Abstract: A chip resistor (A1) includes a chip-like resistor element (1), two electrodes (31) spaced from each other on the bottom surface (1a) of the resistor element, and an insulation film (21) between the two electrodes. Each electrode (31) has an overlapping portion (31c) which overlaps the insulation film (21) as viewed in the vertical direction.

Abstract: A chip resistor (A1) includes a chip-like resistor element (1), two electrodes (31) spaced from each other on the bottom surface (1a) of the resistor element, and an insulation film (21) between the two electrodes. Each electrode (31) has an overlapping portion (31c) which overlaps the insulation film (21) as viewed in the vertical direction.

Abstract: A chip resistor (A1) includes a chip-like resistor element (1), two electrodes (31) spaced from each other on the bottom surface (1a) of the resistor element, and an insulation film (21) between the two electrodes. Each electrode (31) has an overlapping portion (31c) which overlaps the insulation film (21) as viewed in the vertical direction.

Abstract: A chip resistor (A1) includes a chip-like resistor element (1), two electrodes (31) spaced from each other on the bottom surface (1a) of the resistor element, and an insulation film (21) between the two electrodes. Each electrode (31) has an overlapping portion (31c) which overlaps the insulation film (21) as viewed in the vertical direction.

Abstract: The invention relates to a method of making a chip resistor using a material substrate for which are set a plurality of first cutting lines extending in a first direction and a plurality of second cutting lines extending in a second direction perpendicular to the first direction. The method includes an upper electrode forming step A for forming a thick upper conductor layer on the upper surface of the substrate by printing and baking a metal organic paste, a lower electrode forming step B for forming a thick lower conductor layer on the lower surface of the substrate by printing and baking metal organic paste, and a resistor element forming step C for forming a thin resistor layer by depositing a resistor material on the upper surface of the substrate. Preferably, the upper and the lower surfaces of the material substrate are flat.

Abstract: A method of making a thin-film chip resistor includes: a step of making a material plate A formed with lengthwise breaking grooves A1 and crosswise breaking grooves A2 along which the plate is to be divided into individual chip substrates 1 each to become a chip resistor; and a step of forming a film of resistive element material B by a thin-film process such as spattering, on a surface of the material plate A. The step of thin-film process, in which the resistive element material B is formed, is performed with a masking sheet E placed on the surface of the material plate A, covering only regions including the lengthwise breaking grooves A1 and the crosswise breaking grooves A2.

Abstract: The invention relates to a method of making a chip resistor using a material substrate for which are set a plurality of first cutting lines extending in a first direction and a plurality of second cutting lines extending in a second direction perpendicular to the first direction. The method includes an upper electrode forming step A for forming a thick upper conductor layer on the upper surface of the substrate by printing and baking a metal organic paste, a lower electrode forming step B for forming a thick lower conductor layer on the lower surface of the substrate by printing and baking metal organic paste, and a resistor element forming step C for forming a thin resistor layer by depositing a resistor material on the upper surface of the substrate. Preferably, the upper and the lower surfaces of the material substrate are flat.

Abstract: The invention relates to a method of making a chip resistor using a material substrate for which are set a plurality of first cutting lines extending in a first direction and a plurality of second cutting lines extending in a second direction perpendicular to the first direction. The method includes an upper electrode forming step A for forming a thick upper conductor layer on the upper surface of the substrate by printing and baking a metal organic paste, a lower electrode forming step B for forming a thick lower conductor layer on the lower surface of the substrate by printing and baking metal organic paste, and a resistor element forming step C for forming a thin resistor layer by depositing a resistor material on the upper surface of the substrate. Preferably, the upper and the lower surfaces of the material substrate are flat.

Abstract: A method of making a thin-film chip resistor includes: a step of making a material plate A formed with lengthwise breaking grooves A1 and crosswise breaking grooves A2 along which the plate is to be divided into individual chip substrates 1 each to become a chip resistor; and a step of forming a film of resistive element material B by a thin-film process such as spattering, on a surface of the material plate A. The step of thin-film process, in which the resistive element material B is formed, is performed with a masking sheet E placed on the surface of the material plate A, covering only regions including the lengthwise breaking grooves A1 and the crosswise breaking grooves A2.

Abstract: Resistance or side electrodes of a chip resistor is prevented from being lost due to chemical reaction with NaCl contained in human sweat and so on when human sweat, seawater, etc. are adhered thereto. The chip resistor comprises an insulating substrate, thick-film upper surface electrodes formed at opposite ends of the top surface of the insulating substrate, a thin-film resistance made of a constituent material not reacting with NaCl, and formed so as to be extended over the upper surface of the insulating substrate and respective portions of the upper surface of the thick-film upper surface electrodes, thick-film back surface electrodes formed at spots on the back surface of the insulating substrate, corresponding to the thick-film upper surface electrodes, respectively, and thick-film side surface electrodes connecting the thick-film back surface electrodes with respective portions of the thick-film upper surface electrodes, exposed out of the thin-film resistance, respectively.

Abstract: A resistance element (4) is provided by a thin film on the surface of an insulating substrate (1) consisting of, for example, alumina, and having a rectangular planar shape, so as to extend from one end to the opposite other end thereof. Connected to the opposite ends of the resistance element, respectively, top surface electrodes (21) (21a, 21b), (31) (31a, 31b) and back surface electrodes (22), (32) are formed by a thick film, on the surface and the other side at the opposite ends of the insulating substrate, and the top surface and back surface electrodes are electrically connected by thick-film electrodes such as side surface electrodes (23), (33). A protective film (5) (51 to 53) is provided on the surface of the resistance element.

Abstract: The invention relates to a method of making a chip resistor using a material substrate for which are set a plurality of first cutting lines extending in a first direction and a plurality of second cutting lines extending in a second direction perpendicular to the first direction. The method includes an upper electrode forming step A for forming a thick upper conductor layer on the upper surface of the substrate by printing and baking a metal organic paste, a lower electrode forming step B for forming a thick lower conductor layer on the lower surface of the substrate by printing and baking metal organic paste, and a resistor element forming step C for forming a thin resistor layer by depositing a resistor material on the upper surface of the substrate. Preferably, the upper and the lower surfaces of the material substrate are flat.

Abstract: Resistance or side electrodes of a chip resistor is prevented from being lost due to chemical reaction with NaCl contained in human sweat and so on when human sweat, seawater, etc. are adhered thereto. The chip resistor comprises an insulating substrate, thick-film upper surface electrodes formed at opposite ends of the top surface of the insulating substrate, a thin-film resistance made of a constituent material not reacting with NaCl, and formed so as to be extended over the upper surface of the insulating substrate and respective portions of the upper surface of the thick-film upper surface electrodes, thick-film back surface electrodes formed at spots on the back surface of the insulating substrate, corresponding to the thick-film upper surface electrodes, respectively, and thick-film side surface electrodes connecting the thick-film back surface electrodes with respective portions of the thick-film upper surface electrodes, exposed out of the thin-film resistance, respectively.

Abstract: A resistance element (4) is provided by a thin film on the surface of an insulating substrate (1) consisting of, for example, alumina, and having a rectangular planar shape, so as to extend from one end to the opposite other end thereof. Connected to the opposite ends of the resistance element, respectively, top surface electrodes (21) (21a, 21b), (31) (31a, 31b) and back surface electrodes (22), (32) are formed by a thick film, on the surface and the other side at the opposite ends of the insulating substrate, and the top surface and back surface electrodes are electrically connected by thick-film electrodes such as side surface electrodes (23), (33). A protective film (5) (51 to 53) is provided on the surface of the resistance element.

Abstract: Disclosed are a structure and a method of manufacture of a one-chip electronic composite component which is reduced of size while providing a resistance value properly adjusted. A resistor is formed on an insulator substrate. The resistor has a trimming groove by which a resistance value thereof is adjusted. An electronic element is in electrical connection with the resistor on the substrate. A protection layer covers at least the trimming groove. The resistor is disposed close to one side edge of the substrate with respect to a centerline extending lengthwise of the substrate. The trimming groove extends toward the one side edge of the substrate from a side defining the resistor remote from the one side edge of the substrate.

Abstract: Disclosed are a thick-film capacitor and a chip-type composite electronic component. A pair of end electrodes are formed on the insulator substrate. A lower electrode is formed on the insulator substrate. A dielectric layer is formed on the lower electrode. An upper electrode formed on the dielectric layer. One of the lower electrode and the upper electrode has a broad-width portion having a width wider than the remaining portion thereof. The one of the lower and upper electrode at the broad-width portion is directly connected to one of the end electrodes. The thick-film capacitor is provided with a capacitor electrode arranged to provide positive connection, even where the width of the capacitor electrode is determined narrow to meet a small capacitance value.