Patents by Inventor Masanori Mikawa

Masanori Mikawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Mold for resin sealing
    Patent number: 6276913
    Abstract: In the surface of a lower die 104 in a resin sealing mold, a region where an external leads 18 of a lead frame 12 and its peripheral regions having a width of 0.1 mm are mirror-finished to form a mirror-face region 22. The other region than the mirror-face region is subjected to discharging processing to form a satin-finished region 24. The resin-sealing mold having such a structure permits a package to be smoothly released and prevents resin from remaining.
    Type: Grant
    Filed: February 2, 2000
    Date of Patent: August 21, 2001
    Assignee: Mitsui High-Tech Inc.
    Inventors: Masanori Mitsui, Masanori Mikawa