Patents by Inventor Masanori Owaki

Masanori Owaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Mult-chip module
    Publication number: 20040130036
    Abstract: A compact multi-chip module having a high performance is provided. A plurality of first semiconductor chips for exchanging signals are surface-mounted on a surface of a mounting board. A second semiconductor chip with most of bonding pads thereof arranged along one side thereof is mounted back-to-back with at least one of the first semiconductor chips on the mounting board. The bonding pads of the second semiconductor chip and corresponding electrodes formed on the mounting board are connected by wire bonding. The first and second semiconductor chips and bonding wires on the mounting board are encapsulated with a sealing material.
    Type: Application
    Filed: November 18, 2003
    Publication date: July 8, 2004
    Applicants: Renesas Technology Corp., Shinko Electric Industries Co., Ltd.
    Inventors: Masanori Owaki, Toshikazu Ishikawa, Takahiro Naito, Makoto Suzuki, Takafumi Kikuchi, Takashi Ozawa