Abstract: A multilayer substrate includes a multilayer body including resin layers stacked in a Z-axis direction, a signal conductor layer, and one or more through conductors passing through a first resin layer in the Z-axis direction. A first main surface of the first resin layer includes one or more hollow portions not in contact with the signal conductor layer and overlapping the signal conductor layer when viewed in the Z-axis direction. Each of the one or more hollow portions and the one or more through conductors includes a tapered region in which each of a cross-sectional area of the one or more hollow portions orthogonal to the Z-axis direction and a cross-sectional area of the one or more through conductors orthogonal to the Z-axis direction increases toward the first main surface. The tapered region is in contact with the first main surface of the first resin layer.

Abstract: A multilayer resin substrate includes a stacked body including resin layers stacked on each other, a first planar conductor on a resin layer, and an interlayer connection conductor on a resin layer. The interlayer connection conductor includes a first interlayer connection conductor connected to an external conductor, and a second interlayer connection conductor bonded to the first interlayer connection conductor and a planar conductor. The first and second interlayer connection conductors are made of different materials. The second interlayer connection conductor includes a constricted portion including a smaller planar cross-sectional area than a different portion, between a bonding portion to which the first interlayer connection conductor is bonded and a bonding portion to which the planar conductor is bonded.

Abstract: A light emitting element mounting package includes a plate-like substrate and a base that protrudes from a front surface of the substrate and has a mounting surface on which a light emitting element is mounted. A power supply terminal is provided on the front surface of the substrate, and the power supply terminal is arranged in a direction that is opposite to a direction where an emitting surface of the light emitting element is oriented. The light emitting element mounting package further includes a wiring conductor inside the substrate, wherein the wiring conductor extends to a side of the power supply terminal where one end thereof is positioned at a side of the power supply terminal with respect to the emitting surface of the light emitting element and the other end thereof is electrically connected to the power supply terminal.

Abstract: In a transmission line, a signal conductor layer extends in a front-back direction orthogonal to an up-down direction. A ground conductor layer is above the signal conductor layer. When viewed in a first orthogonal direction, first hollow portions are arranged in the front-back direction in a first direction of the signal conductor layer, and second hollow portions are arranged in the front-back direction in a second direction of the signal conductor layer. Each of regions between adjacent first hollow portions in the front-back direction is a first region. Each of regions between adjacent second hollow portions in the front-back direction is a second region. Each of the first hollow portions overlaps with a corresponding one of the second regions when viewed in a second orthogonal direction. Each of the second hollow portions overlaps with a corresponding one of the first regions when viewed in the second orthogonal direction.

Abstract: In a transmission line, a hollow portion overlaps a first ground conductor layer in an up-down direction. In a first orthogonal direction, the hollow portion includes a first portion extending in a second orthogonal direction of a signal conductor layer. In the first portion, a portion at which a width of the first portion in the second orthogonal direction has a first portion maximum width value is a first portion maximum width portion. A portion at which the width of the first portion in the second orthogonal direction has a first portion minimum width value is a first portion minimum width portion. A portion at which the width of the first portion in the second orthogonal direction has a first portion intermediate width value is a first portion intermediate width portion located between the first portion maximum width portion and the first portion minimum width portion in the front-back direction.

Abstract: A light emitting element mounting package includes a plate-like substrate and a base that protrudes from a front surface of the substrate and has a mounting surface on which a light emitting element is mounted. A power supply terminal is provided on the front surface of the substrate, and the power supply terminal is arranged in a direction that is opposite to a direction where an emitting surface of the light emitting element is oriented. The light emitting element mounting package further includes a wiring conductor inside the substrate, wherein the wiring conductor extends to a side of the power supply terminal where one end thereof is positioned at a side of the power supply terminal with respect to the emitting surface of the light emitting element and the other end thereof is electrically connected to the power supply terminal.

Abstract: A multilayer resin substrate includes a stacked body including resin layers stacked on each other, a first planar conductor on a resin layer, and an interlayer connection conductor on a resin layer. The interlayer connection conductor includes a first interlayer connection conductor connected to an external conductor, and a second interlayer connection conductor bonded to the first interlayer connection conductor and a planar conductor. The first and second interlayer connection conductors are made of different materials. The second interlayer connection conductor includes a constricted portion including a smaller planar cross-sectional area than a different portion, between a bonding portion to which the first interlayer connection conductor is bonded and a bonding portion to which the planar conductor is bonded.

Abstract: A multilayer wiring board includes first and second insulating layers, a first conductive wiring layer on the first insulating layer, a second conductive wiring layer on a surface of the second insulating layer facing the first insulating layer, an interlayer connection conductor including an intermetallic compound and penetrating through the first insulating layer to interconnect the first and second conductive wiring layers, a first intermetallic compound layer between the first conductive wiring layer and the interlayer connection conductor, and a second intermetallic compound layer between the second conductive wiring layer and the interlayer connection conductor, wherein the intermetallic compounds in the first and second intermetallic compound layers have a composition different from that of the intermetallic compound in the interlayer connection conductor, and the first intermetallic compound layer is located at a level different from a level of an interface between the first conductive wiring layer an

Abstract: A light-emitting element housing member includes a substrate that is made of a ceramic and internally includes a deep-bottom-type space portion having an opening in at least one position thereof, wherein an inner wall of the space portion serves as a mounting part for a light-emitting element. A light-emitting element housing member includes a mounting part meant for mounting a light-emitting element and includes a substrate that includes a bottom base material having a rectangular shape in a planar view and a wall member provided on the bottom base material to enclose the mounting part in a U-shaped manner and have an opening in at least one portion thereof, wherein the substrate is integrally formed of a ceramic.

Abstract: A multilayer wiring board includes first and second insulating layers, a first conductive wiring layer on the first insulating layer, a second conductive wiring layer on a surface the second insulating layer facing the first insulating layer, an interlayer connection conductor including an intermetallic compound and penetrating through the first insulating layer to interconnect the first and second conductive wiring layers, a first intermetallic compound layer between the first conductive wiring layer and the interlayer connection conductor, and a second intermetallic compound layer between the second conductive wiring layer and the interlayer connection conductor, wherein the intermetallic compounds in the first and second intermetallic compound layers have a composition different from that of the intermetallic compound in the interlayer connection conductor, and the first intermetallic compound layer at a level different from a level of an interface between the first conductive wiring layer and the first in

Abstract: The present invention includes: a substrate 3, a rectangular frame-shaped substrate bank section 5 provided on the substrate 3 and including four corner portions 5A, and a metal layer 9 provided on a top surface 5Aa of the substrate bank section 5. A top surface 5Aa of the corner portions 5A of the substrate bank section 5 may have an inclined portion S slanted downward. An electronic component housing package may have a lid welded onto the metal layer 9 provided on the substrate bank section 5 of the electronic component storage substrate.

Abstract: An electrical element mounting package includes a plate-like substrate and at least one base that protrudes from a front surface of the substrate and has a mounting surface on which an electrical element is mounted, wherein the substrate and the base are made of ceramics integrally. The electrical element mounting package includes an element terminal that is provided on the mounting surface of the base, a side conductor that is provided on a side surface of the base and extends in a thickness direction of the base, and a substrate-side via conductor that is provided inside the substrate and extends in a thickness direction of the substrate, wherein the element terminal, the side conductor, and the substrate-side via conductor are connected to one another.

Abstract: A light-emitting element housing member includes a substrate that is made of a ceramic and internally includes a deep-bottom-type space portion having an opening in at least one position thereof, wherein an inner wall of the space portion serves as a mounting part for a light-emitting element. A light-emitting element housing member includes a mounting part meant for mounting a light-emitting element and includes a substrate that includes a bottom base material having a rectangular shape in a planar view and a wall member provided on the bottom base material to enclose the mounting part in a U-shaped manner and have an opening in at least one portion thereof, wherein the substrate is integrally formed of a ceramic.

Abstract: The present invention includes: a substrate 3, a rectangular frame-shaped substrate bank section 5 provided on the substrate 3 and including four corner portions 5A, and a metal layer 9 provided on a top surface 5Aa of the substrate bank section 5. A top surface 5Aa of the corner portions 5A of the substrate bank section 5 may have an inclined portion S slanted downward. An electronic component housing package may have a lid welded onto the metal layer 9 provided on the substrate bank section 5 of the electronic component storage substrate.

Abstract: The present disclosure provides a surge protection device including a ceramic substrate (1), at least one pair of discharge electrodes (31) disposed on a surface of the ceramic substrate (1) so as to face each other at end portions thereof with a space in between, outer electrodes (32) electrically connected to the corresponding discharge electrodes (31), and a discharge auxiliary electrode (4) disposed between the end portions of the pair of discharge electrodes (31) The discharge auxiliary electrode (4) contains crystalized glass and particles of conductive powder (40) dispersed apart from each other in the crystalized glass.

Abstract: An ESD protection device 1 includes a ceramic insulating material 10, first and second discharge electrodes 21 and 22, and a discharge auxiliary section 51. The discharge auxiliary section 51 is an electrode configured to reduce a discharge starting voltage between the first discharge electrode 21 and the second discharge electrode 22. The discharge auxiliary section 51 comprises a sintered body including conductive particles and at least one of semiconductor particles and insulating particles. At least the discharge auxiliary section 51 comprises at least one of an alkaline metal component and a boron component. The content of at least one of the alkaline metal component and the boron component in the discharge auxiliary section 51 is larger than the content of at least one of the alkaline metal component and the boron component in the ceramic insulating material 10.

Abstract: The present invention provides agonist compounds that active ABA receptors, and agricultural formulations comprising the agonist compounds. The agricultural formulations are useful for inducing ABA responses in plant vegetative tissues, reducing abiotic stress in plants, and inhibiting germination of plant seeds. The compounds are also useful for inducing expression of ABA-responsive genes in cells that express endogenous or heterologous ABA receptors.

Abstract: The present disclosure provides a surge protection device including a ceramic substrate (1), at least one pair of discharge electrodes (31) disposed on a surface of the ceramic substrate (1) so as to face each other at end portions thereof with a space in between, outer electrodes (32) electrically connected to the corresponding discharge electrodes (31), and a discharge auxiliary electrode (4) disposed between the end portions of the pair of discharge electrodes (31) The discharge auxiliary electrode (4) contains crystalized glass and particles of conductive powder (40) dispersed apart from each other in the crystalized glass.

Abstract: An ESD protection device 1 includes a ceramic insulating material 10, first and second discharge electrodes 21 and 22, and a discharge auxiliary section 51. The discharge auxiliary section 51 is an electrode configured to reduce a discharge starting voltage between the first discharge electrode 21 and the second discharge electrode 22. The discharge auxiliary section 51 comprises a sintered body including conductive particles and at least one of semiconductor particles and insulating particles. At least the discharge auxiliary section 51 comprises at least one of an alkaline metal component and a boron component. The content of at least one of the alkaline metal component and the boron component in the discharge auxiliary section 51 is larger than the content of at least one of the alkaline metal component and the boron component in the ceramic insulating material 10.

Abstract: The present invention provides agonist compounds that active ABA receptors, and agricultural formulations comprising the agonist compounds. The agricultural formulations are useful for inducing ABA responses in plant vegetative tissues, reducing abiotic stress in plants, and inhibiting germination of plant seeds. The compounds are also useful for inducing expression of ABA-responsive genes in cells that express endogenous or heterologous ABA receptors.