Abstract: A curable polyorganosiloxane composition includes (a) a polyorganosiloxane having two or more curable functional group capable of causing addition reaction in one molecule; (b) a crosslinking agent having three or more crosslinking groups which have reactivity with the curable functional group of the (a) in one molecule; (c) a curing catalyst capable of catalyzing a crosslinking reaction of the (a) and (b); and (d) a silicon compound having a monovalent alkyl group of 8 to 30 carbon atoms and a hydrolyzable group which are directly bonded to a silicon atom; and in some cases, (e) scaly inorganic fine particles. An adhesive may use the curable polyorganosiloxane composition.

Abstract: A thermally conductive polysiloxane composition includes (A) a thermally conductive filler, (B) a polyorganosiloxane resin including at least one polysiloxane having one curable functional group in the molecule thereof, and (C) a siloxane compound having an alkoxysilyl group and a linear siloxane structure.

Abstract: A curable silicone adhesive composition comprising a combination of adhesion promoters is shown and described herein. The composition includes a first adhesion promoter selected from a silicon hydride adhesion promoter and a second adhesion promoter selected from an acrylate functional adhesion promoter to provide a silicone material that is curable at relatively low temperatures and shorter time and provides good adhesion to plastics and metal.

Abstract: An addition reaction curing type polyorganosiloxane composition for bonding poly(phenylene sulfide) resins includes (A) a polyorganosiloxane containing two or more alkenyl groups in the molecule, (B) a polyorganohydrogensiloxane having, in the molecule, three or more silicon-atom-bonded hydrogen atoms, (C) a platinum-based catalyst, (D) an oxide or carbonate of a metal selected from among the metals in Groups 2 and 12 of the periodic table, and (E) an adhesion promoter, the content of the ingredient (D) being 0.1-20 wt % with respect to the whole composition.

Abstract: A siloxane compound represented by the general formula (1): where R1 is a group having an alkoxysilyl group having 1 to 4 carbon atoms, R2 is a linear organosiloxy group represented by the general formula (2): where each R4 is independently a monovalent hydrocarbon group having 1 to 12 carbon atoms, Y is a monovalent hydrocarbon group having 1 to 6 carbon atoms, and d is an integer of 10 to 50, each X is independently a divalent hydrocarbon group having 2 to 10 carbon atoms, each of a and b is independently an integer of 1 or more, c is an integer of 0 or more, a+b+c is an integer of 4 or more, and each R3 is independently a monovalent hydrocarbon group having 1 to 6 carbon atoms.

Abstract: An adhesive polyorganosiloxane composition includes, at a specific composition ratio: (A) a linear polyorganosiloxane containing an alkenyl group including a low-viscosity linear polyorganosiloxane containing an alkenyl group; (B) a polyorganosiloxane containing at least three alkenyl groups in the molecule; (C1) a polyorganohydrogensiloxane having 3 or more hydrogen atoms bonded to a silicon atom in the molecule; (C2) a linear polyorganohydrogensiloxane having one hydrogen atom bonded to a silicon atom only at both terminals of the molecular chain, and having no aliphatic unsaturated bonds in the molecule; (D) a filler; (E) a platinum group metal compound; and (F) two or more kinds of specific adhesion imparting agent.

Abstract: A method for producing a polyorganosiloxane resin composition including: (a) mixing a thermally-conductive filler having a particle size distribution having a single peak, with a surface treatment agent containing a siloxane to form a mixture, and (b) mixing the mixture from step (a) with a polysiloxane resin.

Abstract: An adhesive polyorganosiloxane composition includes: (A) a polyorganosiloxane having 2 or more alkenyl groups in each molecule thereof; (B) a polyorganohydrodienesiloxane having 3 or more hydrogen atoms bonded to a silicon atom in each molecule thereof; (C) a platinum-based catalyst; (D) at least two kinds of adhesion-imparting agents selected from the group consisting of specific organic silicon compounds, silane compounds, tetraalkoxysilane compounds, and/or partial hydrolysis condensates thereof; (E) hexamethyldisilazane; (F) water; and (G) at least one of (G1) and (G2), where (G1) is a non-surface-treated inorganic filler having a BET specific surface area of 50 to 500 m2/g, and (G2) is an inorganic filler obtained by surface-treating said (G1) with hexamethyldisilazane.

Abstract: The present invention relates to a thermally conductive polysiloxane composition that provides a cured product having excellent tackiness and flexibility in which the composition contains (A) a thermally conductive filler, (B) a siloxane compound having an alkoxysilyl group and a linear siloxane structure, (C) a polyorganosiloxane having at least two alkenyl groups bonded to silicon atoms per molecule, (D1) a linear polyorganohydrogensiloxane represented by the general formula (4), (D2) a polyorganohydrogensiloxane having per molecule at least three units represented by the general formula (5), and (E) a platinum catalyst.

Abstract: A thermally conductive polysiloxane composition includes (A) a thermally conductive filler, and (B) at least one member selected from the group consisting of an alkoxysilyl group-containing compound and a dimethylpolysiloxane. The component (A) includes at least two thermally conductive fillers having different average particle diameters, and (A-1) indefinite-shaped aluminum nitride particles having an average particle diameter of 30 ?m to 150 ?m in an amount of at least 20% by mass, based on the mass of a total of the component (A).

Abstract: A thermally conductive polysiloxane composition includes (A) a thermally conductive filler, and (B) at least one member selected from the group consisting of an alkoxysilyl group-containing compound and a dimethylpolysiloxane. The component (A) includes at least two thermally conductive fillers having different average particle diameters, and (A-1) indefinite-shaped aluminum nitride particles having an average particle diameter of 30 ?m to 150 ?m in an amount of at least 20% by mass, based on the mass of a total of the component (A).

Abstract: A thermally conductive polysiloxane composition includes (A) a thermally conductive filler, and (B) at least one member selected from the group consisting of an alkoxysilyl group-containing compound and a dimethylpolysiloxane. The component (A) includes at least two thermally conductive fillers having different average particle diameters, and (A-1) indefinite-shaped aluminum nitride particles having an average particle diameter of 30 ?m to 150 ?m in an amount of at least 20% by mass, based on the mass of a total of the component (A).

Abstract: A thermally conductive polysiloxane composition includes (A) a thermally conductive filler, (B) a polyorganosiloxane resin including at least one polysiloxane having one curable functional group in the molecule thereof, and (C) a siloxane compound having an alkoxysilyl group and a linear siloxane structure

Abstract: A siloxane compound represented by the general formula (1): where R1 is a group having an alkoxysilyl group having 1 to 4 carbon atoms, R2 is a linear organosiloxy group represented by the general formula (2): where each R4 is independently a monovalent hydrocarbon group having 1 to 12 carbon atoms, Y is a monovalent hydrocarbon group having 1 to 6 carbon atoms, and d is an integer of 10 to 50, each X is independently a divalent hydrocarbon group having 2 to 10 carbon atoms, each of a and b is independently an integer of 1 or more, c is an integer of 0 or more, a+b+c is an integer of 4 or more, and each R3 is independently a monovalent hydrocarbon group having 1 to 6 carbon atoms.

Abstract: The present invention relates to a thermally conductive polysiloxane composition that provides a cured product having excellent tackiness and flexibility in which the composition contains (A) a thermally conductive filler, (B) a siloxane compound having an alkoxysilyl group and a linear siloxane structure, (C) a polyorganosiloxane having at least two alkenyl groups bonded to silicon atoms per molecule, (D1) a linear polyorganohydrogensiloxane represented by the general formula (4), (D2) a polyorganohydrogensiloxane having per molecule at least three units represented by the general formula (5), and (E) a platinum catalyst.

Abstract: Provided is a composition comprising: (A) a silicone polymer of the Formula (I): M1aM2bM3cD1dD2eD3fT1gT2hT3iQj.

Abstract: A thermally conductive composition is a thermally conductive composition including (A) a spherical thermally conductive filler, (B) an alkoxysilane compound or dimethylpolysiloxane, and (C) a polyorganosiloxane (not inclusive of the dimethylpolysiloxane of component (B)), wherein component (A) is a mixture formulated with specific ratios of fillers having different average particle sizes, the mixture being formulated with a filler having an average particle size of 50 ?m or more in an amount of 30% by mass or more; component (B) and component (C) are included in a total amount of 1.5 to 35 parts by mass relative to 100 parts by mass of component (A); and a content ratio of component (C) in the total amount of component (B) and component (C) is 15 to 98% by mass.

Abstract: A thermally conductive silicone composition is shown and described herein. The thermally conductive silicone composition comprises (A) an ionically modified siloxane, and (B) a thermally conductive filler comprising a first filler and a second filler, where the first filler and/or the second filler comprises a plurality of filler types, the plurality of filler types differing from one another in terms of particle size and/or morphology. The ionically modified siloxane may function as a dispersing aid or wetter for efficient dispersion of thermal conducting organic and inorganic fillers to achieve high thermal conductivity.

Abstract: A method for producing a polyorganosiloxane resin composition including: (a) mixing a thermally-conductive filler having a particle size distribution having a single peak, with a surface treatment agent containing a siloxane to form a mixture, and (b) mixing the mixture from step (a) with a polysiloxane resin.

Abstract: The present invention provides a thermally conductive composition good in thermal conductivity, low in viscosity and easy in application. The thermally conductive composition is a thermally conductive composition including (A) a spherical thermally conductive filler and (B) an alkoxysilane compound or dimethylpolysiloxane, wherein the spherical thermally conductive filler of component (A) is a mixture formulated with specific ratios of fillers having different average particle sizes, the mixture being formulated with a spherical thermally conductive filler made of a nitride and having an average particle size of 50 ?m or more in an amount of 30% by mass or more.