Abstract: In a light radiation device including an upstream radiation portion, a middle radiation portion and a downstream radiation portion, the upstream radiation portion overlaps a nozzle array in a transportation direction. A controller includes a path controller to control a path operation of ejecting ink from the nozzle array onto a medium while moving a recording head and the light radiation device in a scanning direction, a transportation controller to control a transportation operation of, after the path operation, transporting the medium downstream in the transportation direction by a distance shorter than a length in the transportation direction of the nozzle array, and a first light radiation controller to control the light radiation device, during the path operation by the path controller, to turn on the upstream radiation portion and the downstream radiation portion and to turn off the middle radiation portion.

Abstract: A multiple contact connector comprises a plurality of terminal pieces arranged linearly in the lengthwise direction, and an insulating provided with a plurality of dividing walls extending between the terminal pieces for supporting the terminal pieces and for insulating between adjacent terminal pieces, having the insulating pieces inserted into terminal supporting spaces between the separating walls.

Abstract: A multiple contact connector comprises a plurality of terminal pieces arranged linearly in the lengthwise direction, and an insulating provided with a plurality of dividing walls extending between the terminal pieces for supporting the terminal pieces and for insulating between adjacent terminal pieces, having the insulating pieces inserted into terminal supporting spaces between the separating walls.

Abstract: An electrical connector assembly includes a receptacle connector (24) having a first non-conductive housing (51) for mounting on a printed circuit board (28) and including a mating receptacle (54). A plurality of board terminals (52) are mounted on the first housing and have tail portions (62) for connection to appropriate circuit traces on the circuit board and contact portions (58,58a) extending into the mating receptacle. A plug connector (22) has a second non-conductive housing (30) including a mating plug portion (30b) for insertion into the mating receptacle of the receptacle connector. A plurality of signal terminals (32) are mounted on the second housing and have contact portions (32b) on the mating plug portion thereof for engaging the contact portions of the board terminals in the mating receptacle when the connectors are mated. The signal terminals include terminating portions (32a) for termination to a plurality of discrete signal conductors (26a).

Abstract: The present invention is directed to a socket connector having a plurality of contacts for contacting with a plurality of solder balls arranged on one of the surface of a semiconductor package, and a socket body in which a plurality of mounting holes are provided for mounting respective contacts. The mounting hole is provided with a through-hole pierced in a height direction of the socket body and a contact support hole of the contact. Each contact is provided with an upright piece extending through the through-hole, and a support piece extending from the upright piece to be inserted into the support hole. A contact portion for contacting with the solder ball is formed at a tip end portion of the upright piece. The support piece extends from the proximal end portion of the upright piece.

Abstract: The present invention is directed to a socket connector (TS) having a plurality of contacts to be brought into contact with a plurality of solder balls (S) of a semiconductor package, a socket body (15) in which a mounting hole (11) is provided for each contact (10), a through-hole pierced in a height direction of the socket body and a contact support hole (13) are provided. Each contact (10) is provided with an upright piece (101) extending through the through-hole, a support piece extending from a proximal end side of the upright piece to be inserted into the through-hole and a contact portion (103) formed at a free end portion of the upright piece to be brought into contact with the solder ball. Each contact portion is arranged at a height level such that it projects from the surface of the socket body. A guide projection (14) is provided at a position to face an associated contact portion of each contact.

Abstract: A memory card connector includes a main body and mounted on the body for receiving a memory card therebetween. The card is insertable to a fully mated position, and the cover is mounted for movement on the body from an inoperative position to an eject position. An eject device includes a single spring mounted on the body and having a first portion. Operatively associated with the cover to bias the cover toward its inoperative position. A second portion of the single spring is operatively associated with the memory card for biasing the card in an eject direction away from its mated position.

Abstract: An electrical connector assembly includes a receptacle connector (24) having a first non-conductive housing (51) for mounting on a printed circuit board (28) and including a mating receptacle (54). A plurality of board terminals (52) are mounted on the first housing and have tail portions (62) for connection to appropriate circuit traces on the circuit board and contact portions (58,58a) extending into the mating receptacle. A plug connector (22) has a second non-conductive housing (30) including a mating plug portion (30b) for insertion into the mating receptacle of the receptacle connector. A plurality of signal terminals (32) are mounted on the second housing and have contact portions (32b) on the mating plug portion thereof for engaging the contact portions of the board terminals in the mating receptacle when the connectors are mated. The signal terminals include terminating portions (32a) for termination to a plurality of discrete signal conductors (26a).

Abstract: The present invention is directed to a socket connector having a plurality of contacts for contacting with a plurality of solder balls arranged on one of the surface of a semiconductor package, and a socket body in which a plurality of mounting holes are provided for mounting respective contacts. The mounting hole is provided with a through-hole pierced in a height direction of the socket body and a contact support hole of the contact. Each contact is provided with an upright piece extending through the through-hole, and a support piece extending from the upright piece to be inserted into the support hole. A contact portion for contacting with the solder ball is formed at a tip end portion of the upright piece. The support piece extends from the proximal end portion of the upright piece.

Abstract: The present invention is directed to a socket connector (TS) having a plurality of contacts to be brought into contact with a plurality of solder balls (S) of a semiconductor package, a socket body (15) in which a mounting hole (11) is provided for each contact (10), a through-hole pierced in a height direction of the socket body and a contact support hole (13) are provided. Each contact (10) is provided with an upright piece (101) extending through the through-hole, a support piece extending from a proximal end side of the upright piece to be inserted into the through-hole and a contact portion (103) formed at a free end portion of the upright piece to be brought into contact with the solder ball. Each contact portion is arranged at a height level such that it projects from the surface of the socket body. A guide projection (14) is provided at a position to face an associated contact portion of each contact.

Abstract: A memory card connector includes a main body and mounted on the body for receiving a memory card therebetween. The card is insertable to a fully mated position, and the cover is mounted for movement on the body from an inoperative position to an eject position. An eject device includes a single spring mounted on the body and having a first portion. Operatively associated with the cover to bias the cover toward its inoperative position. A second portion of the single spring is operatively associated with the memory card for biasing the card in an eject direction away from its mated position.

Abstract: A card connector for receiving a card C equipped with an eject device is disclosed wherein the connector includes a connector body having a housing with a receiving slot for the card and a metal shell for covering the housing. The eject device includes a slider movable between a forward position and a back position of the card, a coil spring for biasing the slider back to the back position of the card, and a cam mechanism for defining the sliding operation of the slider. The cam mechanism is provided on a side surface of the slider and includes a first guide groove defining the forward position of the slider, a second guide groove defining the back position of the slider, and a pin member movable within the guide grooves for defining the slider's position. The slider is received in a recess portion provided along a side of the housing and allows the connector to be relatively small in size.

Abstract: An intermediate connector for engaging a surface mount connector and a cable connector contains conductive terminals in a body portion. The body portion is cooperatively defined by distinct and separate terminal contact support portions that are affixed to opposite ends of the connector terminals. The support portions may be affixed to the connector terminals from different directions and thus eliminates the need for a complex, molded connector housing. The support portions and the terminals are held together and aligned together by a retainer and a spacer is provided to maintain a desired spacing between the terminals of the connector.

Abstract: A card connector for receiving a card C equipped with an eject device is disclosed wherein the connector includes a connector body having a housing with a receiving slot for the card and a metal shell for covering the housing. The eject device includes a slider movable between a forward position and a back position of the card, a coil spring for biasing the slider back to the back position of the card, and a cam mechanism for defining the sliding operation of the slider. The cam mechanism is provided on a side surface of the slider and includes a first guide groove defining the forward position of the slider, a second guide groove defining the back position of the slider, and a pin member movable within the guide grooves for defining the slider's position. The slider is received in a recess portion provided along a side of the housing and allows the connector to be relatively small in size.

Abstract: An improved insulation displacement terminal is formed by punching it from a metal blank. The terminal is folded upon itself to form distinct first and second body portions, each of which ends in an upright line-contacting element. The folded over portion of the terminal defines a first contact beam while a second contact beam extends from alongside the terminal and posses underneath the first contact beam to form a terminal-receiving passage therein for an opposing connector terminal.

Abstract: A surface mount connector is disclosed having an improved terminal construction that avoid shorting between adjacent terminal contact portions, while maintaining a multi-pole structure with a reduced pitch of the terminal solder tail portions. The connector has an insulative connector housing with a plurality of terminals loaded in the housing on opposite sides of an opposing connector engaging slot. The terminals have contact that face into the slot and which are arranged in parallel in a predetermined pitch. Solder tail portions of the terminals extend underneath portions of the terminals and are arranged in parallel in a pitch that is one-half that of the pitch of the terminal contact portions.

Abstract: An electrical connector assembly includes a receptacle connector having a housing defining a mating receptacle. A dielectric wafer is mounted in the housing. A plurality of terminal pins are mounted through the wafer with mating ends of the pins projecting from one side of the wafer into the mating receptacle and connector ends of the pins projecting from an opposite side of the wafer. A plurality of discrete first connector modules are mounted on the housing for termination to selected ones of the connector ends of the terminal pins. A plug connector includes a shell defining a mating plug for insertion into the mating receptacle of the receptacle connector. A plurality of discrete second connector modules are mounted on the shell for termination to selected ones of the mating ends of the terminal pins when the plug connector is mated with the receptacle connector.

Abstract: Disclosed is an improved IC socket comprising a housing having terminals and an opening-and-closing mechanism to change the terminals from a contact-making position to a contact-releasing position. The housing has a platform to receive the lead wires of the IC, and a movable cover activates a swingable member which rotates. The opening-and-closing mechanism is positioned so that the swingable member tilts the opening-and-closing mechanism toward the contact-releasing position when the movable cover is depressed. The device is designed as to leave between the lead platform and a contact end a clearance C, which is smaller than the thickness T of the lead wire. Clearance C prevents any debris from sticking on the contact end, assuring the reliability of electric contacts with the lead wires of the IC.