ethylene/?-olefin random copolymer, and (c) from 5 to 70 wt % of a block copolymer of from 10 to 50 wt % of a styrene-type hydrocarbon and from 50 to 90 wt % of a conjugated diene-type hydrocarbon, and (d) from 0 to 50 wt % of an impact-resistant polystyrene.

Abstract: A heat-stealing film having a baze of not more than 30% and having a sealant layer made of a resin composition which comprises from 50 to 100 wt % of the total of the following components (a) to (c); (a) from 5 to 50 wt % of a block copolymer of from 50 to 95 wt % of a styrene-type hydrocarbon and from 5 to 50 wt % of a conjugated diene-type hydrocarbon, (b) from 5 to 50 wt % of an ethylene/?-olefin random copolymer, and (c) from 5 to 70 wt % of a block copolymer of from 10 to 50 wt % of a styrene-type hydrocarbon and from 50 to 90 wt % of a conjugated diene-type hydrocarbon, and (d) from 0 to 50 wt % of and impact-resistant polystyrene.

Abstract: In order to prevent impairment due to static electricity in a container for an electronic component, generation of static electricity itself has to be inhibited. The peeling static electrification amount of a cover tape should be from −9 to +9 nC when the cover tape has a surface resistivity of at least 1011 &OHgr;, or it should be from −3 to +3 nC when the cover tape has a surface resistivity of less than 1011 &OHgr;. In a carrier tape body, a side of a cover tape which faces an electronic component should have a composition containing a resin on the positive polarity side and a resin on the negative polarity side relative to a side of the electronic component which faces the cover tape in the series of frictional electrification. For the surface of a container to be in contact with an electronic component, a material which is less likely to generate static electricity should be employed.

Abstract: A method for fabricating a semiconductor device includes the steps of forming a plurality of semiconductor chips on a semiconductor substrate, forming a connection part such that the connection part connects the semiconductor chips with other across an dicing line, bonding the semiconductor substrate upon a support substrate, removing the dicing region while maintaining the semiconductor chips in a state such that the semiconductor chips are bonded upon the support substrate, detaching the plurality of semiconductor chips from the support substrate while maintaining an alignment between the semiconductor chips, and separating the semiconductor chips from each other by eliminating the connection part.

Abstract: A method of producing a semiconductor device including a step of forming separation grooves in scribing regions defined at boundary portions between a plurality of semiconductor-device forming portions formed on a top surface of a semiconductor substrate; a step of defining portions of the scribing regions in the semiconductor substrate as substrate connecting portions; and a step of cutting off the substrate connecting portions along the separation grooves, to thereby separate the plurality of semiconductor-device forming portions into chips. These production steps contribute to a higher working efficiency in a later assembling process and to improved mass-production.

Abstract: A method for fabricating a semiconductor device including the steps of forming a plurality of semiconductor chips on a semiconductor substrate, forming a connection part such that the connection part connects the semiconductor chips with each other across a dicing line, bonding the semiconductor substrate upon a support substrate, removing the dicing region while maintaining the semiconductor chips in a state such that the semiconductor chips are bonded upon the support substrate, detaching the plurality of semiconductor chips from the support substrate while maintaining an alignment between the semiconductor chips, and separating the semiconductor chips from each other by eliminating the connection part.

Abstract: A file compression processor of the present invention comprises a file status monitor which compares the current available capacity on the file unit to record files and the threshold value predetermined as the upper limit of the available capacity and a file compression portion which compresses a file on said file unit when the file status monitor judges that the current available capacity is smaller than the threshold.

Abstract: A synchronous rectifying circuit for a switching power supply is disclosed which is arranged such that the necessity to provide a diode element in parallel with a rectifying transistor is eliminated so that a highly efficient and stable operation can be achieved. "On" drive signal of a switching transistor (Q1) is detected by a first limiter circuit (6), and a flip-flop circuit (5) causes a rectifying transistor (Q2) to be turned off in response to output of the first limiter circuit (6); turning-off operation of the switching transistor (Q1) is detected by a second limiter circuit (7), and the flip-flop circuit (5) causes the rectifying transistor (Q2) to be turned on in response to output of the second limiter circuit (7). The necessity to provide a diode element in parallel with the rectifying transistor is eliminated. Stable operation can be performed even if the switching element has an indefinite operation delay time. An enhanced efficiency can be achieved.

Abstract: The present invention provides an AC-DC converter in which a voltage at a light load is kept from rising, and an application range of an AC input voltage can be made broader. In the AC-DC converter having a rectifier 3, a boost chopper 4 and a DC--DC converter, a PWM circuit 6, a frequency divider 7 and a peak value detector 8 are further arranged. A first pulse signal V.sub.pa which the PWM circuit 6 outputs is inputted to a first switching transistor Q1 in the DC--DC converter 5 and the frequency divider 7. The frequency divider 7 divides a frequency of the first pulse signal V.sub.pa according to a frequency dividing control signal which the peak value detector 8 outputs, for monitoring a rectified output voltage in the rectifier 3 and outputs a second pulse signal V.sub.pb generated by the frequency divider 7 to the second switching transistor Q2 in the boost chopper 4.

Abstract: In a buffer asynchronous output apparatus comprising a plurality of renewal processing programs each of which renews one of buffer areas in a system shared buffer unit as a renewed buffer area, a copied buffer area securing section secures a copied buffer area. A renewed buffer area copying section copies contents of the renewed buffer area into the copied buffer area. An output request enqueuing section enqueues an output request into an output request waiting queue. Performed asynchronously with the renewal processing programs, an output processing program comprises a file outputting section for outputting contents of the copied buffer area into a file device on reception of the output request dequeued from the output request waiting queue. After completion of a file output processing by means of the file outputting section, an output completion informing section stores an output completion status and a file output result status in a copied buffer information field on a buffer control table.

Abstract: The present invention provides an AC-DC converter in which an application range of an AC input voltage can be extended, keeping a voltage in a circuit from rising at a light load. In an AC-DC converter having a rectifier 3, a boost chopper 4 and a DC-DC converter 5, a PWM circuit 6, an one-shot multivibrator 7, a pulse synthesizer 8 and a comparator 9 are further arranged. The pulse synthesizer 8 generates a second pulse signal having a pulse width being narrower by a pulse width of the delay pulse V.sub.pD than that of the first pulse signal V.sub.pa by means of the first pulse signal V.sub.pa which the PWM circuit 6 output s and a delay pulse V.sub.pD generating in said one-shot multivibrator 7. The comparator 9 compares a voltage V.sub.C boosted up by the boost chopper 4 with a reference voltage V.sub.REF to stop generating the delay pulse when voltage V.sub.C drops below the reference voltage V.sub.REF .

Abstract: A method for manufacturing a compound semiconductor device in which a mixed crystal layer containing a III-V group compound is formed on a substrate, characterized in that when a part of the mixed crystal layer is subjected to etching by an etching liquid, the etching portion is subjected to etching while maintaining the state of not exposing light to the etching portion.