Abstract: A transparent adhesive sheet for optics, which is capable of satisfying both adhesion and rework property, in view of the above problems of prior art. A production method of a silicone-based transparent adhesive sheet for optics for assembling the optical components, includes a step of forming a surface activation treated surface, in which peel strength after laminating onto an adherend increases with time, as compared with peel strength before lamination. The surface activation treatment is performed by using UV-ray irradiation on at least a part or the entire surface of an adhesive face contacting with the adherend of said transparent adhesive sheet for optics.

Abstract: The present invention discloses a transparent adhesive sheet for optics, which is capable of satisfying both adhesion and rework property, in view of the above problems of prior art. A production method of a silicone-based transparent adhesive sheet for optics for assembling the optical components, characterized by forming a surface activation treated surface, in which peel strength after laminating onto an adherend increases with time, as compared with peel strength before lamination, by performing surface activation treatment using UV-ray irradiation on at least a part or the entire surface of an adhesive face contacting with the adherend of said transparent adhesive sheet for optics, and a transparent adhesive sheet for optics obtained from the production method thereof, and the like.

Abstract: As means for solving a problem of a positional shift of a land and a hole which is caused by an alignment in the formation of an etching resist layer and a plated resist layer in a method of manufacturing a circuit board, there are provided a method of manufacturing a circuit board including the steps of forming a first resin layer on a surface of an insulating substrate having a conductive layer on the surface and an internal wall of a through hole or/and a non-through hole, forming a second resin layer which is insoluble or slightly soluble in a developing solution for the first resin layer on the first resin layer provided on the surface conductive layer, and removing the first resin layer provided over the hole with the developing solution for the first resin layer, and a method of manufacturing a circuit board including the step of uniformly charging a surface of the first resin layer to induce a potential difference to the first resin layer provided over the hole and the first resin layer provided on th

Abstract: As means for solving a problem of a positional shift of a land and a hole which is caused by an alignment in the formation of an etching resist layer and a plated resist layer in a method of manufacturing a circuit board, there are provided a method of manufacturing a circuit board including the steps of forming a first resin layer on a surface of an insulating substrate having a conductive layer on the surface and an internal wall of a through hole or/and a non-through hole, forming a second resin layer which is insoluble or slightly soluble in a developing solution for the first resin layer on the first resin layer provided on the surface conductive layer, and removing the first resin layer provided over the hole with the developing solution for the first resin layer, and a method of manufacturing a circuit board including the step of uniformly charging a surface of the first resin layer to induce a potential difference to the first resin layer provided over the hole and the first resin layer provided on th

Abstract: Disclosed is disclosed a process for producing a printed wiring board which comprises the steps of: a) exposing a wiring board having at least one photoconductive layer in which its chargeability is changed by light exposure on at least one surface of a conductive support which comprises an insulating substrate and at least one metal conductive layer provided at least one surface thereof through a resist pattern; b) charging the photoconductive layer to form an electrostatic latent image; c) forming a toner image on the photoconductive layer by toner developing treatment; d) removing a portion of the photoconductive layer to which no toner is attached by dissolution to form a resist image; and e) removing a portion of the metal conductive layer other than a portion where the resist image is formed by etching.

Abstract: There is disclosed a liquid developing method of a printed wiring board using a one-surface stepwise developing system which forms a resist pattern stepwisely according to an electrophotographic reverse developing method on each surface of a material to be developed obtained by forming photo-conductive layers on both surfaces of a both-surfaces copper-clad laminated board, wherein the method comprises the steps of subjecting to a static charging treatment on a surface to which no electrostatic latent image is formed which surface is positioned opposing to an electrostatic latent image-formed surface which is a surface to be exposed, or to a non-developing surface between completion of an exposure treatment and before a liquid toner developing treatment, and subjecting to the liquid toner developing treatment to form a toner image corresponding to the resist pattern on the electrostatically latent image-formed surface.

Abstract: Disclosed is disclosed a process for producing a printed wiring board which comprises the steps of: