Patents by Inventor Masanori Takushima

Masanori Takushima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for forming electrical connecting structure
    Patent number: 6454159
    Abstract: Recesses are formed in a solder transfer plate and filled with solder. Core bumps of an electronic component are brought into contact with the solder in the recesses, and thereby the metal contained in the solder in the recesses is melted. The electrical connecting structure, on which the core bump is coated with solder, is formed by separating the electronic component from the transfer plate.
    Type: Grant
    Filed: August 11, 2000
    Date of Patent: September 24, 2002
    Assignee: International Business Machines Corporation
    Inventor: Masanori Takushima