Patents by Inventor Masanori Orihashi

Masanori Orihashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Acidic gold alloy plating solution
    Patent number: 9303326
    Abstract: A gold alloy plating solution and plating method thereof that provides a gold plating solution with high deposition selectivity by using a gold plating solution that contains gold cyanide, cobalt ions, hexamethylene tetramine, and specific glossing agents.
    Type: Grant
    Filed: November 9, 2011
    Date of Patent: April 5, 2016
    Inventors: Yutaka Morii, Masanori Orihashi
  • Acidic gold alloy plating solution
    Patent number: 9297087
    Abstract: A gold alloy plating solution and plating method thereof that provides a gold plating solution with high deposition selectivity by using a gold plating solution that contains gold cyanide, cobalt ions, hexamethylene tetramine, and specific glossing agents.
    Type: Grant
    Filed: November 9, 2011
    Date of Patent: March 29, 2016
    Inventors: Yutaka Morii, Masanori Orihashi
  • Acidic gold alloy plating solution
    Patent number: 8357285
    Abstract: A gold alloy plating solution and plating method thereof that provides a gold plating solution with high deposition selectivity by using a gold plating solution that contains gold cyanide, cobalt ions, hexamethylene tetramine, and specific glossing agents.
    Type: Grant
    Filed: June 5, 2008
    Date of Patent: January 22, 2013
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Yutaka Morii, Masanori Orihashi
  • Tin electroplating solution and a method for tin electroplating
    Patent number: 8277630
    Abstract: A tin plating solution and tin plating method for chip components minimizes tin shavings when plated components are rubbed together such as during bulk mounting. This minimizes sticking of the chip components together.
    Type: Grant
    Filed: January 13, 2010
    Date of Patent: October 2, 2012
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventor: Masanori Orihashi
  • Hard gold alloy plating bath
    Patent number: 8142639
    Abstract: A hard gold plating solution and plating method which provides a gold plating solution with high deposition selectivity using a gold plating solution containing gold cyanide, cobalt salt, and hexamethylenetetramine.
    Type: Grant
    Filed: August 21, 2007
    Date of Patent: March 27, 2012
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Masanori Orihashi, Yasushi Takizawa
  • ACIDIC GOLD ALLOY PLATING SOLUTION
    Publication number: 20120055802
    Abstract: A gold alloy plating solution and plating method thereof that provides a gold plating solution with high deposition selectivity by using a gold plating solution that contains gold cyanide, cobalt ions, hexamethylene tetramine, and specific glossing agents.
    Type: Application
    Filed: November 9, 2011
    Publication date: March 8, 2012
    Applicant: Rohm and Haas Electronic Materials LLC
    Inventors: Yutaka MORII, Masanori Orihashi
  • ACIDIC GOLD ALLOY PLATING SOLUTION
    Publication number: 20120048740
    Abstract: A gold alloy plating solution and plating method thereof that provides a gold plating solution with high deposition selectivity by using a gold plating solution that contains gold cyanide, cobalt ions, hexamethylene tetramine, and specific glossing agents.
    Type: Application
    Filed: November 9, 2011
    Publication date: March 1, 2012
    Applicant: Rohm and Haas Electronic Materials LLC
    Inventors: Yutaka MORII, Masanori Orihashi
  • Tin electroplating solution and a method for tin electroplating
    Publication number: 20110308960
    Abstract: A tin plating solution and tin plating method for chip components minimizes tin shavings when plated components are rubbed together such as during bulk mounting. This minimizes sticking of the chip components together.
    Type: Application
    Filed: January 13, 2010
    Publication date: December 22, 2011
    Applicant: Rohm and Haas Electronic Materials LLC
    Inventor: Masanori Orihashi
  • Aqueous solution for surface treatment of metal and method for preventing discoloration of metal surface
    Patent number: 8043662
    Abstract: To provide a solder-plating film which has good solder wettability and with which discoloration and twisting of the tin film after heat treatment are prevented. A method and a solution for surface treating a tin film are disclosed. The aqueous solution contains specific compounds and is brought into contact with a tin-plating film before reflow treatment of the tin film.
    Type: Grant
    Filed: August 21, 2006
    Date of Patent: October 25, 2011
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventor: Masanori Orihashi
  • Acidic gold alloy plating solution
    Publication number: 20090014335
    Abstract: A gold alloy plating solution and plating method thereof that provides a gold plating solution with high deposition selectivity by using a gold plating solution that contains gold cyanide, cobalt ions, hexamethylene tetramine, and specific glossing agents.
    Type: Application
    Filed: June 5, 2008
    Publication date: January 15, 2009
    Applicant: Rohm and Haas Electronic Materials LLC
    Inventors: Yutaka Morii, Masanori Orihashi
  • Hard gold alloy plating bath
    Publication number: 20090000953
    Abstract: A hard gold plating solution and plating method which provides a gold plating solution with high deposition selectivity using a gold plating solution containing gold cyanide, cobalt salt, and hexamethylenetetramine.
    Type: Application
    Filed: August 21, 2007
    Publication date: January 1, 2009
    Applicant: Rohm and Haas Electronic Materials LLC
    Inventors: Masanori Orihashi, Yasushi Takizawa
  • Aqueous solution for surface treatment of metal and method for preventing discoloration of metal surface
    Publication number: 20070042122
    Abstract: To provide a solder-plating film which has good solder wettability and with which discoloration and twisting of the tin film after heat treatment are prevented. A method and a solution for surface treating a tin film are disclosed. The aqueous solution contains specific compounds and is brought into contact with a tin-plating film before reflow treatment of the tin film.
    Type: Application
    Filed: August 21, 2006
    Publication date: February 22, 2007
    Applicant: Rohm and Haas Electronic Materials LLC
    Inventor: Masanori Orihashi