Patents by Inventor Masanori Sadano

Masanori Sadano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Module and method of manufacturing the same
    Patent number: 7704797
    Abstract: A method of manufacturing a module, formed of a semiconductor element flip-chip bonded to a substrate and chip component soldered to the substrate, is disclosed. The method includes a step of mounting the chip component and the semiconductor element to the substrate, a first injection step for injecting first resin from a center of a lateral face of the semiconductor element into a gap between the semiconductor element and the substrate, a second injection step for applying second resin having a greater viscosity than the first resin to corners of the semiconductor element before the first resin reaches the corners, and a curing step for heating the module. This method allows mounting the chip component closer to the semiconductor element, so that the component can be mounted at a higher density on the module.
    Type: Grant
    Filed: July 16, 2007
    Date of Patent: April 27, 2010
    Assignee: Panasonic Corporation
    Inventors: Junichi Kimura, Yoshitsugu Uenishi, Masanori Sadano, Yoshihisa Maehata, Nobuhiro Tada
  • Module and method of manufacturing the same
    Publication number: 20080017969
    Abstract: A method of manufacturing a module, formed of a semiconductor element flip-chip bonded to a substrate and chip component soldered to the substrate, is disclosed. The method includes a step of mounting the chip component and the semiconductor element to the substrate, a first injection step for injecting first resin from a center of a lateral face of the semiconductor element into a gap between the semiconductor element and the substrate, a second injection step for applying second resin having a greater viscosity than the first resin to corners of the semiconductor element before the first resin reaches the corners, and a curing step for heating the module. This method allows mounting the chip component closer to the semiconductor element, so that the component can be mounted at a higher density on the module.
    Type: Application
    Filed: July 16, 2007
    Publication date: January 24, 2008
    Inventors: Junichi Kimura, Yoshitsugu Uenishi, Masanori Sadano, Yoshihisa Maehata, Nobuhiro Tada