Abstract: A peeling device according to the present disclosure includes a holding unit, a plurality of suction moving units, a state detection unit and a control unit. The holding unit is configured to hold a first substrate of a superposed substrate having the first substrate and a second substrate joined. The suction moving units are configured to suction-hold the second substrate of the superposed substrate and move the second substrate in a direction away from a surface of the first substrate. The state detection unit is configured to detect a peeled-off state of the second substrate from the first substrate. The control unit is configured to control operation timings of the suction moving units so that the second substrate is peeled off from the first substrate gradually from one end of the second substrate toward the other end thereof, based on the peeled-off state detected by the state detection unit.

Abstract: Provided is a peeling apparatus including a first holding unit, a second holding unit, and a peeling inducing unit. The first holding unit holds a first substrate of a superimposed substrate in which the first substrate and a second substrate are bonded. The second holding unit holds the second substrate of the superimposed substrate and moves the second substrate in a direction of separating the second substrate from a surface of the first substrate. The peeling inducing unit forms an area where the second substrate starts to be peeled off from the first substrate on a side surface of the superimposed substrate. The peeling inducing unit includes a sharp member, and a moving mechanism that moves the sharp member toward a side surface portion of the second substrate adjacent to a bonding portion of the first substrate and the second substrate in the side surface of the superimposed substrate.

Abstract: Provided is a peeling apparatus includes a first holding unit, a second holding unit, and a peeling inducing unit. The first holding unit holds a first substrate of a superimposed substrate in which the first substrate and a second substrate are bonded. The second holding unit holds the second substrate of the superimposed substrate and moves the second substrate in a direction of separating the second substrate from a surface of the first substrate. The peeling inducing unit forms an area where the second substrate starts to be peeled off from the first substrate on a side surface of the superimposed substrate. The second holding unit includes a first suction and moving unit and a second suction and moving unit. The first suction moving unit sucks and moves a circumferential edge portion of the second corresponding to the area formed by the peeling inducing unit, in a direction of separating the circumferential edge portion from the surface of the first substrate.

Abstract: A separation apparatus according to the present disclosure includes a first holding unit, a cutting unit, a measuring unit and a position adjusting unit. The first holding unit holds a first substrate of a superposed substrate formed by joining the first substrate and a second substrate. The cutting unit cuts a joining portion of the first substrate and the second substrate. The measuring unit measures a distance from a predetermined measurement reference position to a holding surface of the first holding unit or to an object interposed between the measurement reference position and the holding surface. The position adjusting unit adjusts a cutting position of the cutting unit based on a result of the measuring unit and information acquired in advance with respect to a thickness of the superposed substrate.

Abstract: Provided is a delamination device of delaminating a laminated substrate obtained by bonding a first substrate and a second substrate, the laminated substrate being disposed in an opening of a frame, the opening having a diameter larger than that of the laminated substrate, and the laminated substrate being held by the frame with a non-bonding surface of the first substrate attached to a tape provided in the opening. The delamination device includes: a first holding unit configured to hold the second substrate of the laminated substrate from above; a second holding unit configured to hold the first substrate of the laminated substrate from below through the tape; and a moving mechanism configured to move the first holding unit in a direction away from the second holding unit.

Abstract: The storage apparatus of the present invention includes a disk controller (CM) that issues a command to a disk via a fabric device. The CM controls the number of commands to be issued to the disk based on the structure of the storage apparatus and the operation state of the storage apparatus.

Abstract: In a combination including a pitcher-type water purifier and its purification cartridge, which can adsorb and eliminate chemical substances such as chlorine from raw water, eliminate bacteria, and prevent propagation of bacteria and provide safe purified water in a short period of time, even when the purified water has been stored for a long-period time, the pitcher type water purifier contains a casing divided into upper and lower parts as a raw water reservoir portion and a purified water reservoir portion, and has a purified water pouring opening in the purified water reservoir portion; and the purification cartridge has a raw water inlet in an upper face thereof and a purified water outlet in a bottom face, and adsorbent is filled in an upper layer of an interior thereof and hollow fiber membranes are filled in a lower layer thereof at an opening rate ? of 25-58%.

Abstract: The storage apparatus of the present invention includes a disk controller (CM) that issues a command to a disk via a fabric device. The CM controls the number of commands to be issued to the disk based on the structure of the storage apparatus and the operation state of the storage apparatus.

Abstract: To provide a layout verification method capable of accurately detecting damage to be given to a gate, and to provide a higher-workability and higher-reliability design method to accurately detect damage to be given to a gate and to determine an approach for design correction to avoid damage, the layout verification method according to the invention is characterized in that an antenna value which is an estimated value of transistor gate damage is output based on an antenna ratio, and a fluctuation of plasma charging damage due to the layout near the transistor gate.

Abstract: The semiconductor integrated circuit of the present invention comprises a clock circuit for generating a clock signal. The clock circuit comprises a clock control circuit for controlling propagation of the clock signal. The clock control circuit comprises a burn-in control signal input terminal for inputting a burn-in control signal that controls operation state of the clock circuit when performing burn-in processing, and a clock control signal output terminal for outputting the clock signal. The clock control circuit controls propagation of the clock signal outputted from the clock control signal output terminal based on the burn-in control signal inputted to the burn-in control signal input terminal.

Abstract: To provide a layout verification method capable of accurately detecting damage to be given to a gate, and to provide a higher-workability and higher-reliability design method to accurately detect damage to be given to a gate and to determine an approach for design correction to avoid damage, the layout verification method according to the invention is characterized in that an antenna value which is an estimated value of transistor gate damage is output based on an antenna ratio, and a fluctuation of plasma charging damage due to the layout near the transistor gate.

Abstract: A vibration machining device comprises a frame that forms a structure, a shaft that is rotatably held by the frame, an actuator that rotatably drives the shaft, a cam that is attached to the shaft and the cam surface of which reciprocates when the cam rotates because its height changes in the direction of rotation axis of the shaft, a spindle that holds a machining tool and which is supported so as to be able to reciprocate in its axial direction, and a transfer mechanism that transfers the reciprocation of the cam surface of the cam such that the spindle reciprocates in its axial direction. The reciprocating motion of the cam surface describes a modified sine curve during the period of one complete rotation of the cam.

Abstract: A metal foil (10) and a metal plate (1) are used to form an electromagnetic shield for an electronic device. A protrusion (11) is formed on the metal foil (10) by rolling up the edge, and this protrusion (11) is fitted into a hole (30) formed in the metal plate (1). The metal foil (10) is further fixed to the metal plate (1) with screws (80). Thus, it is possible to form the electromagnetic shield for an electronic device at low costs.

Abstract: The present invention has an object to provide a pitcher type water purifier and a purification cartridge for the water purifier, which can adsorb and eliminate chemical substances such as chlorine and the like from raw water, eliminate bacteria and, even when the purified water has been stored for a long period of time, can prevent propagation of bacteria and can provide purified water with high safety in a short period of time.

Abstract: The present invention belongs to a technical field for manufacturing a three-dimensional structure for an electronic device such as a radio wave shielding member through extension working of a metal plate having cuts. In conventional three-dimensional working of a metal plate, there is a problem in that a non-extension portion is wrinkled depending on extension of a cut. In the present invention, a connecting portion (3) extended in a second direction (D2) is provided at an equal pitch (p) in a first direction (D1) through an opening (4) having a rectangular cross-section in an intermediate portion (PB) between a cut forming portion (PC) having cuts (2) provided like a zigzag in the first direction (D1) and a non-extension portion (PA) having no cut in a metal plate (1). Consequently, even if the cut forming portion (PC) is extended, the connecting portion (3) is simply squashed and contracted and a boundary line (BL) portion is not deformed.

Abstract: A metal foil (10) and a metal plate (1) are used to form an electromagnetic shield for an electronic device. A protrusion (11) is formed on the metal foil (10) by rolling up the edge, and this protrusion (11) is fitted into a hole (30) formed in the metal plate (1). The metal foil (10) is further fixed to the metal plate (1) with screws (80). Thus, it is possible to form the electromagnetic shield for an electronic device at low costs.